| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A multiscale analytical correction technique for two-dimensional thermal models of AlGaN/GaN HEMTs
|
Azarifar, Mohammad
|
|
2017
|
74 |
C |
p. 82-87
6 p.
|
article
|
| 2 |
A prognostic method for predicting failure of dc/dc converter
|
Qingchuan, He
|
|
2017
|
74 |
C |
p. 27-33
7 p.
|
article
|
| 3 |
Degradation induced by TID radiation and hot-carrier stress in 130-nm short channel PDSOI NMOSFETs
|
Dai, Lihua
|
|
2017
|
74 |
C |
p. 74-80
7 p.
|
article
|
| 4 |
Editorial Board
|
|
|
2017
|
74 |
C |
p. IFC-
1 p.
|
article
|
| 5 |
Effect of roughness on electrical contact performance of electronic components
|
Liu, Xin-long
|
|
2017
|
74 |
C |
p. 100-109
10 p.
|
article
|
| 6 |
Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints
|
Ghosh, Rituparna
|
|
2017
|
74 |
C |
p. 44-51
8 p.
|
article
|
| 7 |
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
|
Huang, Huizhen
|
|
2017
|
74 |
C |
p. 15-21
7 p.
|
article
|
| 8 |
Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling
|
Qiu, Delong
|
|
2017
|
74 |
C |
p. 34-43
10 p.
|
article
|
| 9 |
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
|
Vandevelde, Bart
|
|
2017
|
74 |
C |
p. 131-135
5 p.
|
article
|
| 10 |
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur
|
|
2017
|
74 |
C |
p. 118-120
3 p.
|
article
|
| 11 |
Impact of gate-to-source/drain misalignments on source-side injection Schottky barrier charge-trapping memory cells evaluated using numerical programming-trapping iterations
|
Shih, Chun-Hsing
|
|
2017
|
74 |
C |
p. 9-14
6 p.
|
article
|
| 12 |
Improving the ESD self-protection capability of 60V HV p-channel LDMOS large array device in 0.25μm BCD process
|
Chen, Hung-Wei
|
|
2017
|
74 |
C |
p. 110-117
8 p.
|
article
|
| 13 |
Influences of silicon-rich shallow trench isolation on total ionizing dose hardening and gate oxide integrity in a 130nm partially depleted SOI CMOS technology
|
Song, Lei
|
|
2017
|
74 |
C |
p. 1-8
8 p.
|
article
|
| 14 |
Junction temperature of QFN32 and 64 electronic devices subjected to free convection. Effects of the resin's thermal conductivity
|
Baïri, Abderrahmane
|
|
2017
|
74 |
C |
p. 67-73
7 p.
|
article
|
| 15 |
Low cost fault tolerance against kc-cycle and km-unit transient for loop based control data flow graphs during physically aware high level synthesis
|
Sengupta, Anirban
|
|
2017
|
74 |
C |
p. 88-99
12 p.
|
article
|
| 16 |
[No title]
|
Gan, Chong Leong
|
|
2017
|
74 |
C |
p. 81-
1 p.
|
article
|
| 17 |
Operation of 4H-SiC high voltage normally-OFF V-JFET in radiation hard conditions: Simulations and experiment
|
Popelka, S.
|
|
2017
|
74 |
C |
p. 58-66
9 p.
|
article
|
| 18 |
Reliability experiments of sintered silver based interconnections by accelerated isothermal bending tests
|
Heilmann, Jens
|
|
2017
|
74 |
C |
p. 136-146
11 p.
|
article
|
| 19 |
Reliability of Cu wire bonds in microelectronic packages
|
Mazloum-Nejadari, A.
|
|
2017
|
74 |
C |
p. 147-154
8 p.
|
article
|
| 20 |
Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method
|
Qian, Cheng
|
|
2017
|
74 |
C |
p. 173-178
6 p.
|
article
|
| 21 |
Thermal evaluation of GaN-based HEMTs with various layer sizes and structural parameters using finite-element thermal simulation
|
Liao, Zhiheng
|
|
2017
|
74 |
C |
p. 52-57
6 p.
|
article
|
| 22 |
Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages
|
Fan, Jiajie
|
|
2017
|
74 |
C |
p. 179-185
7 p.
|
article
|
| 23 |
The role of stress state and stress triaxiality in lifetime prediction of solder joints in different packages utilized in automotive electronics
|
Kuczynska, M.
|
|
2017
|
74 |
C |
p. 155-164
10 p.
|
article
|
| 24 |
Threshold-voltage variability analysis and modeling for junctionless double-gate transistors
|
Chen, Chun-Yu
|
|
2017
|
74 |
C |
p. 22-26
5 p.
|
article
|
| 25 |
Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor
|
Palczynska, Alicja
|
|
2017
|
74 |
C |
p. 165-172
8 p.
|
article
|
| 26 |
Viscoplastic properties of pressure-less sintered silver materials using indentation
|
Leslie, D.
|
|
2017
|
74 |
C |
p. 121-130
10 p.
|
article
|
Journal description