|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 25 of 43 found articles
| Title: |
Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test |
| Author: |
Ha, Sang-Su Jang, Jin-Kyu Ha, Sang-Ok Kim, Jong-Woong Yoon, Jeong-Won Kim, Byung-Woo Park, Sun-Kyu Jung, Seung-Boo |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 38 (2009) nr. 12 pages 2489-2495 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 43 found articles
| << previous | next >> |