| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Chalcopyrite/Si Heterojunctions for Photovoltaic Applications
|
Akpa, O.
|
|
2010
|
39 |
11 |
p. 2462-2466
|
artikel
|
| 2 |
Control of Interface Traps in HfO2 Gate Dielectric on Silicon
|
Tan, S. Y.
|
|
2010
|
39 |
11 |
p. 2435-2440
|
artikel
|
| 3 |
Co Solubility in Sn and Interfacial Reactions in Sn-Co/Ni Couples
|
Chen, Sinn-wen
|
|
2010
|
39 |
11 |
p. 2418-2428
|
artikel
|
| 4 |
Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder
|
Chiang, Yu-Yan
|
|
2010
|
39 |
11 |
p. 2397-2402
|
artikel
|
| 5 |
Elastic Moduli of (Ni,Cu)3Sn4 Ternary Alloys from First-Principles Calculations
|
Gao, Feng
|
|
2010
|
39 |
11 |
p. 2429-2434
|
artikel
|
| 6 |
Electrical and Optical Characterization of AlGaN/GaN HEMTs with In Situ and Ex Situ Deposited SiNx Layers
|
Tadjer, Marko J.
|
|
2010
|
39 |
11 |
p. 2452-2458
|
artikel
|
| 7 |
Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n, and Implications for EM Reliability Assessment
|
Budiman, A.S.
|
|
2010
|
39 |
11 |
p. 2483-2488
|
artikel
|
| 8 |
Foreword
|
|
|
2010
|
39 |
11 |
p. 2367
|
artikel
|
| 9 |
Growth Mechanism of a Ternary (Cu,Ni)6Sn5 Compound at the Sn(Cu)/Ni(P) Interface
|
Huang, T. S.
|
|
2010
|
39 |
11 |
p. 2382-2386
|
artikel
|
| 10 |
High-Temperature Capacitor Based on Ca-Doped Bi0.5Na0.5TiO3-BaTiO3 Ceramics
|
Yuan, Y.
|
|
2010
|
39 |
11 |
p. 2471-2475
|
artikel
|
| 11 |
Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders
|
Mahmudi, R.
|
|
2010
|
39 |
11 |
p. 2495-2502
|
artikel
|
| 12 |
Influence of Palladium Thickness on the Soldering Reactions Between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) Surface Finish
|
Wu, W. H.
|
|
2010
|
39 |
11 |
p. 2387-2396
|
artikel
|
| 13 |
In Situ Temperature Measurement of GaN-Based Ultraviolet Light-Emitting Diodes by Micro-Raman Spectroscopy
|
Wang, Yaqi
|
|
2010
|
39 |
11 |
p. 2448-2451
|
artikel
|
| 14 |
Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps
|
Jeong, Myeong-Hyeok
|
|
2010
|
39 |
11 |
p. 2368-2374
|
artikel
|
| 15 |
Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate
|
Yen, Yee-Wen
|
|
2010
|
39 |
11 |
p. 2412-2417
|
artikel
|
| 16 |
Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints
|
Chang, Y. W.
|
|
2010
|
39 |
11 |
p. 2489-2494
|
artikel
|
| 17 |
Light-Harvesting in n-ZnO/p-Silicon Heterojunctions
|
Li, L.
|
|
2010
|
39 |
11 |
p. 2467-2470
|
artikel
|
| 18 |
Optimal Electrical Conductivity for Maximum Thermoelectric Figure of Merit
|
Min, Gao
|
|
2010
|
39 |
11 |
p. 2459-2461
|
artikel
|
| 19 |
Recrystallization of Electrodeposited Copper Thin Films During Annealing
|
Alshwawreh, N.
|
|
2010
|
39 |
11 |
p. 2476-2482
|
artikel
|
| 20 |
Study of Interfacial Reactions Between Sn(Cu) Solders and Ni-Co Alloy Layers
|
Huang, K. C.
|
|
2010
|
39 |
11 |
p. 2403-2411
|
artikel
|
| 21 |
Study of the Effects of Zn Content on the Interfacial Reactions Between Sn-Zn Solders and Ni Substrates at 250°C
|
Wang, Chao-hong
|
|
2010
|
39 |
11 |
p. 2375-2381
|
artikel
|
| 22 |
The Application of Barrierless Metallization in Making Copper Alloy, Cu(RuHfN), Films for Fine Interconnects
|
Lin, C.H.
|
|
2010
|
39 |
11 |
p. 2441-2447
|
artikel
|
Tijdschrift beschrijving