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Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature |
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Titel: |
Single event upset for monolithic 3-D integrated 6T SRAM based on a 22 nm FD-SOI technology: Effects of channel size and temperature |
Auteur: |
Zhang, Junjun Liu, Fanyu Li, Bo Li, Binhong Huang, Yang Yang, Can Wang, Guoqing Wang, Rongwei Luo, Jiajun Han, Zhengsheng |
Verschenen in: |
Microelectronics reliability |
Paginering: |
Jaargang 114 () nr. C pagina's p. |
Jaar: |
2020 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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