| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of deep level defects in bipolar junction transistors irradiated by 2MeV electrons
|
Ma, Yao
|
|
2017
|
79 |
C |
p. 149-152
4 p.
|
artikel
|
| 2 |
A new method to estimate the state of charge of the green battery
|
Li, Ling-Ling
|
|
2017
|
79 |
C |
p. 306-313
8 p.
|
artikel
|
| 3 |
BTI mitigation by anti-ageing software patterns
|
Abbas, Haider Muhi
|
|
2017
|
79 |
C |
p. 79-90
12 p.
|
artikel
|
| 4 |
Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications
|
Kabaar, A. Ben
|
|
2017
|
79 |
C |
p. 288-296
9 p.
|
artikel
|
| 5 |
CMOS micro-heater design for direct integration of carbon nanotubes
|
Roy, Avisek
|
|
2017
|
79 |
C |
p. 517-525
9 p.
|
artikel
|
| 6 |
Comparative studies on microelectronic reliability issue of Sn whisker growth in Sn-0.3Ag-0.7Cu-1Pr solder under different environments
|
Wu, Jie
|
|
2017
|
79 |
C |
p. 124-135
12 p.
|
artikel
|
| 7 |
Comparing the degradation effect of a ‘two-cell’ Supercapacitor-module with and without voltage equalization circuit(s) under experimental self-discharge and load cycling tests
|
Ahmad Abubakar, Hadiza
|
|
2017
|
79 |
C |
p. 140-148
9 p.
|
artikel
|
| 8 |
Cycle life estimation of lithium-ion polymer batteries using artificial neural network and support vector machine with time-resolved thermography
|
Zhou, Xunfei
|
|
2017
|
79 |
C |
p. 48-58
11 p.
|
artikel
|
| 9 |
Design methodology for over-temperature and over-current protection of an LDO voltage regulator by using electro-thermal simulations
|
Plesa, Cosmin-Sorin
|
|
2017
|
79 |
C |
p. 509-516
8 p.
|
artikel
|
| 10 |
Direct observation of changes in the effective minority-carrier lifetime of SiN x -passivated n-type crystalline-silicon substrates caused by potential-induced degradation and recovery tests
|
Nishikawa, Naoyuki
|
|
2017
|
79 |
C |
p. 91-95
5 p.
|
artikel
|
| 11 |
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages
|
Haslinda, M.S.
|
|
2017
|
79 |
C |
p. 336-351
16 p.
|
artikel
|
| 12 |
3-D thermal models calibration by parametric dynamic compact thermal models
|
Codecasa, Lorenzo
|
|
2017
|
79 |
C |
p. 371-379
9 p.
|
artikel
|
| 13 |
Effect of normal forces on fretting corrosion of tin-coated electrical contacts
|
Han, Dong-Woon
|
|
2017
|
79 |
C |
p. 321-327
7 p.
|
artikel
|
| 14 |
Effect of oxygen vacancy in tungsten oxide on the photocatalytic activity for decomposition of organic materials in the gas phase
|
Fukushi, Daisuke
|
|
2017
|
79 |
C |
p. 1-4
4 p.
|
artikel
|
| 15 |
Effects of nooks configuration on hydrothermal performance of zigzag channels for nanofluid-cooled microelectronic heat sink
|
Khoshvaght-Aliabadi, M.
|
|
2017
|
79 |
C |
p. 153-165
13 p.
|
artikel
|
| 16 |
Electrical characterization and reliability of submicron SOI CMOS technology in the extended temperature range (to 300°C)
|
Petrosyants, Konstantin O.
|
|
2017
|
79 |
C |
p. 416-425
10 p.
|
artikel
|
| 17 |
Electronic module for the thermal monitoring of a Li-ion battery cell through the electrochemical impedance estimation
|
Ranieri, Marco
|
|
2017
|
79 |
C |
p. 410-415
6 p.
|
artikel
|
| 18 |
ESD protection structure with reduced capacitance and overshoot voltage for high speed interface applications
|
Dong, Aihua
|
|
2017
|
79 |
C |
p. 201-205
5 p.
|
artikel
|
| 19 |
Experimental investigation of a Peltier cells cooling system for a Switch-Mode Power Supply
|
Casano, G.
|
|
2017
|
79 |
C |
p. 426-432
7 p.
|
artikel
|
| 20 |
Experimental investigation of discrete air cooled device thermal resistance dependence on cooling conditions
|
Janicki, Marcin
|
|
2017
|
79 |
C |
p. 405-409
5 p.
|
artikel
|
| 21 |
Experimental study of electroluminescence and temperature distribution in high-power AlGaInN LEDs & LED arrays
|
Chernyakov, Anton E.
|
|
2017
|
79 |
C |
p. 457-461
5 p.
|
artikel
|
| 22 |
Fabrication and characterization of microscale heat sinks
|
Takács, Gábor
|
|
2017
|
79 |
C |
p. 480-487
8 p.
|
artikel
|
| 23 |
Force and collapsed shape of a liquid solder bump under load
|
van Veen, N.
|
|
2017
|
79 |
C |
p. 547-553
7 p.
|
artikel
|
| 24 |
Framework for thermal-aware verification of digital and mixed signal systems
|
Jani, Lázár
|
|
2017
|
79 |
C |
p. 499-508
10 p.
|
artikel
|
| 25 |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
|
Chu, David T.
|
|
2017
|
79 |
C |
p. 32-37
6 p.
|
artikel
|
| 26 |
Harmonic distortion analysis of triple gate SOI nanowire MOSFETS down to 100K
|
Paz, B.C.
|
|
2017
|
79 |
C |
p. 111-118
8 p.
|
artikel
|
| 27 |
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
|
Ključar, Luka
|
|
2017
|
79 |
C |
p. 297-305
9 p.
|
artikel
|
| 28 |
Implementation of a fast relative digital temperature sensor to achieve thermal protection in Zynq SoC technology
|
Lefebvre, Charles-Alexis
|
|
2017
|
79 |
C |
p. 433-439
7 p.
|
artikel
|
| 29 |
Improved analytical model of surface potential with modified boundary conditions for double gate tunnel FETs
|
Lu, Bin
|
|
2017
|
79 |
C |
p. 231-238
8 p.
|
artikel
|
| 30 |
Improved reliability characteristics of Ge MOS devices by capping Hf or Zr on interfacial layer
|
Li, Yan-Lin
|
|
2017
|
79 |
C |
p. 136-139
4 p.
|
artikel
|
| 31 |
Improving carrier mobility with vanadium doping of transparent conducting CdO
|
Dakhel, A.A.
|
|
2017
|
79 |
C |
p. 276-280
5 p.
|
artikel
|
| 32 |
Inside Front Cover - Editorial Board Page
|
|
|
2017
|
79 |
C |
p. IFC-
1 p.
|
artikel
|
| 33 |
In situ tensile testing of tin (Sn) whiskers in a focused ion beam (FIB)/scanning electron microscope (SEM)
|
Vallabhaneni, Renuka
|
|
2017
|
79 |
C |
p. 314-320
7 p.
|
artikel
|
| 34 |
Interface and interconnection stresses in electronic assemblies – A critical review of analytical solutions
|
Wong, E.H.
|
|
2017
|
79 |
C |
p. 206-220
15 p.
|
artikel
|
| 35 |
Investigation on X-ray irradiation on nanoscale nitride based charge trapping flash memory devices
|
Lee, Meng Chuan
|
|
2017
|
79 |
C |
p. 59-68
10 p.
|
artikel
|
| 36 |
Light output stabilisation of LED based streetlighting luminaires by adaptive current control
|
Hegedüs, J.
|
|
2017
|
79 |
C |
p. 448-456
9 p.
|
artikel
|
| 37 |
Location resolved transient thermal analysis to investigate crack growth in solder joints
|
Liu, E.
|
|
2017
|
79 |
C |
p. 533-546
14 p.
|
artikel
|
| 38 |
Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions
|
Staliulionis, Ž.
|
|
2017
|
79 |
C |
p. 526-532
7 p.
|
artikel
|
| 39 |
Measuring structure functions of power devices in inverters
|
Aliyu, Attahir M.
|
|
2017
|
79 |
C |
p. 395-404
10 p.
|
artikel
|
| 40 |
Modelling LED lamps in SPICE with thermal phenomena taken into account
|
Górecki, Krzysztof
|
|
2017
|
79 |
C |
p. 440-447
8 p.
|
artikel
|
| 41 |
Modelling the temperature influence on dc characteristics of the IGBT
|
Górecki, Paweł
|
|
2017
|
79 |
C |
p. 96-103
8 p.
|
artikel
|
| 42 |
Module packaging effects on MEMS airbag sensor performance for automobiles
|
Park, Dong Hyun
|
|
2017
|
79 |
C |
p. 328-335
8 p.
|
artikel
|
| 43 |
Nanomechanical properties of Ag solder bumps doped with Pd and Au
|
Wen, Hua-Chiang
|
|
2017
|
79 |
C |
p. 270-275
6 p.
|
artikel
|
| 44 |
Nucleation and shrinkage of defects on the surface of tin induced by local strain distribution
|
Shibutani, Tadahiro
|
|
2017
|
79 |
C |
p. 119-123
5 p.
|
artikel
|
| 45 |
Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering
|
Najib, A.M.
|
|
2017
|
79 |
C |
p. 69-78
10 p.
|
artikel
|
| 46 |
Optimization of convectively cooled heat sinks
|
Lampio, Kaj
|
|
2017
|
79 |
C |
p. 473-479
7 p.
|
artikel
|
| 47 |
Partition-based approach to parametric dynamic compact thermal modeling
|
Codecasa, Lorenzo
|
|
2017
|
79 |
C |
p. 361-370
10 p.
|
artikel
|
| 48 |
Peak temperature reduction by optimizing power density distribution in 3D ICs with microchannel cooling
|
Zając, Piotr
|
|
2017
|
79 |
C |
p. 488-498
11 p.
|
artikel
|
| 49 |
Peculiarities of hole trapping in Al2O3-SiO2 gate dielectric stack
|
Lisiansky, M.
|
|
2017
|
79 |
C |
p. 265-269
5 p.
|
artikel
|
| 50 |
Phase-change immersion cooling high power light emitting diodes and heat transfer improvement
|
Kang, Xue
|
|
2017
|
79 |
C |
p. 257-264
8 p.
|
artikel
|
| 51 |
Physically-based evaluation of aging contributions in HC/FN-programmed 40nm NOR Flash technology
|
Torrente, Giulio
|
|
2017
|
79 |
C |
p. 281-287
7 p.
|
artikel
|
| 52 |
Reliability of MEMS shallow arches based actuator under the combined effect of mechanical shock and electric loads
|
Ouakad, Hassen M.
|
|
2017
|
79 |
C |
p. 352-359
8 p.
|
artikel
|
| 53 |
Remaining storage life prediction for an electromagnetic relay by a particle filtering-based method
|
Zhao, Youhu
|
|
2017
|
79 |
C |
p. 221-230
10 p.
|
artikel
|
| 54 |
Solder joint fatigue life prediction using peridynamic approach
|
Baber, Forrest
|
|
2017
|
79 |
C |
p. 20-31
12 p.
|
artikel
|
| 55 |
SPICE level implementation of physics of filamentation in ESD protection devices
|
Sinha, Dheeraj Kumar
|
|
2017
|
79 |
C |
p. 239-247
9 p.
|
artikel
|
| 56 |
Stress imaging in structural challenging MEMS with high sensitivity using micro-Raman spectroscopy
|
Meszmer, Peter
|
|
2017
|
79 |
C |
p. 104-110
7 p.
|
artikel
|
| 57 |
Study on the methods to measure the junction-to-case thermal resistance of IGBT modules and press pack IGBTs
|
Deng, Erping
|
|
2017
|
79 |
C |
p. 248-256
9 p.
|
artikel
|
| 58 |
The phenomenon of tin pest: A review
|
Cornelius, Ben
|
|
2017
|
79 |
C |
p. 175-192
18 p.
|
artikel
|
| 59 |
Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits
|
Melamed, Samson
|
|
2017
|
79 |
C |
p. 380-386
7 p.
|
artikel
|
| 60 |
Thermal investigations of integrated circuits and systems, THERMINIC'16
|
Rencz, Marta
|
|
2017
|
79 |
C |
p. 360-
1 p.
|
artikel
|
| 61 |
Thermoelectrical modelling and simulation of devices based on VO2
|
Pohl, László
|
|
2017
|
79 |
C |
p. 387-394
8 p.
|
artikel
|
| 62 |
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
|
Chen, Cheng
|
|
2017
|
79 |
C |
p. 38-47
10 p.
|
artikel
|
| 63 |
Transfer matrix model of multilayer graphene nanoribbon interconnects
|
Fotoohi, Somayeh
|
|
2017
|
79 |
C |
p. 193-200
8 p.
|
artikel
|
| 64 |
Trend of the development of metal-based heat dissipative materials
|
Mizuuchi, Kiyoshi
|
|
2017
|
79 |
C |
p. 5-19
15 p.
|
artikel
|
| 65 |
Using scanning acoustic microscopy and LM-BP algorithm for defect inspection of micro solder bumps
|
Liu, Fan
|
|
2017
|
79 |
C |
p. 166-174
9 p.
|
artikel
|
| 66 |
Validation methodology to analyze the temperature-dependent heat path of a 4-chip LED module using a finite volume simulation
|
Mitterhuber, Lisa
|
|
2017
|
79 |
C |
p. 462-472
11 p.
|
artikel
|
Tijdschrift beschrijving