| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis and mitigation of BTI aging in register file: An application driven approach
|
Kothawade, Saurabh
|
|
2013
|
53 |
1 |
p. 105-113
9 p.
|
artikel
|
| 2 |
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps
|
Chang, Y.W.
|
|
2013
|
53 |
1 |
p. 41-46
6 p.
|
artikel
|
| 3 |
Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias
|
Udupa, Anirudh
|
|
2013
|
53 |
1 |
p. 63-69
7 p.
|
artikel
|
| 4 |
An efficient technique to select logic nodes for single event transient pulse-width reduction
|
Mahatme, Nihaar N.
|
|
2013
|
53 |
1 |
p. 114-117
4 p.
|
artikel
|
| 5 |
An improved multilevel cell programming technique for 4-bits/cell localized trapping SONOS memory devices
|
Xu, Yue
|
|
2013
|
53 |
1 |
p. 118-122
5 p.
|
artikel
|
| 6 |
Annealing and thickness related performance and degradation of polymer solar cells
|
Zhao, Zhouying
|
|
2013
|
53 |
1 |
p. 123-128
6 p.
|
artikel
|
| 7 |
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
|
Kar, Yap Boon
|
|
2013
|
53 |
1 |
p. 164-173
10 p.
|
artikel
|
| 8 |
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test
|
Liu, Xi
|
|
2013
|
53 |
1 |
p. 70-78
9 p.
|
artikel
|
| 9 |
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force
|
Li, Xin
|
|
2013
|
53 |
1 |
p. 174-181
8 p.
|
artikel
|
| 10 |
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging
|
Chen, Wen-Hwa
|
|
2013
|
53 |
1 |
p. 30-40
11 p.
|
artikel
|
| 11 |
Inside front cover - Editorial board
|
|
|
2013
|
53 |
1 |
p. IFC-
1 p.
|
artikel
|
| 12 |
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias
|
Jiang, Tengfei
|
|
2013
|
53 |
1 |
p. 53-62
10 p.
|
artikel
|
| 13 |
Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment
|
Shen, Y.-L.
|
|
2013
|
53 |
1 |
p. 79-89
11 p.
|
artikel
|
| 14 |
Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method
|
Ikeda, Toru
|
|
2013
|
53 |
1 |
p. 145-153
9 p.
|
artikel
|
| 15 |
Reliability assessment of RFID reader through prognostics and health management
|
Huang, Chien-Yi
|
|
2013
|
53 |
1 |
p. 136-144
9 p.
|
artikel
|
| 16 |
Reliability of key technologies in 3D integration
|
Ko, Cheng-Ta
|
|
2013
|
53 |
1 |
p. 7-16
10 p.
|
artikel
|
| 17 |
Reliability of micro-interconnects in 3D IC packages
|
Robert Kao, C.
|
|
2013
|
53 |
1 |
p. 1-
1 p.
|
artikel
|
| 18 |
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric
|
Frank, T.
|
|
2013
|
53 |
1 |
p. 17-29
13 p.
|
artikel
|
| 19 |
Research and design of a power management chip for wireless powering capsule endoscopy
|
Chen, Jianguang
|
|
2013
|
53 |
1 |
p. 129-135
7 p.
|
artikel
|
| 20 |
Revisiting MOSFET threshold voltage extraction methods
|
Ortiz-Conde, Adelmo
|
|
2013
|
53 |
1 |
p. 90-104
15 p.
|
artikel
|
| 21 |
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics
|
Chen, Y.J.
|
|
2013
|
53 |
1 |
p. 47-52
6 p.
|
artikel
|
| 22 |
Size and constraint effects on interfacial fracture behavior of microscale solder interconnects
|
Li, B.
|
|
2013
|
53 |
1 |
p. 154-163
10 p.
|
artikel
|
| 23 |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
|
Tu, K.N.
|
|
2013
|
53 |
1 |
p. 2-6
5 p.
|
artikel
|
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