| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s
|
Bieler, Thomas R.
|
|
2009
|
38 |
12 |
p. 2694-2701
|
artikel
|
| 2 |
Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing
|
Tan, Chia-Yen
|
|
2009
|
38 |
12 |
p. 2496-2505
|
artikel
|
| 3 |
Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders
|
Arfaei, Babak
|
|
2009
|
38 |
12 |
p. 2617-2627
|
artikel
|
| 4 |
Determination of Average Failure Time and Microstructural Analysis of Sn-Ag-Bi-In Solder Under Electromigration
|
Wu, Albert T.
|
|
2009
|
38 |
12 |
p. 2780-2785
|
artikel
|
| 5 |
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solderon Ni/Cu Substrate
|
Mittal, Jagjiwan
|
|
2009
|
38 |
12 |
p. 2436-2442
|
artikel
|
| 6 |
Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates
|
Alam, M. E.
|
|
2009
|
38 |
12 |
p. 2479-2488
|
artikel
|
| 7 |
Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films
|
Guo, Fu
|
|
2009
|
38 |
12 |
p. 2647-2658
|
artikel
|
| 8 |
Effect of Wet Pretreatment on Interfacial Adhesion Energyof Cu-Cu Thermocompression Bond for 3D IC Packages
|
Jang, Eun-Jung
|
|
2009
|
38 |
12 |
p. 2449-2454
|
artikel
|
| 9 |
Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders
|
Hsiao, Y. H.
|
|
2009
|
38 |
12 |
p. 2573-2578
|
artikel
|
| 10 |
ENIG Corrosion Induced by Second-Phase Precipitation
|
Osenbach, John
|
|
2009
|
38 |
12 |
p. 2592-2599
|
artikel
|
| 11 |
Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays
|
Wu, Albert T.
|
|
2009
|
38 |
12 |
p. 2786
|
artikel
|
| 12 |
Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles
|
Nishikawa, Hiroshi
|
|
2009
|
38 |
12 |
p. 2610-2616
|
artikel
|
| 13 |
Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages
|
Chuang, Tung-Han
|
|
2009
|
38 |
12 |
p. 2762-2769
|
artikel
|
| 14 |
Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound
|
Buchovecky, Eric
|
|
2009
|
38 |
12 |
p. 2676-2684
|
artikel
|
| 15 |
Foreword
|
Kang, Sung K.
|
|
2009
|
38 |
12 |
p. 2427-2428
|
artikel
|
| 16 |
Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy
|
Gong, Jicheng
|
|
2009
|
38 |
12 |
p. 2429-2435
|
artikel
|
| 17 |
Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints
|
Kobayashi, Takayuki
|
|
2009
|
38 |
12 |
p. 2659-2667
|
artikel
|
| 18 |
Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier
|
Kim, Seongjun
|
|
2009
|
38 |
12 |
p. 2668-2675
|
artikel
|
| 19 |
Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
|
Guo, H.Y.
|
|
2009
|
38 |
12 |
p. 2470-2478
|
artikel
|
| 20 |
Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu
|
Oh, Yong-Jun
|
|
2009
|
38 |
12 |
p. 2554-2562
|
artikel
|
| 21 |
Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment
|
Min, Kyoung-Jin
|
|
2009
|
38 |
12 |
p. 2455-2460
|
artikel
|
| 22 |
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings
|
Daghfal, John P.
|
|
2009
|
38 |
12 |
p. 2506-2515
|
artikel
|
| 23 |
Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology
|
Bakhishev, Teymur
|
|
2009
|
38 |
12 |
p. 2720-2725
|
artikel
|
| 24 |
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications
|
Dutta, I.
|
|
2009
|
38 |
12 |
p. 2735-2745
|
artikel
|
| 25 |
Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test
|
Ha, Sang-Su
|
|
2009
|
38 |
12 |
p. 2489-2495
|
artikel
|
| 26 |
Mechanical Shock Behavior of Bulk Pure Sn Solder
|
Yazzie, K. E.
|
|
2009
|
38 |
12 |
p. 2746-2755
|
artikel
|
| 27 |
Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear
|
Zhou, Bite
|
|
2009
|
38 |
12 |
p. 2702-2711
|
artikel
|
| 28 |
Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation
|
Bieler, Thomas R.
|
|
2009
|
38 |
12 |
p. 2712-2719
|
artikel
|
| 29 |
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
|
Lee, Tae-Kyu
|
|
2009
|
38 |
12 |
p. 2685-2693
|
artikel
|
| 30 |
Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework
|
Snugovsky, Polina
|
|
2009
|
38 |
12 |
p. 2628-2646
|
artikel
|
| 31 |
Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting
|
Wagner, John L.
|
|
2009
|
38 |
12 |
p. 2600-2609
|
artikel
|
| 32 |
Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating
|
Dimitrovska, Aleksandra
|
|
2009
|
38 |
12 |
p. 2516-2524
|
artikel
|
| 33 |
Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering
|
Park, M. S.
|
|
2009
|
38 |
12 |
p. 2525-2533
|
artikel
|
| 34 |
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
|
Liang, S. W.
|
|
2009
|
38 |
12 |
p. 2443-2448
|
artikel
|
| 35 |
Nucleation Control and Thermal Aging Resistanceof Near-Eutectic Sn-Ag-Cu-X Solder Jointsby Alloy Design
|
Anderson, Iver E.
|
|
2009
|
38 |
12 |
p. 2770-2779
|
artikel
|
| 36 |
Reaction Mechanism and Mechanical Properties of the Flip-Chip Sn-3.0Ag-0.5Cu Solder Bump with Cu/Ni-xCu/Ti Underbump Metallization After Various Reflows
|
Peng, Chung-Nan
|
|
2009
|
38 |
12 |
p. 2543-2553
|
artikel
|
| 37 |
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
|
Guo, Fu
|
|
2009
|
38 |
12 |
p. 2756-2761
|
artikel
|
| 38 |
Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging
|
Wang, Kai-Jheng
|
|
2009
|
38 |
12 |
p. 2534-2542
|
artikel
|
| 39 |
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface
|
Shang, P. J.
|
|
2009
|
38 |
12 |
p. 2579-2584
|
artikel
|
| 40 |
The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy
|
Seo, Sun-Kyoung
|
|
2009
|
38 |
12 |
p. 2461-2469
|
artikel
|
| 41 |
The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth
|
Dimitrovska, Aleksandra
|
|
2009
|
38 |
12 |
p. 2726-2734
|
artikel
|
| 42 |
The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples
|
Wu, W.H.
|
|
2009
|
38 |
12 |
p. 2563-2572
|
artikel
|
| 43 |
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
|
Kinney, Christopher
|
|
2009
|
38 |
12 |
p. 2585-2591
|
artikel
|
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