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Journal description
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Details for article 172 of 175 found articles
| Title: |
Using of bond-wire resistance as aging indicator of semiconductor power modules |
| Author: |
Ibrahim, A. Khatir, Z. Ousten, J.P. Lallemand, R. Degrenne, N. Mollov, S. Ingrosso, D. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 114 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 172 of 175 found articles
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