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                             26 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs Azarifar, Mohammad
2017
74 C p. 82-87
6 p.
artikel
2 A prognostic method for predicting failure of dc/dc converter Qingchuan, He
2017
74 C p. 27-33
7 p.
artikel
3 Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs Dai, Lihua
2017
74 C p. 74-80
7 p.
artikel
4 Editorial Board 2017
74 C p. IFC-
1 p.
artikel
5 Effect of roughness on electrical contact performance of electronic components Liu, Xin-long
2017
74 C p. 100-109
10 p.
artikel
6 Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints Ghosh, Rituparna
2017
74 C p. 44-51
8 p.
artikel
7 Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder Huang, Huizhen
2017
74 C p. 15-21
7 p.
artikel
8 Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling Qiu, Delong
2017
74 C p. 34-43
10 p.
artikel
9 Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components Vandevelde, Bart
2017
74 C p. 131-135
5 p.
artikel
10 Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems Wymysłowski, Artur
2017
74 C p. 118-120
3 p.
artikel
11 Impact of gate-to-source/drain misalignments on source-side injection Schottky barrier charge-trapping memory cells evaluated using numerical programming-trapping iterations Shih, Chun-Hsing
2017
74 C p. 9-14
6 p.
artikel
12 Improving the ESD self-protection capability of 60V HV p-channel LDMOS large array device in 0.25μm BCD process Chen, Hung-Wei
2017
74 C p. 110-117
8 p.
artikel
13 Influences of silicon-rich shallow trench isolation on total ionizing dose hardening and gate oxide integrity in a 130nm partially depleted SOI CMOS technology Song, Lei
2017
74 C p. 1-8
8 p.
artikel
14 Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity Baïri, Abderrahmane
2017
74 C p. 67-73
7 p.
artikel
15 Low cost fault tolerance against kc-cycle and km-unit transient for loop based control data flow graphs during physically aware high level synthesis Sengupta, Anirban
2017
74 C p. 88-99
12 p.
artikel
16 [No title] Gan, Chong Leong
2017
74 C p. 81-
1 p.
artikel
17 Operation of 4H-SiC high voltage normally-OFF V-JFET in radiation hard conditions: Simulations and experiment Popelka, S.
2017
74 C p. 58-66
9 p.
artikel
18 Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests Heilmann, Jens
2017
74 C p. 136-146
11 p.
artikel
19 Reliability of Cu wire bonds in microelectronic packages Mazloum-Nejadari, A.
2017
74 C p. 147-154
8 p.
artikel
20 Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method Qian, Cheng
2017
74 C p. 173-178
6 p.
artikel
21 Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation Liao, Zhiheng
2017
74 C p. 52-57
6 p.
artikel
22 Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages Fan, Jiajie
2017
74 C p. 179-185
7 p.
artikel
23 The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics Kuczynska, M.
2017
74 C p. 155-164
10 p.
artikel
24 Threshold-voltage variability analysis and modeling for junctionless double-gate transistors Chen, Chun-Yu
2017
74 C p. 22-26
5 p.
artikel
25 Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor Palczynska, Alicja
2017
74 C p. 165-172
8 p.
artikel
26 Viscoplastic properties of pressure-less sintered silver materials using indentation Leslie, D.
2017
74 C p. 121-130
10 p.
artikel
                             26 gevonden resultaten
 
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