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Journal description
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Details for article 6 of 40 found articles
| Title: |
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products |
| Author: |
Shnawah, Dhafer Abdulameer Sabri, Mohd Faizul Mohd Badruddin, Irfan Anjum |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 52 (2012) nr. 1 pages 10 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 40 found articles
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