| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
AC analysis of nanoscale GME-TRC MOSFET for microwave and RF applications
|
Malik, Priyanka
|
|
2012
|
52 |
1 |
p. 151-158
8 p.
|
artikel
|
| 2 |
Adhesion improvement of Epoxy Molding Compound – Pd Preplated leadframe interface using shaped nickel layers
|
Ni, Mingzhi
|
|
2012
|
52 |
1 |
p. 206-211
6 p.
|
artikel
|
| 3 |
A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress
|
Le, Jia-Liang
|
|
2012
|
52 |
1 |
p. 100-106
7 p.
|
artikel
|
| 4 |
Analysis of a vibration-induced micro-generator with a helical micro-spring and induction coil
|
Lu, W.L.
|
|
2012
|
52 |
1 |
p. 262-270
9 p.
|
artikel
|
| 5 |
Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation
|
Ferrara, Michael
|
|
2012
|
52 |
1 |
p. 9-15
7 p.
|
artikel
|
| 6 |
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products
|
Shnawah, Dhafer Abdulameer
|
|
2012
|
52 |
1 |
p. 90-99
10 p.
|
artikel
|
| 7 |
Competition between the buckling-driven delamination and wrinkling in compressed thin coatings
|
Tarasovs, S.
|
|
2012
|
52 |
1 |
p. 296-299
4 p.
|
artikel
|
| 8 |
Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications
|
Chung, Chang-Kyu
|
|
2012
|
52 |
1 |
p. 217-224
8 p.
|
artikel
|
| 9 |
Finite difference modelling of moisture diffusion in printed circuit boards with ground planes
|
Thomas, O.
|
|
2012
|
52 |
1 |
p. 253-261
9 p.
|
artikel
|
| 10 |
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
|
Suk, Kyoung-Lim
|
|
2012
|
52 |
1 |
p. 225-234
10 p.
|
artikel
|
| 11 |
High-energy neutrons effect on strained and non-strained SOI MuGFETs and planar MOSFETs
|
Kilchytska, V.
|
|
2012
|
52 |
1 |
p. 118-123
6 p.
|
artikel
|
| 12 |
Impact of ambient temperature set point deviation on Arrhenius estimates
|
Whitman, Charles S.
|
|
2012
|
52 |
1 |
p. 2-8
7 p.
|
artikel
|
| 13 |
Impact of gate placement on RF power degradation in GaN high electron mobility transistors
|
Joh, Jungwoo
|
|
2012
|
52 |
1 |
p. 33-38
6 p.
|
artikel
|
| 14 |
Increasing the reliability of solid state lighting systems via self-healing approaches: A review
|
Lafont, Ugo
|
|
2012
|
52 |
1 |
p. 71-89
19 p.
|
artikel
|
| 15 |
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints
|
Song, Jenn-Ming
|
|
2012
|
52 |
1 |
p. 180-189
10 p.
|
artikel
|
| 16 |
Inside front cover - Editorial board
|
|
|
2012
|
52 |
1 |
p. IFC-
1 p.
|
artikel
|
| 17 |
Introducing a scale structure to correlate quality and reliability
|
Roesch, William J.
|
|
2012
|
52 |
1 |
p. 16-22
7 p.
|
artikel
|
| 18 |
Investigation of optical and chemical bond properties of hydrogenated amorphous silicon nitride for optoelectronics applications
|
Herth, E.
|
|
2012
|
52 |
1 |
p. 141-146
6 p.
|
artikel
|
| 19 |
Investigation of the effect of temperature during off-state degradation of AlGaN/GaN High Electron Mobility Transistors
|
Douglas, E.A.
|
|
2012
|
52 |
1 |
p. 23-28
6 p.
|
artikel
|
| 20 |
Investigation of the fluid/structure interaction phenomenon in IC packaging
|
Khor, C.Y.
|
|
2012
|
52 |
1 |
p. 241-252
12 p.
|
artikel
|
| 21 |
Investigations on electrical characteristics and reliability properties of MOS capacitors using HfAlO x on n-GaAs substrates
|
Das, P.S.
|
|
2012
|
52 |
1 |
p. 112-117
6 p.
|
artikel
|
| 22 |
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling
|
Jacques, S.
|
|
2012
|
52 |
1 |
p. 212-216
5 p.
|
artikel
|
| 23 |
Modelling the effect of uneven PWB surface on stencil bending during stencil printing process
|
Krammer, Olivér
|
|
2012
|
52 |
1 |
p. 235-240
6 p.
|
artikel
|
| 24 |
New threshold voltage definition for undoped symmetrical DG MOSFET
|
Sałek, Paweł
|
|
2012
|
52 |
1 |
p. 294-295
2 p.
|
artikel
|
| 25 |
[No title]
|
Davidović, Vojkan
|
|
2012
|
52 |
1 |
p. 300-
1 p.
|
artikel
|
| 26 |
[No title]
|
Ersland, Peter
|
|
2012
|
52 |
1 |
p. 1-
1 p.
|
artikel
|
| 27 |
Novel GaAs enhancement-mode/depletion-mode pHEMTs technology using high-k praseodymium oxide interlayer
|
Chen, Chao-Hung
|
|
2012
|
52 |
1 |
p. 147-150
4 p.
|
artikel
|
| 28 |
On the effects of temperature on the drop reliability of electronic component boards
|
Mattila, T.T.
|
|
2012
|
52 |
1 |
p. 165-179
15 p.
|
artikel
|
| 29 |
On the reliability assessment of trench fieldstop IGBT under atmospheric neutron spectrum
|
Touboul, A.D.
|
|
2012
|
52 |
1 |
p. 124-129
6 p.
|
artikel
|
| 30 |
On the use of high-impedance power supplies to reduce the substrate switching noise in system-on-chips
|
Fiori, F.
|
|
2012
|
52 |
1 |
p. 282-288
7 p.
|
artikel
|
| 31 |
Radiation-induced shallow trench isolation leakage in 180-nm flash memory technology
|
Ning, Bingxu
|
|
2012
|
52 |
1 |
p. 130-136
7 p.
|
artikel
|
| 32 |
Reliability issues of double gate dielectric stacks based on hafnium dioxide (HfO2) layers for non-volatile semiconductor memory (NVSM) applications
|
Mroczyński, Robert
|
|
2012
|
52 |
1 |
p. 107-111
5 p.
|
artikel
|
| 33 |
Shock impact reliability characterization of a handheld product in accelerated tests and use environment
|
Karppinen, J.
|
|
2012
|
52 |
1 |
p. 190-198
9 p.
|
artikel
|
| 34 |
Single-bit failure analysis at a nanometer resolution by conductive atomic force microscopy
|
Jiang, Yong
|
|
2012
|
52 |
1 |
p. 159-164
6 p.
|
artikel
|
| 35 |
Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities
|
Grasser, Tibor
|
|
2012
|
52 |
1 |
p. 39-70
32 p.
|
artikel
|
| 36 |
Temperature dependence of neutron-induced soft errors in SRAMs
|
Bagatin, M.
|
|
2012
|
52 |
1 |
p. 289-293
5 p.
|
artikel
|
| 37 |
The effect of gate overlap lightly doped drains on low temperature poly-Si thin film transistors
|
Cho, Jaehyun
|
|
2012
|
52 |
1 |
p. 137-140
4 p.
|
artikel
|
| 38 |
The effect of nano-scale interaction forces on the premature pull-in of real-life Micro-Electro-Mechanical Systems
|
Ardito, R.
|
|
2012
|
52 |
1 |
p. 271-281
11 p.
|
artikel
|
| 39 |
Thermal stability of back side metallization multilayer for power device application
|
Ito, Takeshi
|
|
2012
|
52 |
1 |
p. 199-205
7 p.
|
artikel
|
| 40 |
The role of surface barrier oxidation on AlGaN/GaN HEMTs reliability
|
Ťapajna, Milan
|
|
2012
|
52 |
1 |
p. 29-32
4 p.
|
artikel
|
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