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Journal description
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Details for article 24 of 37 found articles
| Title: |
Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing |
| Author: |
Yang, Tsung-Han Lin, Yu-Min Ouyang, Fan-Yi |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 43 (2013) nr. 1 pages 270-276 |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 37 found articles
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