|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 21 of 23 found articles
| Title: |
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics |
| Author: |
Chen, Y.J. Chung, C.K. Yang, C.R. Kao, C.R. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 53 (2013) nr. 1 pages 6 p. |
| Year: |
2013 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 23 found articles
| << previous | next >> |