| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A compact model for NBTI degradation and recovery under use-profile variations and its application to aging analysis of digital integrated circuits
|
Kleeberger, Veit B.
|
|
2014
|
54 |
6-7 |
p. 1083-1089
7 p.
|
article
|
| 2 |
A graph based approach for reliability analysis of nano-scale VLSI logic circuits
|
Vaghef, Vahid Hamiyati
|
|
2014
|
54 |
6-7 |
p. 1299-1306
8 p.
|
article
|
| 3 |
Analysis of Harmonic distortion in asymmetric underlap DG-MOSFET with high-k spacer
|
Dutta, Arka
|
|
2014
|
54 |
6-7 |
p. 1125-1132
8 p.
|
article
|
| 4 |
Analytical compact modeling and statistical variability study of LDMOS
|
Zhou, Hongtao
|
|
2014
|
54 |
6-7 |
p. 1096-1102
7 p.
|
article
|
| 5 |
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner
|
Ding, Yingtao
|
|
2014
|
54 |
6-7 |
p. 1384-1391
8 p.
|
article
|
| 6 |
An area-efficient LDMOS-SCR ESD protection device for the I/O of power IC application
|
Zeng, Jie
|
|
2014
|
54 |
6-7 |
p. 1173-1178
6 p.
|
article
|
| 7 |
An investigation on capacitance-trigger ESD protection devices for high voltage integrated circuits
|
Liang, Hailian
|
|
2014
|
54 |
6-7 |
p. 1169-1172
4 p.
|
article
|
| 8 |
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes
|
Ye, Huaiyu
|
|
2014
|
54 |
6-7 |
p. 1355-1362
8 p.
|
article
|
| 9 |
A review: On the development of low melting temperature Pb-free solders
|
Kotadia, Hiren R.
|
|
2014
|
54 |
6-7 |
p. 1253-1273
21 p.
|
article
|
| 10 |
Case studies of defect localization based on software-based fault diagnosis in comparison with PEMS/OBIRCH analysis
|
Naoe, Takuya
|
|
2014
|
54 |
6-7 |
p. 1433-1442
10 p.
|
article
|
| 11 |
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
|
Vandevelde, Bart
|
|
2014
|
54 |
6-7 |
p. 1200-1205
6 p.
|
article
|
| 12 |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
|
Eckermann, J.
|
|
2014
|
54 |
6-7 |
p. 1235-1242
8 p.
|
article
|
| 13 |
Design-in-reliability: From library modeling and optimization to gate-level verification
|
Jain, Palkesh
|
|
2014
|
54 |
6-7 |
p. 1421-1432
12 p.
|
article
|
| 14 |
Device characteristics of AlGaN/GaN MIS–HEMTs with high-k Hf x Zr1 − x O2 (x =0.66,0.47,0.15) insulator layer
|
Chiu, Hsien-Chin
|
|
2014
|
54 |
6-7 |
p. 1282-1287
6 p.
|
article
|
| 15 |
ESD degradation and robustness of RGB LEDs and modules: An investigation based on combined electrical and optical measurements
|
Meneghini, Matteo
|
|
2014
|
54 |
6-7 |
p. 1143-1149
7 p.
|
article
|
| 16 |
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system
|
Ye, Huaiyu
|
|
2014
|
54 |
6-7 |
p. 1338-1343
6 p.
|
article
|
| 17 |
Flexible stop and double-cascaded stop to improve shock reliability of MEMS accelerometer
|
Tao, Yong-Kang
|
|
2014
|
54 |
6-7 |
p. 1328-1337
10 p.
|
article
|
| 18 |
Geometry optimization of a Lorentz force, resonating MEMS magnetometer
|
Bagherinia, M.
|
|
2014
|
54 |
6-7 |
p. 1192-1199
8 p.
|
article
|
| 19 |
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur
|
|
2014
|
54 |
6-7 |
p. 1179-1181
3 p.
|
article
|
| 20 |
Improved device variability in scaled MOSFETs with deeply retrograde channel profile
|
Woo, Jason
|
|
2014
|
54 |
6-7 |
p. 1090-1095
6 p.
|
article
|
| 21 |
Improving the reliability of electronic paper display using FMEA and Taguchi methods: A case study
|
Su, Chao-Ton
|
|
2014
|
54 |
6-7 |
p. 1369-1377
9 p.
|
article
|
| 22 |
Influence of bias humidity testing and application on time-dependent, Arrhenius-law-based stability predictions for thin film resistors
|
Kuehl, Reiner W.
|
|
2014
|
54 |
6-7 |
p. 1316-1327
12 p.
|
article
|
| 23 |
Inside front cover - Editorial board
|
|
|
2014
|
54 |
6-7 |
p. IFC-
1 p.
|
article
|
| 24 |
Mechanical and corrosion resistances of a Sn–0.7wt.%Cu lead-free solder alloy
|
Freitas, Emmanuelle S.
|
|
2014
|
54 |
6-7 |
p. 1392-1400
9 p.
|
article
|
| 25 |
Methodology of reliability enhancement for high power LED driver
|
Lan, Song
|
|
2014
|
54 |
6-7 |
p. 1150-1159
10 p.
|
article
|
| 26 |
Modeling and analysis of gate-all-around silicon nanowire FET
|
Chen, Xiangchen
|
|
2014
|
54 |
6-7 |
p. 1103-1108
6 p.
|
article
|
| 27 |
Monitoring of aging in integrated circuits by identifying possible critical paths
|
Lorenz, Dominik
|
|
2014
|
54 |
6-7 |
p. 1075-1082
8 p.
|
article
|
| 28 |
Multi-physics reliability simulation for solid state lighting drivers
|
Tarashioon, S.
|
|
2014
|
54 |
6-7 |
p. 1212-1222
11 p.
|
article
|
| 29 |
Multi-physics simulations for combined temperature/humidity loading of potted electronic assemblies
|
Parsa, Ehsan
|
|
2014
|
54 |
6-7 |
p. 1182-1191
10 p.
|
article
|
| 30 |
New degradation mechanism observed for AlGaN/GaN HEMTs with sub 100nm scale unpassivated regions around the gate periphery
|
Ivo, Ponky
|
|
2014
|
54 |
6-7 |
p. 1288-1292
5 p.
|
article
|
| 31 |
On the crack and delamination risk optimization of a Si-interposer for LED packaging
|
Auersperg, J.
|
|
2014
|
54 |
6-7 |
p. 1223-1227
5 p.
|
article
|
| 32 |
On the current conduction mechanisms of CeO2/La2O3 stacked gate dielectric
|
Feng, Xuan
|
|
2014
|
54 |
6-7 |
p. 1133-1136
4 p.
|
article
|
| 33 |
Oxygen vacancy formation and the induced defect states in HfO2 and Hf-silicates – A first principles hybrid functional study
|
Chen, Tsung-Ju
|
|
2014
|
54 |
6-7 |
p. 1119-1124
6 p.
|
article
|
| 34 |
Planar copper-tin inter-metallic film formation on strained substrates
|
Hsu, Feng-Chih
|
|
2014
|
54 |
6-7 |
p. 1378-1383
6 p.
|
article
|
| 35 |
Predicting bond failure after 1.5ms of bonding, an initial study
|
Tietäväinen, Aino
|
|
2014
|
54 |
6-7 |
p. 1452-1454
3 p.
|
article
|
| 36 |
Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging
|
Park, M.S.
|
|
2014
|
54 |
6-7 |
p. 1401-1411
11 p.
|
article
|
| 37 |
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
|
Li, Jue
|
|
2014
|
54 |
6-7 |
p. 1228-1234
7 p.
|
article
|
| 38 |
Reliability investigation of AlGaN/GaN high electron mobility transistors under reverse-bias stress
|
Chen, Wei-Wei
|
|
2014
|
54 |
6-7 |
p. 1293-1298
6 p.
|
article
|
| 39 |
Resilience Articulation Point (RAP): Cross-layer dependability modeling for nanometer system-on-chip resilience
|
Herkersdorf, Andreas
|
|
2014
|
54 |
6-7 |
p. 1066-1074
9 p.
|
article
|
| 40 |
Robustness measurement of integrated circuits and its adaptation to aging effects
|
Barke, Martin
|
|
2014
|
54 |
6-7 |
p. 1058-1065
8 p.
|
article
|
| 41 |
Self-repairing adder using fault localization
|
Akbar, Muhammad Ali
|
|
2014
|
54 |
6-7 |
p. 1443-1451
9 p.
|
article
|
| 42 |
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core
|
Weide-Zaage, K.
|
|
2014
|
54 |
6-7 |
p. 1206-1211
6 p.
|
article
|
| 43 |
Snapback breakdown ESD device based on zener diodes on silicon-on-insulator technology
|
Tam, Wing-Shan
|
|
2014
|
54 |
6-7 |
p. 1163-1168
6 p.
|
article
|
| 44 |
Soft error estimation and mitigation of digital circuits by characterizing input patterns of logic gates
|
Rezaei, Siavash
|
|
2014
|
54 |
6-7 |
p. 1412-1420
9 p.
|
article
|
| 45 |
Special section reliability and variability of devices for circuits and systems
|
Asenov, Asen
|
|
2014
|
54 |
6-7 |
p. 1057-
1 p.
|
article
|
| 46 |
Stacked zener trigger SCR for HV IC ESD protection
|
Dong, Shurong
|
|
2014
|
54 |
6-7 |
p. 1160-1162
3 p.
|
article
|
| 47 |
Stress impact of moisture diffusion measured with the stress chip
|
Schindler-Saefkow, F.
|
|
2014
|
54 |
6-7 |
p. 1243-1252
10 p.
|
article
|
| 48 |
Study of body and oxide thickness variation on analog and RF performance of underlap DG-MOSFETs
|
Pati, Sudhansu Kumar
|
|
2014
|
54 |
6-7 |
p. 1137-1142
6 p.
|
article
|
| 49 |
Subthreshold behavior models for short-channel junctionless tri-material cylindrical surrounding-gate MOSFET
|
Li, Cong
|
|
2014
|
54 |
6-7 |
p. 1274-1281
8 p.
|
article
|
| 50 |
Temperature dependences of threshold voltage and drain-induced barrier lowering in 60nm gate length MOS transistors
|
Chen, Zehua
|
|
2014
|
54 |
6-7 |
p. 1109-1114
6 p.
|
article
|
| 51 |
Thermal stability of sectorial split-drain magnetic field-effect transistors
|
Tam, Wing-Shan
|
|
2014
|
54 |
6-7 |
p. 1115-1118
4 p.
|
article
|
| 52 |
Thermal stresses in a multilayered thin film thermoelectric structure
|
Jin, Z.-H.
|
|
2014
|
54 |
6-7 |
p. 1363-1368
6 p.
|
article
|
| 53 |
U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
|
Wang, Jung-Chang
|
|
2014
|
54 |
6-7 |
p. 1344-1354
11 p.
|
article
|
| 54 |
Useful lifetime analysis for high-power white LEDs
|
Wang, Fu-Kwun
|
|
2014
|
54 |
6-7 |
p. 1307-1315
9 p.
|
article
|
Journal description