| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization
|
Fang, Jau-Shiung
|
|
2013
|
43 |
1 |
p. 212-218
|
article
|
| 2 |
Characterization of ALD Beryllium Oxide as a Potential High-k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs
|
Johnson, Derek W.
|
|
2013
|
43 |
1 |
p. 151-154
|
article
|
| 3 |
Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders
|
Wang, Chao-hong
|
|
2013
|
43 |
1 |
p. 195-203
|
article
|
| 4 |
EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
|
Wang, S. J.
|
|
2013
|
43 |
1 |
p. 219-228
|
article
|
| 5 |
Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints
|
Hu, Y. J.
|
|
2013
|
43 |
1 |
p. 170-175
|
article
|
| 6 |
Effect of Mo Addition on Structure and Magnetocaloric Effect in γ-FeNi Nanocrystals
|
Ucar, Huseyin
|
|
2013
|
43 |
1 |
p. 137-141
|
article
|
| 7 |
Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders
|
Liu, Sihan
|
|
2013
|
43 |
1 |
p. 26-32
|
article
|
| 8 |
Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition
|
Jung, Myung-Won
|
|
2013
|
43 |
1 |
p. 290-298
|
article
|
| 9 |
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy
|
Xie, H.X.
|
|
2013
|
43 |
1 |
p. 33-42
|
article
|
| 10 |
Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature
|
Calata, Jesus N.
|
|
2013
|
43 |
1 |
p. 109-116
|
article
|
| 11 |
Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging
|
Hsu, Hao
|
|
2013
|
43 |
1 |
p. 236-246
|
article
|
| 12 |
Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis
|
Hsu, Hsueh-Hsien
|
|
2013
|
43 |
1 |
p. 52-56
|
article
|
| 13 |
Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys
|
Rahman, Md. Arifur
|
|
2013
|
43 |
1 |
p. 176-186
|
article
|
| 14 |
Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum
|
Lee, Chin C.
|
|
2013
|
43 |
1 |
p. 9-15
|
article
|
| 15 |
High-Frequency Inductor Materials
|
Varga, L. K.
|
|
2013
|
43 |
1 |
p. 117-120
|
article
|
| 16 |
Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints
|
Huang, Z.
|
|
2013
|
43 |
1 |
p. 88-95
|
article
|
| 17 |
Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
|
Lee, Tae-Kyu
|
|
2013
|
43 |
1 |
p. 69-79
|
article
|
| 18 |
In Situ Measurement of Stress and Whisker/Hillock Density During Thermal Cycling of Sn Layers
|
Pei, Fei
|
|
2013
|
43 |
1 |
p. 80-87
|
article
|
| 19 |
Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder
|
Hu, Y.J.
|
|
2013
|
43 |
1 |
p. 277-283
|
article
|
| 20 |
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
|
Lin, Shih-kang
|
|
2013
|
43 |
1 |
p. 204-211
|
article
|
| 21 |
Interfacial Reactions of High-Bi Alloys on Various Substrates
|
Wang, Jin-Yi
|
|
2013
|
43 |
1 |
p. 155-165
|
article
|
| 22 |
Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates
|
Yen, Yee-Wen
|
|
2013
|
43 |
1 |
p. 187-194
|
article
|
| 23 |
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions
|
Chang, Jaewon
|
|
2013
|
43 |
1 |
p. 259-269
|
article
|
| 24 |
Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing
|
Yang, Tsung-Han
|
|
2013
|
43 |
1 |
p. 270-276
|
article
|
| 25 |
Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures
|
Hashiba, M.
|
|
2013
|
43 |
1 |
p. 247-258
|
article
|
| 26 |
Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications
|
Zhou, Bite
|
|
2013
|
43 |
1 |
p. 57-68
|
article
|
| 27 |
Mitigation of Sn Whisker Growth by Small Bi Additions
|
Jo, Jung-Lae
|
|
2013
|
43 |
1 |
p. 1-8
|
article
|
| 28 |
Multiphase Resistivity Model for Magnetic Nanocomposites Developed for High Frequency, High Power Transformation
|
DeGeorge, V.
|
|
2013
|
43 |
1 |
p. 96-108
|
article
|
| 29 |
Nanomeshed Pt(Au) Transparent Contact to p-GaNof Light-Emitting Diode
|
Li, Xu Feng
|
|
2013
|
43 |
1 |
p. 166-169
|
article
|
| 30 |
Optical Properties of AlxOy/Ni/AlxOy Multilayered Absorber Coatings Prepared by Reactive DC Magnetron Sputtering
|
Tsai, T. K.
|
|
2013
|
43 |
1 |
p. 229-235
|
article
|
| 31 |
Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications
|
Ho, C. E.
|
|
2013
|
43 |
1 |
p. 16-25
|
article
|
| 32 |
Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System
|
Chien, P. Y.
|
|
2013
|
43 |
1 |
p. 284-289
|
article
|
| 33 |
Soft Magnetic Alloy–Polymer Composite for High-Frequency Power Electronics Application
|
Calata, Jesus N.
|
|
2013
|
43 |
1 |
p. 126-131
|
article
|
| 34 |
Structure–Property Correlations in CoFe–SiO2 Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques
|
Ohodnicki, P.R.
|
|
2013
|
43 |
1 |
p. 142-150
|
article
|
| 35 |
Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism
|
Wang, Ling
|
|
2013
|
43 |
1 |
p. 132-136
|
article
|
| 36 |
Texture and Magnetic Properties of Rolled Fe-6.5 wt.%Si Thin Sheets
|
Yao, Y. C.
|
|
2013
|
43 |
1 |
p. 121-125
|
article
|
| 37 |
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
|
Linares, Xioranny
|
|
2013
|
43 |
1 |
p. 43-51
|
article
|
Journal description