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Journal description
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Details for article 14 of 43 found articles
| Title: |
Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound |
| Author: |
Buchovecky, Eric Jadhav, Nitin Bower, Allan F. Chason, Eric |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 38 (2009) nr. 12 pages 2676-2684 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 43 found articles
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