| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparative study between the improved unified creep-plasticity model and Anand model: Experimental investigations at the material-scale and packaging structure-scale
|
Yang, Fan
|
|
|
172 |
C |
p.
|
artikel
|
| 2 |
Condition monitoring for detection of humidity-induced failures in control electronics of power converters
|
Sehr, F.
|
|
|
172 |
C |
p.
|
artikel
|
| 3 |
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods
|
Karanja, L.
|
|
|
172 |
C |
p.
|
artikel
|
| 4 |
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors
|
Joseph, Biby
|
|
|
172 |
C |
p.
|
artikel
|
| 5 |
Editorial Board
|
|
|
|
172 |
C |
p.
|
artikel
|
| 6 |
Gate oxide lifetime modeling of vertical SiC-MOS under accelerated reverse bias (ARB)
|
Biswas, Ayan K.
|
|
|
172 |
C |
p.
|
artikel
|
| 7 |
Geometry-driven physics-of-failure lifetime analysis of aluminum bonding wires in discrete SiC power electronics
|
Kilian, Borja
|
|
|
172 |
C |
p.
|
artikel
|
| 8 |
High-performance, low-area-overhead, and low-delay triple-node-upset self-recoverable latch design based on stacked transistors
|
Xu, Hui
|
|
|
172 |
C |
p.
|
artikel
|
| 9 |
Interconnect electromigration modeling based on chemical mechanical polishing process variation
|
Wang, Yali
|
|
|
172 |
C |
p.
|
artikel
|
| 10 |
Interfacial fracture behavior of polyimide/copper in RDL structures for advanced electronic packaging
|
Chen, Wenqing
|
|
|
172 |
C |
p.
|
artikel
|
| 11 |
Local thermal runaway during surge events in power rectifiers
|
Bergmann, Ole Jonathan
|
|
|
172 |
C |
p.
|
artikel
|
| 12 |
Long-term positive and negative gate bias stress tests on parallel connected SiC MOSFETs at −40 °C and 175 °C
|
Deb, A.
|
|
|
172 |
C |
p.
|
artikel
|
| 13 |
Machine learning-based surrogate models for finned heatsink thermal modeling
|
Wang, Z.
|
|
|
172 |
C |
p.
|
artikel
|
| 14 |
Mechanical and electrical testing of encapsulated stretchable substrate interconnect models for emerging flexible electronic systems
|
Bhatti, Gulafsha
|
|
|
172 |
C |
p.
|
artikel
|
| 15 |
Microstructure and properties of Cu/In-Sn-xZn-yAg/Cu solder joints after thermal aging
|
He, Yucong
|
|
|
172 |
C |
p.
|
artikel
|
| 16 |
Reading reliability analysis and modeling in 1S1R devices based on Phase-Change Memory and Ovonic Threshold Switching selector integrated in a double-patterned self-aligned structure
|
Antonelli, Renzo
|
|
|
172 |
C |
p.
|
artikel
|
| 17 |
Reliability analysis of dopingless vertical nanowire TFET with interface trap charges for ring-oscillator circuit implementation
|
Bhardwaj, Anjana
|
|
|
172 |
C |
p.
|
artikel
|
| 18 |
Remaining useful life prediction of DC contactor based on LSTM
|
Wang, Yu
|
|
|
172 |
C |
p.
|
artikel
|
| 19 |
Research on high-power high-frequency electrical transmission characteristics of through glass via interconnections
|
Chen, Luming
|
|
|
172 |
C |
p.
|
artikel
|
| 20 |
Separate investigation of performance degradation for the Si and GaN parts in cascode GaN devices under repetitive short circuits
|
Lu, Zhebie
|
|
|
172 |
C |
p.
|
artikel
|
| 21 |
Solder joint reliability predictions using physics-informed machine learning
|
de Jong, S.D.M.
|
|
|
172 |
C |
p.
|
artikel
|
| 22 |
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process
|
Lee, Jing Rou
|
|
|
172 |
C |
p.
|
artikel
|
| 23 |
Thermo-electrical reliability of power MOSFETs influenced by packaging architecture in stack-die and single-die configurations
|
Jang, You-Cheol
|
|
|
172 |
C |
p.
|
artikel
|
| 24 |
Thermo-mechanical analysis on 10 kV SiC-MOSFETs to improve the reliability of solder layers
|
Takahashi, Masaki
|
|
|
172 |
C |
p.
|
artikel
|
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