| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated aging test for gate-oxide degradation in SiC MOSFETs for condition monitoring
|
Hayashi, Shin-Ichiro
|
|
|
114 |
C |
p.
|
artikel
|
| 2 |
Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)
|
Yan, Gangping
|
|
|
114 |
C |
p.
|
artikel
|
| 3 |
A comparison study on electromagnetic susceptibility of current reference circuits with scaling-down technologies and schemes
|
Wang, Zhian
|
|
|
114 |
C |
p.
|
artikel
|
| 4 |
AC stress reliability study on a novel vertical MOS transistor for non-volatile memory technology
|
Locati, J.
|
|
|
114 |
C |
p.
|
artikel
|
| 5 |
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material
|
Zhang, Xiaotong
|
|
|
114 |
C |
p.
|
artikel
|
| 6 |
A fault tolerant switched reluctance motor drive for electric vehicles under multi-switches open-fault conditions
|
Yang, Qingqing
|
|
|
114 |
C |
p.
|
artikel
|
| 7 |
Ageing of glass passivated TRIAC devices under thermal and electrical stress
|
Buvat, Y.
|
|
|
114 |
C |
p.
|
artikel
|
| 8 |
A high-efficiency threshold voltage distribution test method based on the reliability of 3D NAND flash memory
|
Wei, Debao
|
|
|
114 |
C |
p.
|
artikel
|
| 9 |
A lifetime assessment and prediction method for large area solder joints
|
Lederer, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 10 |
A method to determine critical circuit blocks for electromigration based on temperature analysis
|
Nunes, R.O.
|
|
|
114 |
C |
p.
|
artikel
|
| 11 |
A method to extract lumped thermal networks of capacitors for reliability oriented design
|
Delmonte, N.
|
|
|
114 |
C |
p.
|
artikel
|
| 12 |
A method to improve the reliability of three-level inverter based on equivalent input disturbance and repetitive control combinations
|
Yang, Guoliang
|
|
|
114 |
C |
p.
|
artikel
|
| 13 |
An active thermal management strategy for switched reluctance drive system with minimizing current sampling delay
|
Yang, Qingqing
|
|
|
114 |
C |
p.
|
artikel
|
| 14 |
Analog and mixed-signal circuits simulation for product level EMMI analysis
|
Melis, Tommaso
|
|
|
114 |
C |
p.
|
artikel
|
| 15 |
Analysis of counterfeit electronics
|
Mura, G.
|
|
|
114 |
C |
p.
|
artikel
|
| 16 |
Analysis of cyclic spontaneous switchings in GaN & SiC cascodes by snappy turn-off currents
|
Gunaydin, Yasin
|
|
|
114 |
C |
p.
|
artikel
|
| 17 |
Analysis of drain current transient stability of AlGaN/GaN HEMT stressed under HTOL & HTRB, by random telegraph noise and low frequency noise characterizations
|
Tartarin, J.G.
|
|
|
114 |
C |
p.
|
artikel
|
| 18 |
Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling
|
Dornic, N.
|
|
|
114 |
C |
p.
|
artikel
|
| 19 |
Analysis of the successive breakdown statistics of multilayer Al2O3/HfO2 gate stacks using the time-dependent clustering model
|
Muñoz-Gorriz, J.
|
|
|
114 |
C |
p.
|
artikel
|
| 20 |
Analysis of trap states in AlGaN/GaN self-switching diodes via impedance measurements
|
Pérez-Martín, E.
|
|
|
114 |
C |
p.
|
artikel
|
| 21 |
An error detecting scheme with input offset regulation for enhancing reliability of ultralow-voltage SRAM
|
Yang, Pan
|
|
|
114 |
C |
p.
|
artikel
|
| 22 |
An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process
|
Lv, Chunlin
|
|
|
114 |
C |
p.
|
artikel
|
| 23 |
An investigation of FinFET single-event latch-up characteristic and mitigation method
|
Li, Dongqing
|
|
|
114 |
C |
p.
|
artikel
|
| 24 |
A non-invasive SiC MOSFET Junction temperature estimation method based on the transient light Emission from the intrinsic body diode
|
Susinni, G.
|
|
|
114 |
C |
p.
|
artikel
|
| 25 |
A novel accelerated life-test method under thermal cyclic loadings for electronic devices considering multiple failure mechanisms
|
Li, Yaqiu
|
|
|
114 |
C |
p.
|
artikel
|
| 26 |
A novel BIST for monitoring aging/temperature by self-triggered scheme to improve the reliability of STT-MRAM
|
Zhou, Y.
|
|
|
114 |
C |
p.
|
artikel
|
| 27 |
A novel on-wafer approach to test the stability of GaN-based devices in hard switching conditions: Study of hot-electron effects
|
Modolo, Nicola
|
|
|
114 |
C |
p.
|
artikel
|
| 28 |
A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV
|
Tang, D.Y.
|
|
|
114 |
C |
p.
|
artikel
|
| 29 |
A rapid life-prediction approach for solder joints based on modified Engelmaier fatigue model
|
Pan, Yuxiong
|
|
|
114 |
C |
p.
|
artikel
|
| 30 |
A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function
|
Pan, Guangze
|
|
|
114 |
C |
p.
|
artikel
|
| 31 |
Assessing multi-output Gaussian process regression for modeling of non-monotonic degradation trends of light emitting diodes in storage
|
Lim, S.L.H.
|
|
|
114 |
C |
p.
|
artikel
|
| 32 |
A study of hopping transport during discharging in SiNx films for MEMS capacitive switches
|
Birmpiliotis, D.
|
|
|
114 |
C |
p.
|
artikel
|
| 33 |
A study of material stoichiometry on charging properties of SiNx films for potential application in RF MEMS capacitive switches
|
Koutsoureli, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 34 |
Asynchronous early output majority voter and a relative-timed asynchronous TMR implementation
|
Balasubramanian, Padmanabhan
|
|
|
114 |
C |
p.
|
artikel
|
| 35 |
A time-domain stability analysis method for LLC resonant converter based on Floquet theory
|
Li, Hong
|
|
|
114 |
C |
p.
|
artikel
|
| 36 |
A time-domain stability analysis method for paralleled LLC resonant converter system based on Floquet theory
|
Li, Hong
|
|
|
114 |
C |
p.
|
artikel
|
| 37 |
Barrier properties of Cu/TiW/ITO electrode for Si heterojunction solar cell under low temperature thermal aging
|
Jeong, Jae-Seong
|
|
|
114 |
C |
p.
|
artikel
|
| 38 |
Can automotive MEMS be reliably used in space applications? An assessment method under sequential bi-parameter testing
|
Auchlin, Maxime
|
|
|
114 |
C |
p.
|
artikel
|
| 39 |
Capacitive micromachined ultrasonic transducers leak detection by dye penetrant test
|
Nowodzinski, A.
|
|
|
114 |
C |
p.
|
artikel
|
| 40 |
CFD modeling of additive manufacturing liquid cold plates for more reliable power press-pack assemblies
|
Cova, P.
|
|
|
114 |
C |
p.
|
artikel
|
| 41 |
Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices
|
Tetzner, Kornelius
|
|
|
114 |
C |
p.
|
artikel
|
| 42 |
Circuit design using Schmitt Trigger to reliability improvement
|
Zimpeck, A.L.
|
|
|
114 |
C |
p.
|
artikel
|
| 43 |
Combined experimental and numerical approach for investigating the mechanical degradation of the interface between thin film metallization and Si-substrate after temperature cycling test
|
Zhao, D.
|
|
|
114 |
C |
p.
|
artikel
|
| 44 |
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules
|
Scognamillo, Ciro
|
|
|
114 |
C |
p.
|
artikel
|
| 45 |
Comparative evaluation of reliability assessment methods of power modules in motor drive inverter
|
Choi, U.M.
|
|
|
114 |
C |
p.
|
artikel
|
| 46 |
Comparing analytical and Monte-Carlo-based simulation methods for logic gates SET sensitivity evaluation
|
Schvittz, R.B.
|
|
|
114 |
C |
p.
|
artikel
|
| 47 |
Comparisons of SnO2 gas sensor degradation under elevated storage and working conditions
|
Sun, Yongquan
|
|
|
114 |
C |
p.
|
artikel
|
| 48 |
Conducted EMI mitigation in transformerless PV inverters based on intrinsic MOSFET parameters
|
Kraiem, S.
|
|
|
114 |
C |
p.
|
artikel
|
| 49 |
Conducted EMI susceptibility analysis of a COTS processor as function of aging
|
Benfica, Juliano
|
|
|
114 |
C |
p.
|
artikel
|
| 50 |
Correlative microscopy workflow for precise targeted failure analysis of multi-layer ceramic capacitors
|
May, Nicholas
|
|
|
114 |
C |
p.
|
artikel
|
| 51 |
Coupled simulations for lifetime prediction of board level packages encapsulated by thermoset injection moulding based on the Coffin-Manson relation
|
Kulkarni, R.
|
|
|
114 |
C |
p.
|
artikel
|
| 52 |
CSME: A novel cycle-sensing margin enhancement scheme for high yield STT-MRAM
|
Cai, H.
|
|
|
114 |
C |
p.
|
artikel
|
| 53 |
Damage based PoF model of solder joints under temperature cycling and electric coupling condition
|
Yuan, Jiaxin
|
|
|
114 |
C |
p.
|
artikel
|
| 54 |
Degradation mechanism of 0.15 μm AlGaN/GaN HEMTs: effects of hot electrons
|
Gao, Z.
|
|
|
114 |
C |
p.
|
artikel
|
| 55 |
Degradation mechanisms in high power InGaN semiconductor lasers investigated by electrical, optical, spectral and C-DLTS measurements
|
Piva, F.
|
|
|
114 |
C |
p.
|
artikel
|
| 56 |
Design exploration of majority voter architectures based on the signal probability for TMR strategy optimization in space applications
|
Aguiar, Y.Q.
|
|
|
114 |
C |
p.
|
artikel
|
| 57 |
Design of E-mode GaN HEMTs by the Polarization Super Junction (PSJ) technology
|
Sharbati, Samaneh
|
|
|
114 |
C |
p.
|
artikel
|
| 58 |
Editorial Board
|
|
|
|
114 |
C |
p.
|
artikel
|
| 59 |
Editorial of 31st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2020)
|
Papaioannou, George
|
|
|
114 |
C |
p.
|
artikel
|
| 60 |
Effect of cell size reduction on the threshold voltage of UMOSFETs
|
Baba, Yoshiro
|
|
|
114 |
C |
p.
|
artikel
|
| 61 |
Effect of integrated anneal optimizations of electroplated Cu thin films interconnects
|
Wahab, Y.A.
|
|
|
114 |
C |
p.
|
artikel
|
| 62 |
Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis
|
Du, H.
|
|
|
114 |
C |
p.
|
artikel
|
| 63 |
Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability
|
Arabi, F.
|
|
|
114 |
C |
p.
|
artikel
|
| 64 |
Effects of alloying elements in high reliability copper wire bond material for high temperature applications
|
Eto, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 65 |
Effects of anisotropy on the reliability of TSV microstructure
|
Fan, Zhengwei
|
|
|
114 |
C |
p.
|
artikel
|
| 66 |
Effects of gamma radiation on suspended silicon nanogauges bridge used for MEMS transduction
|
Janioud, P.
|
|
|
114 |
C |
p.
|
artikel
|
| 67 |
Effects of solder degradation on the die temperature measurement via internal gate resistance
|
Kawahara, C.
|
|
|
114 |
C |
p.
|
artikel
|
| 68 |
Evaluating the soft error sensitivity of a GPU-based SoC for matrix multiplication
|
León, Germán
|
|
|
114 |
C |
p.
|
artikel
|
| 69 |
Evaluation based on performance and failure of PV system in 10 years field-aged 1 MW PV power plant
|
Oh, Wonwook
|
|
|
114 |
C |
p.
|
artikel
|
| 70 |
Experimental results on diodes and BIMOS ESD devices in 28 nm FD-SOI under TLP & TID radiation
|
Galy, Ph.
|
|
|
114 |
C |
p.
|
artikel
|
| 71 |
Experimental setup to monitor non-destructive single events triggered by ionizing radiation in power devices
|
Pocaterra, Marco
|
|
|
114 |
C |
p.
|
artikel
|
| 72 |
Exploration of gate trench module for vertical GaN devices
|
Ruzzarin, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 73 |
Extraction of wearout model parameters using on-line test of an SRAM
|
Hsu, Shu-Han
|
|
|
114 |
C |
p.
|
artikel
|
| 74 |
Failure-analysis method of soldering interfaces in light-emitting diode packages based on time-domain transient thermal response
|
Ma, Byongjin
|
|
|
114 |
C |
p.
|
artikel
|
| 75 |
Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve
|
Ma, Mingyao
|
|
|
114 |
C |
p.
|
artikel
|
| 76 |
Faults and reliability analysis of negative resistance converter traction power system
|
Yang, Xiaofeng
|
|
|
114 |
C |
p.
|
artikel
|
| 77 |
FBGA solder ball defect effect on DDR4 data signal rise time and ISI measured by loading the data line with a capacitor
|
Waqar, Muhammad
|
|
|
114 |
C |
p.
|
artikel
|
| 78 |
FEM-aided damage model calibration method for experimental results
|
Fogsgaard, M.B.
|
|
|
114 |
C |
p.
|
artikel
|
| 79 |
Field emission induced-damage in the actuation paths of MEMS capacitive structures
|
Theocharis, J.
|
|
|
114 |
C |
p.
|
artikel
|
| 80 |
FPGA-based reliability testing and analysis for 3D NAND flash memory
|
Wei, Debao
|
|
|
114 |
C |
p.
|
artikel
|
| 81 |
Fretting wear reliability assessment methodology of gold-plated electrical connectors considering manufacture parameters distribution
|
Ling, S.
|
|
|
114 |
C |
p.
|
artikel
|
| 82 |
GaN-based high-periodicity multiple quantum well solar cells: Degradation under optical and electrical stress
|
Caria, A.
|
|
|
114 |
C |
p.
|
artikel
|
| 83 |
Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode
|
Castellazzi, A.
|
|
|
114 |
C |
p.
|
artikel
|
| 84 |
Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode
|
Takamori, Taro
|
|
|
114 |
C |
p.
|
artikel
|
| 85 |
Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs
|
Borghese, A.
|
|
|
114 |
C |
p.
|
artikel
|
| 86 |
Gate threshold voltage instability and on-resistance degradation under reverse current conduction stress on E-mode GaN-HEMTs
|
Nakayama, T.
|
|
|
114 |
C |
p.
|
artikel
|
| 87 |
Gold wire bond study for automotive application
|
Papadopoulos, C.
|
|
|
114 |
C |
p.
|
artikel
|
| 88 |
Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy
|
Kim, Jae-Yeon
|
|
|
114 |
C |
p.
|
artikel
|
| 89 |
Heavy ion and proton induced single event upsets in 3D SRAM
|
He, Z.
|
|
|
114 |
C |
p.
|
artikel
|
| 90 |
Heavy ion track straggling effect in single event effect numerical simulation of 3D stacked devices
|
Liu, T.Q.
|
|
|
114 |
C |
p.
|
artikel
|
| 91 |
Hot-Carrier degradation in P- and N-channel EDMOS for smart power application
|
Li, Shuang
|
|
|
114 |
C |
p.
|
artikel
|
| 92 |
Hot-carrier-injection resilient RF power amplifier using adaptive bias
|
Pazos, S.M.
|
|
|
114 |
C |
p.
|
artikel
|
| 93 |
IGBT aging monitoring and remaining lifetime prediction based on long short-term memory (LSTM) networks
|
Li, Wanping
|
|
|
114 |
C |
p.
|
artikel
|
| 94 |
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components
|
Ben Romdhane, E.
|
|
|
114 |
C |
p.
|
artikel
|
| 95 |
Impact of electrical stress on total ionizing dose effects on graphene nano-disc non-volatile memory devices
|
Xi, K.
|
|
|
114 |
C |
p.
|
artikel
|
| 96 |
Impact of modulation strategies on the lifetime estimation of impedance source inverter in wind power system
|
Fan, Peng
|
|
|
114 |
C |
p.
|
artikel
|
| 97 |
Impact of stray-inductance imbalance on short-circuit capability of multi-chip SiC power modules
|
Chou, K.
|
|
|
114 |
C |
p.
|
artikel
|
| 98 |
Impact of the sensing current density on PN-junction based temperature estimation methods for Si and SiC power devices
|
Hoffmann, Felix
|
|
|
114 |
C |
p.
|
artikel
|
| 99 |
Improving GPU register file reliability with a comprehensive ISA extension
|
Gonçalves, M.M.
|
|
|
114 |
C |
p.
|
artikel
|
| 100 |
Influence of CdTe solar cell properties on stability at high temperatures
|
Bertoncello, Matteo
|
|
|
114 |
C |
p.
|
artikel
|
| 101 |
Influence of temperature and humidity on power cycling capability of power modules
|
Wuest, Felix
|
|
|
114 |
C |
p.
|
artikel
|
| 102 |
Interface characterization of CuCu ball bonds by a fast shear fatigue method
|
Czerny, B.
|
|
|
114 |
C |
p.
|
artikel
|
| 103 |
Investigation of critical parameters in power supplies components failure due to electric pulse
|
Curos, L.
|
|
|
114 |
C |
p.
|
artikel
|
| 104 |
Investigation of multiple short-circuits characteristics and reliability in SiC power devices used for a start-up method of power converters
|
Mannen, Tomoyuki
|
|
|
114 |
C |
p.
|
artikel
|
| 105 |
Investigation of the current collapse behaviour in GaN power HEMTs with highly adjustable pulse and measurement concept
|
Goller, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 106 |
Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation
|
Kolbinger, E.
|
|
|
114 |
C |
p.
|
artikel
|
| 107 |
Life-cycle reliability design optimization of high-power DC electromagnetic devices based on time-dependent non-probabilistic convex model process
|
Ye, Xuerong
|
|
|
114 |
C |
p.
|
artikel
|
| 108 |
Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model
|
Qu, X.
|
|
|
114 |
C |
p.
|
artikel
|
| 109 |
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
|
Maures, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 110 |
Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects
|
De Wolf, Ingrid
|
|
|
114 |
C |
p.
|
artikel
|
| 111 |
0.5 μm GaN RF power bar technology space evaluation
|
Van de Casteele, J.
|
|
|
114 |
C |
p.
|
artikel
|
| 112 |
Microstructure evolutions upon Ni(Pt) silicidation and the different responses to the metal etch
|
Qin, Wentao
|
|
|
114 |
C |
p.
|
artikel
|
| 113 |
Mission profile-oriented configuration of PV panels for lifetime and cost-efficiency of PV inverters
|
Wang, Dingyi
|
|
|
114 |
C |
p.
|
artikel
|
| 114 |
Mitigating single event upset of FPGA for the onboard bus control of satellite
|
Cui, Xiuhai
|
|
|
114 |
C |
p.
|
artikel
|
| 115 |
Mode identification for reliability improvement of MMC
|
Fan, X.F.
|
|
|
114 |
C |
p.
|
artikel
|
| 116 |
Modeling and analysis of the catastrophic failure and degradation data
|
Kim, Seung-Hyun
|
|
|
114 |
C |
p.
|
artikel
|
| 117 |
Modeling and fault diagnosis of multi-phase winding inter-turn short circuit for five-phase PMSM based on improved trust region
|
Yang, J.W.
|
|
|
114 |
C |
p.
|
artikel
|
| 118 |
Modular dynamic pulse stress test system for discrete high power semiconductors
|
Patmanidis, K.
|
|
|
114 |
C |
p.
|
artikel
|
| 119 |
Monitoring of parameter stability of SiC MOSFETs in real application tests
|
Sievers, M.
|
|
|
114 |
C |
p.
|
artikel
|
| 120 |
Multimodal fault-tolerant control for single-phase cascaded off-grid PV-storage system with PV failure using hybrid modulation
|
Liu, Zhao
|
|
|
114 |
C |
p.
|
artikel
|
| 121 |
Multiple failure mode identification of SiC planar MOSFETs in short-circuit operation
|
Wang, Bixuan
|
|
|
114 |
C |
p.
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