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                             40 results found
no title author magazine year volume issue page(s) type
1 Acoustic noise and vibration analysis of solid state drive induced by multi-layer ceramic capacitors Kim, Hyunwoo
2018
83 C p. 136-145
article
2 A 3D numerical study of humidity evolution and condensation risk on a printed circuit board (PCB) exposed to harsh ambient conditions Shojaee Nasirabadi, Parizad
2018
83 C p. 39-49
article
3 A dynamic partial reconfigurable system with combined task allocation method to improve the reliability of FPGA Wang, Guohua
2018
83 C p. 14-24
article
4 A dynamic partial reconfiguration design flow for permanent faults mitigation in FPGAs Martins, Victor Manuel Gonçalves
2018
83 C p. 50-63
article
5 AlGaN/GaN Schottky barrier diodes on silicon substrates with various Fe doping concentrations in the buffer layers Chiu, Hsien-Chin
2018
83 C p. 238-241
article
6 A modified two dimensional analytical model for short-channel fully depleted SOI MESFET's Mohammadi, Hossein
2018
83 C p. 173-179
article
7 A similarity based prognostics approach for real time health management of electronics using impedance analysis and SVM regression Lee, Changyong
2018
83 C p. 77-83
article
8 Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue Dudek, R.
2018
83 C p. 162-172
article
9 Compact conduction band model for transition-metal dichalcogenide alloys Chen, Kuan-Ting
2018
83 C p. 223-229
article
10 DC-bias-voltage dependence of degradation of aluminum electrolytic capacitors Hasegawa, K.
2018
83 C p. 115-118
article
11 Development of a capacitive sensing technology for the measurement of perpendicularity in the narrow, deep slot-walls of micromolds Chen, Shun-Tong
2018
83 C p. 216-222
article
12 Dual-resonance concurrent oscillator Jang, Sheng-Lyang
2018
83 C p. 208-215
article
13 Editorial Board 2018
83 C p. ii
article
14 Editorial: IEDMS 2016 Liu, Chuan-Hsi
2018
83 C p. 207
article
15 Effect of contact-etch-stop-layer and Si1-xGex channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays Lee, Chang-Chun
2018
83 C p. 230-234
article
16 Effect of fin shape of tapered FinFETs on the device performance in 5-nm node CMOS technology Kurniawan, Erry Dwi
2018
83 C p. 254-259
article
17 Effects of SiO2 film thickness and operating temperature on thermally-induced failures in through-silicon-via structures Han, Chang-Fu
2018
83 C p. 1-13
article
18 Ferroelectric of HfO2 dielectric layer sputtered with TiN or ZrN for sandwich-like metal-insulator-metal capacitors Juan, P.C.
2018
83 C p. 242-248
article
19 First principles calculations study of crystallographic orientation effects on SiC/Ti and SiC/Cr interfaces Li, Lei
2018
83 C p. 119-126
article
20 Fully-differential transimpedance amplifier for reliable wireless communications Royo, Guillermo
2018
83 C p. 25-28
article
21 GaAsSb/InGaAs tunnel field effect transistor with a pocket layer Yu, Tzu-Yu
2018
83 C p. 235-237
article
22 High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material Gain, Asit Kumar
2018
83 C p. 101-110
article
23 Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables Rajaguru, P.
2018
83 C p. 146-156
article
24 Investigation and application of vertical NPN devices for RF ESD protection in BiCMOS technology Huang, Guo-Lun
2018
83 C p. 271-280
article
25 Low cost sensor network for obstacle avoidance in share-controlled smart wheelchairs under daily scenarios Pu, Jiangbo
2018
83 C p. 180-186
article
26 Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling Libot, J.B.
2018
83 C p. 64-76
article
27 Modular fault tolerant processor architecture on a SoC for space Tabero, Jesús
2018
83 C p. 84-90
article
28 [No title] Ersland, Peter
2018
83 C p. 206
article
29 Phase separation-suppressed and strain-modulated improvement of crystalline quality of AlGaN epitaxial layer grown by MOCVD Luong, Tien Tung
2018
83 C p. 286-292
article
30 Radiation Hardened by Design Latches — A Review and SEU Fault Simulations Sajjade, Faisal Mustafa
2018
83 C p. 127-135
article
31 Reaction of NiO film on flexible substrates with buffer solutions and application to flexible arrayed lactate biosensor Chou, Jung-Chuan
2018
83 C p. 249-253
article
32 Realistic non-destructive testing of integrated circuit bond wiring using 3-D X-ray tomography, reverse engineering, and finite element analysis Favata, Joseph
2018
83 C p. 91-100
article
33 Resistive switching properties of alkaline earth oxide-based memory devices Lee, Ke-Jing
2018
83 C p. 281-285
article
34 Scalability comparison between raised- and embedded-SiGe source/drain structures for Si0.55Ge0.45 implant free quantum well pFET Yamaguchi, S.
2018
83 C p. 157-161
article
35 Simple-structured efficient white organic light emitting diode via solution process Dubey, Deepak Kumar
2018
83 C p. 293-296
article
36 Simplification of sub-gap density of states extraction method for amorphous In-Ga-Zn-O thin-film transistors by a single capacitance-voltage curve Wang, Weiliang
2018
83 C p. 111-114
article
37 Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy Ma, Haoran
2018
83 C p. 198-205
article
38 Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis Huang, Yongle
2018
83 C p. 187-197
article
39 Thermal stress probing the channel-length modulation effect of nano n-type FinFETs Tuan, Fu-Yuan
2018
83 C p. 260-270
article
40 Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process Su, Meiying
2018
83 C p. 29-38
article
                             40 results found
 
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