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Journal description
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Details for article 35 of 54 found articles
| Title: |
Predicting bond failure after 1.5ms of bonding, an initial study |
| Author: |
Tietäväinen, Aino Rauhala, Timo Seppänen, Henri Kurppa, Risto Meriläinen, Antti I. Hæggström, Edward |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 6-7 pages 3 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 54 found articles
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