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Journal description
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Details for article 13 of 43 found articles
| Title: |
Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages |
| Author: |
Chuang, Tung-Han Cheng, Chih-Yuan Chang, Tao-Chih |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 38 (2009) nr. 12 pages 2762-2769 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 43 found articles
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