Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
Titel:
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
Auteur:
Vandevelde, Bart Ivankovic, A. Debecker, B. Lofrano, M. Vanstreels, K. Guo, W. Cherman, V. Gonzalez, M. Van der Plas, G. De Wolf, I. Beyne, E. Tokei, Z.