| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparative study on electrothermal characteristics of nanoscale multiple gate MOSFETs
|
Gu, Qi-Lin
|
|
2017
|
78 |
C |
p. 362-369
8 p.
|
artikel
|
| 2 |
Adhesion of NCF to oxidized Si wafers after oxygen plasma treatment
|
Jang, Min-Seok
|
|
2017
|
78 |
C |
p. 220-226
7 p.
|
artikel
|
| 3 |
Analysis of multifinger power HEMTs supported by effective 3-D device electrothermal simulation
|
Chvála, Aleš
|
|
2017
|
78 |
C |
p. 148-155
8 p.
|
artikel
|
| 4 |
Analysis on the difference of the characteristic between high power IGBT modules and press pack IGBTs
|
Deng, Erping
|
|
2017
|
78 |
C |
p. 25-37
13 p.
|
artikel
|
| 5 |
An efficient reliability testing method combined with thermal performance monitoring
|
Hantos, G.
|
|
2017
|
78 |
C |
p. 126-130
5 p.
|
artikel
|
| 6 |
A newly developed rapid uniform thermal cycle test system for electronic components
|
Ikuno, Hajime
|
|
2017
|
78 |
C |
p. 53-64
12 p.
|
artikel
|
| 7 |
A novel multiple-stress-based predictive model of LEDs for rapid lifetime estimation
|
Huang, Su-Dan
|
|
2017
|
78 |
C |
p. 46-52
7 p.
|
artikel
|
| 8 |
A novel vertical SCR for ESD protection in 40V HV bipolar process
|
Liu, Fan
|
|
2017
|
78 |
C |
p. 307-310
4 p.
|
artikel
|
| 9 |
A potential gas sensor device based on Pd/RGO/TiO2 nanotube ternary hybrid junction
|
Ghosal, S.
|
|
2017
|
78 |
C |
p. 299-306
8 p.
|
artikel
|
| 10 |
A reliable integrative autocorrelator device for particle fluctuation rate monitoring
|
Pan, Boan
|
|
2017
|
78 |
C |
p. 280-284
5 p.
|
artikel
|
| 11 |
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method
|
Wei, Hsiu-Ping
|
|
2017
|
78 |
C |
p. 319-330
12 p.
|
artikel
|
| 12 |
A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging
|
Kung, Huang-Kuang
|
|
2017
|
78 |
C |
p. 272-279
8 p.
|
artikel
|
| 13 |
Battery remaining useful life prediction at different discharge rates
|
Wang, Dong
|
|
2017
|
78 |
C |
p. 212-219
8 p.
|
artikel
|
| 14 |
Characterizing a RISC-V SRAM-based FPGA implementation against Single Event Upsets using fault injection
|
Ramos, Alexis
|
|
2017
|
78 |
C |
p. 205-211
7 p.
|
artikel
|
| 15 |
Color shift acceleration on mid-power LED packages
|
Lu, Guangjun
|
|
2017
|
78 |
C |
p. 294-298
5 p.
|
artikel
|
| 16 |
Comparative analysis of parameter extraction techniques for AlGaN/GaN HEMT on silicon/sapphire substrate
|
Majumdar, Shubhankar
|
|
2017
|
78 |
C |
p. 389-395
7 p.
|
artikel
|
| 17 |
Comparison of the electro-thermal constraints on SiC MOSFET and Si IGBT power modules in photovoltaic DC/AC inverters
|
Dbeiss, Mouhannad
|
|
2017
|
78 |
C |
p. 65-71
7 p.
|
artikel
|
| 18 |
Comparison study on microstructure and mechanical properties of Sn-10Bi and Sn-Ag-Cu solder alloys and joints
|
Guo, Qinhan
|
|
2017
|
78 |
C |
p. 72-79
8 p.
|
artikel
|
| 19 |
Cooling-controlled and reliable driving module for low-level light therapy LED helmet
|
Wang, Pengbo
|
|
2017
|
78 |
C |
p. 370-373
4 p.
|
artikel
|
| 20 |
Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments
|
Ahn, Key-one
|
|
2017
|
78 |
C |
p. 1-10
10 p.
|
artikel
|
| 21 |
Design of 2.4-GHz T/R switch with embedded ESD protection devices in CMOS process
|
Lin, Chun-Yu
|
|
2017
|
78 |
C |
p. 258-266
9 p.
|
artikel
|
| 22 |
Effect of body bias and temperature on low-frequency noise in 40-nm nMOSFETs
|
Chiu, Hsien-Chin
|
|
2017
|
78 |
C |
p. 267-271
5 p.
|
artikel
|
| 23 |
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds
|
Pun, Kelvin P.L.
|
|
2017
|
78 |
C |
p. 339-348
10 p.
|
artikel
|
| 24 |
Effect of 805nm on reliability of 735/805/850-nm LED involved near-infrared spectroscopy biomedical device
|
Zhao, Yue
|
|
2017
|
78 |
C |
p. 406-410
5 p.
|
artikel
|
| 25 |
Effects of acrylic adhesives property and optimized bonding parameters on Sn58Bi solder joint morphology for flex-on-board assembly
|
Zhang, Shuye
|
|
2017
|
78 |
C |
p. 181-189
9 p.
|
artikel
|
| 26 |
Effects of electric field and bias voltage on corrosion behavior of tin under a thin electrolyte layer
|
Huang, Hualiang
|
|
2017
|
78 |
C |
p. 131-142
12 p.
|
artikel
|
| 27 |
Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding
|
Usui, M.
|
|
2017
|
78 |
C |
p. 93-99
7 p.
|
artikel
|
| 28 |
Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages
|
Wu, Yuelin
|
|
2017
|
78 |
C |
p. 355-361
7 p.
|
artikel
|
| 29 |
Estimating the SEU failure rate of designs implemented in FPGAs in presence of MCUs
|
Villalta, Igor
|
|
2017
|
78 |
C |
p. 85-92
8 p.
|
artikel
|
| 30 |
Estimating the Single-Event Upset sensitivity of a memory array using simulation
|
Raine, Mélanie
|
|
2017
|
78 |
C |
p. 349-354
6 p.
|
artikel
|
| 31 |
High stability and robustness of a developed novel laser acupuncture theranostic device
|
Zhong, Fulin
|
|
2017
|
78 |
C |
p. 401-405
5 p.
|
artikel
|
| 32 |
Impact of thermal aging on the intermetallic compound particle size and mechanical properties of lead free solder for green electronics
|
Aamir, Muhammad
|
|
2017
|
78 |
C |
p. 311-318
8 p.
|
artikel
|
| 33 |
Implementation and evaluation of 2D SEC-DED forward error correction scheme in wireless sensor networks
|
Nikolic, Goran S.
|
|
2017
|
78 |
C |
p. 161-180
20 p.
|
artikel
|
| 34 |
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
|
Tao, Qi
|
|
2017
|
78 |
C |
p. 396-400
5 p.
|
artikel
|
| 35 |
Inside Front Cover - Editorial Board Page
|
|
|
2017
|
78 |
C |
p. IFC-
1 p.
|
artikel
|
| 36 |
Interface traps effect on the charge transport mechanisms in metal oxide semiconductor structures based on silicon nanocrystals
|
Chatbouri, S.
|
|
2017
|
78 |
C |
p. 227-232
6 p.
|
artikel
|
| 37 |
Interrelationship of thermal parameters, microstructure and microhardness of directionally solidified Bi–Zn solder alloys
|
Septimio, Rudimylla S.
|
|
2017
|
78 |
C |
p. 100-110
11 p.
|
artikel
|
| 38 |
Model of phonon contribution to nonionizing energy loss (NIEL) for InP/InGaAs heterojunction
|
Zhao, Xiao-Hong
|
|
2017
|
78 |
C |
p. 156-160
5 p.
|
artikel
|
| 39 |
New structure with SiO2-gate-dielectric select gates in vertical-channel three-dimensional (3D) NAND flash memory
|
Wang, Bo
|
|
2017
|
78 |
C |
p. 80-84
5 p.
|
artikel
|
| 40 |
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
|
Tang, Hongyu
|
|
2017
|
78 |
C |
p. 197-204
8 p.
|
artikel
|
| 41 |
Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration
|
Jannoun, Mayssam
|
|
2017
|
78 |
C |
p. 249-257
9 p.
|
artikel
|
| 42 |
Reliability analysis of a newly developed detector for monitoring spine health
|
Li, Ting
|
|
2017
|
78 |
C |
p. 411-414
4 p.
|
artikel
|
| 43 |
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products
|
Yazdan Mehr, M.
|
|
2017
|
78 |
C |
p. 143-147
5 p.
|
artikel
|
| 44 |
Reliability study of package-on-package stacking assembly under vibration loading
|
Xia, Jiang
|
|
2017
|
78 |
C |
p. 285-293
9 p.
|
artikel
|
| 45 |
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies
|
d'Alessandro, Vincenzo
|
|
2017
|
78 |
C |
p. 233-242
10 p.
|
artikel
|
| 46 |
Single Event Upset rate determination for 65nm SRAM bit-cell in LEO radiation environments
|
Sajid, Muhammad
|
|
2017
|
78 |
C |
p. 11-16
6 p.
|
artikel
|
| 47 |
Soft error rate comparison of 6T and 8T SRAM ICs using mono-energetic proton and neutron irradiation sources
|
Malagón, D.
|
|
2017
|
78 |
C |
p. 38-45
8 p.
|
artikel
|
| 48 |
Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method
|
Wang, Yang
|
|
2017
|
78 |
C |
p. 17-24
8 p.
|
artikel
|
| 49 |
Temperature dependence of current–voltage characteristics of MoS2/Si devices prepared by the chemical vapor deposition method
|
Su, Ting-Hong
|
|
2017
|
78 |
C |
p. 374-378
5 p.
|
artikel
|
| 50 |
The critical impact of temperature gradients on Pt filament failure
|
Bíró, Ferenc
|
|
2017
|
78 |
C |
p. 118-125
8 p.
|
artikel
|
| 51 |
Thermal characterization of multicolor LED luminaire
|
Colaco, A.M.
|
|
2017
|
78 |
C |
p. 379-388
10 p.
|
artikel
|
| 52 |
Towards high-sensitive built-in current sensors enabling detection of radiation-induced soft errors
|
de Oliveira Rocha, Raphael
|
|
2017
|
78 |
C |
p. 190-196
7 p.
|
artikel
|
| 53 |
Transition voltage of AlGaN/GaN heterostructure MSM varactor with two-dimensional electron gas
|
Osvald, J.
|
|
2017
|
78 |
C |
p. 243-248
6 p.
|
artikel
|
| 54 |
TSV by 355 UV laser for 4G component packaging with micro-electroforming
|
Pan, C.T.
|
|
2017
|
78 |
C |
p. 331-338
8 p.
|
artikel
|
| 55 |
Using nanoindentation to investigate the temperature cycling of Sn37Pb solders
|
Wen, Hua-Chiang
|
|
2017
|
78 |
C |
p. 111-117
7 p.
|
artikel
|
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