| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Al and Si Alloying Effect on Solder Joint Reliability in Sn-0.5Cu for Automotive Electronics
|
Hong, Won Sik
|
|
2016
|
45 |
12 |
p. 6150-6162
|
artikel
|
| 2 |
Effect of Ligament Morphology on Electrical Conductivity of Porous Silver
|
Zuruzi, Abu Samah
|
|
2016
|
45 |
12 |
p. 6113-6122
|
artikel
|
| 3 |
Effect of O2 Fraction in the Sputter Gas on the Electrical Properties of Amorphous In-Zn-O and the Thin Film Transistor Performance
|
Reed, Austin S.
|
|
2016
|
45 |
12 |
p. 6310-6316
|
artikel
|
| 4 |
Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints
|
Kim, Kyoung-Ho
|
|
2016
|
45 |
12 |
p. 6184-6191
|
artikel
|
| 5 |
Effect of Silicon Carbide Nanoparticles on the Grain Boundary Segregation and Thermoelectric Properties of Bismuth Doped Mg2Si0.7Ge0.3
|
Farahi, Nader
|
|
2016
|
45 |
12 |
p. 6052-6058
|
artikel
|
| 6 |
Effect of Solder-Joint Geometry on the Low-Cycle Fatigue Behavior of Sn-xAg-0.7Cu
|
Lee, Hwa-Teng
|
|
2016
|
45 |
12 |
p. 6102-6112
|
artikel
|
| 7 |
Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu
|
Huang, Wei-Chih
|
|
2016
|
45 |
12 |
p. 6137-6142
|
artikel
|
| 8 |
Effects of Ethyl Cellulose on Performance of Titania Photoanode for Dye-sensitized Solar Cells
|
Liu, Ting-Chien
|
|
2016
|
45 |
12 |
p. 6192-6199
|
artikel
|
| 9 |
Effects of Ga Addition on Interfacial Reactions Between Sn-Based Solders and Ni
|
Wang, Chao-Hong
|
|
2016
|
45 |
12 |
p. 6200-6207
|
artikel
|
| 10 |
Effects of Substrate and Post-Growth Treatments on the Microstructure and Properties of ZnO Thin Films Prepared by Atomic Layer Deposition
|
Haseman, Micah
|
|
2016
|
45 |
12 |
p. 6337-6345
|
artikel
|
| 11 |
Efficient and Robust Thermoelectric Power Generation Device Using Hot-Pressed Metal Contacts on Nanostructured Half-Heusler Alloys
|
Joshi, Giri
|
|
2016
|
45 |
12 |
p. 6047-6051
|
artikel
|
| 12 |
Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects
|
Tsou, Chia-Hung
|
|
2016
|
45 |
12 |
p. 6123-6129
|
artikel
|
| 13 |
Electromigration Behaviors of Cu Reinforced Sn-3.5Ag Composite Solder Joints
|
Wang, Yan
|
|
2016
|
45 |
12 |
p. 6095-6101
|
artikel
|
| 14 |
Enhanced Thermoelectric Properties of p-type Bi0.5Sb1.5Te3 Thermoelectric Materials by Mechanical Alloying and Spark Plasma Sintering
|
Madavali, Babu
|
|
2016
|
45 |
12 |
p. 6059-6066
|
artikel
|
| 15 |
Fourier Transform Infrared Spectroscopy Measurements of Multi-phonon and Free-Carrier Absorption in ZnO
|
Saadatkia, Pooneh
|
|
2016
|
45 |
12 |
p. 6329-6336
|
artikel
|
| 16 |
Growth and Characterization of Single Crystalline InN Grown on GaN by RF Sputtering for Robust Schottky Contacts
|
Harotoonian, Vache
|
|
2016
|
45 |
12 |
p. 6305-6309
|
artikel
|
| 17 |
Growth and Implementation of Carbon-Doped AlGaN Layers for Enhancement-Mode HEMTs on 200 mm Si Substrates
|
Su, Jie
|
|
2016
|
45 |
12 |
p. 6346-6354
|
artikel
|
| 18 |
Growth of ErAs Nanoparticles by Pulsed Laser Ablation in an Inert Environment
|
Lewis, Matthew
|
|
2016
|
45 |
12 |
p. 6247-6250
|
artikel
|
| 19 |
Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance
|
Lee, Tae-Kyu
|
|
2016
|
45 |
12 |
p. 6177-6183
|
artikel
|
| 20 |
Improved High-Energy Response of AlGaAs/GaAs Solar Cells Using a Low-Cost Technology
|
Noorzad, Camron D.
|
|
2016
|
45 |
12 |
p. 6317-6322
|
artikel
|
| 21 |
Influence of Carbon in Metalorganic Chemical Vapor Deposition of Few-Layer WSe2 Thin Films
|
Zhang, Xiaotian
|
|
2016
|
45 |
12 |
p. 6273-6279
|
artikel
|
| 22 |
Influence of Li Addition to Zn-Al Alloys on Cu Substrate During Spreading Test and After Aging Treatment
|
Gancarz, Tomasz
|
|
2016
|
45 |
12 |
p. 6067-6078
|
artikel
|
| 23 |
In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits
|
Huang, Y. T.
|
|
2016
|
45 |
12 |
p. 6163-6170
|
artikel
|
| 24 |
Investigation of Surface Defects in AlInSb Metamorphic Buffer (MB) Grown on GaSb
|
Addamane, Sadhvikas
|
|
2016
|
45 |
12 |
p. 6258-6264
|
artikel
|
| 25 |
LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System
|
Tang, Y. K.
|
|
2016
|
45 |
12 |
p. 6171-6176
|
artikel
|
| 26 |
MgO/Cu2O Superlattices: Growth of Epitaxial Two-Dimensional Nanostructures
|
Yang, M. J.
|
|
2016
|
45 |
12 |
p. 6285-6291
|
artikel
|
| 27 |
Molecular Beam Epitaxy Growth of High Crystalline Quality LiNbO3
|
Tellekamp, M. Brooks
|
|
2016
|
45 |
12 |
p. 6292-6299
|
artikel
|
| 28 |
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles
|
Yakymovych, A.
|
|
2016
|
45 |
12 |
p. 6143-6149
|
artikel
|
| 29 |
Optical and Electrical Study of Defects in GaN In Situ Doped with Eu3+ Ion Grown by OMVPE
|
Wang, Jingzhou
|
|
2016
|
45 |
12 |
p. 6355-6362
|
artikel
|
| 30 |
Pd and Au Contacts to SnS: Thermodynamic Predictions and Annealing Study
|
Gurunathan, Ramya L.
|
|
2016
|
45 |
12 |
p. 6300-6304
|
artikel
|
| 31 |
Phase Equilibria of the Fe-Ni-Sn Ternary System at 270°C
|
Huang, Tzu-Ting
|
|
2016
|
45 |
12 |
p. 6208-6213
|
artikel
|
| 32 |
Phase-Field Modeling of Grain-Boundary Grooving Under Electromigration
|
Mukherjee, Arnab
|
|
2016
|
45 |
12 |
p. 6233-6246
|
artikel
|
| 33 |
Probing Phase Transformations and Microstructural Evolutions at the Small Scales: Synchrotron X-ray Microdiffraction for Advanced Applications in 3D IC (Integrated Circuits) and Solar PV (Photovoltaic) Devices
|
Radchenko, I.
|
|
2016
|
45 |
12 |
p. 6222-6232
|
artikel
|
| 34 |
Structural and Optical Characteristics of GeSn Quantum Wells for Silicon-Based Mid-Infrared Optoelectronic Applications
|
Dou, Wei
|
|
2016
|
45 |
12 |
p. 6265-6272
|
artikel
|
| 35 |
Study of High-Quality GeSn Alloys Grown by Chemical Vapor Deposition towards Mid-Infrared Applications
|
Al-Kabi, Sattar
|
|
2016
|
45 |
12 |
p. 6251-6257
|
artikel
|
| 36 |
Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates
|
Liu, C. Y.
|
|
2016
|
45 |
12 |
p. 6079-6085
|
artikel
|
| 37 |
Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock
|
Han, Jing
|
|
2016
|
45 |
12 |
p. 6086-6094
|
artikel
|
| 38 |
The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire
|
Huang, Wei-Hsiang
|
|
2016
|
45 |
12 |
p. 6130-6136
|
artikel
|
| 39 |
Thin-Film Photoluminescent Properties and the Atomistic Model of Mg2TiO4 as a Non-rare Earth Matrix Material for Red-Emitting Phosphor
|
Huang, Chieh-Szu
|
|
2016
|
45 |
12 |
p. 6214-6221
|
artikel
|
| 40 |
Thin Film Transistors Using Wafer-Scale Low-Temperature MOCVD WSe2
|
Gong, Yiyang
|
|
2016
|
45 |
12 |
p. 6280-6284
|
artikel
|
| 41 |
Ultra-low Contact Resistivity of PtHf Silicide Utilizing Dopant Segregation Process
|
Ohmi, Shun-ichiro
|
|
2016
|
45 |
12 |
p. 6323-6328
|
artikel
|
Tijdschrift beschrijving