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                                       Details for article 13 of 43 found articles
 
 
  Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages
 
 
Title: Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages
Author: Chuang, Tung-Han
Cheng, Chih-Yuan
Chang, Tao-Chih
Appeared in: Journal of electronic materials
Paging: Volume 38 (2009) nr. 12 pages 2762-2769
Year: 2009
Contents:
Publisher: Springer US, Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 43 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands