nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Branched Beam-Based Vibration Energy Harvester
|
Zhang, Guangcheng |
|
2014 |
43 |
11 |
p. 3912-3921 |
artikel |
2 |
Abrasive-Free Chemical Mechanical Polishing of Hard Disk Substrate with Cumene Hydroperoxide-H2O2 Slurry
|
Jiang, Ting |
|
2014 |
43 |
11 |
p. 4186-4192 |
artikel |
3 |
Achieving Both High d33 and High Qm for the Pb(Zr0.26Sn0.26Ti0.48)1−xFexO3−x/2 Ternary System for Usein High-Power Ultrasonic Transducers
|
Xing, Zhuo |
|
2014 |
43 |
11 |
p. 3905-3911 |
artikel |
4 |
Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films
|
Choi, Yongwon |
|
2014 |
43 |
11 |
p. 4214-4223 |
artikel |
5 |
An RDL UBM Structural Design for Solving Ultralow-K Delamination Problem of Cu Pillar Bump Flip Chip BGA Packaging
|
Chen, K. M. |
|
2014 |
43 |
11 |
p. 4229-4240 |
artikel |
6 |
Black Pad Susceptibility of the Electroless Ni Films on the Cu UBM
|
Kim, J.H. |
|
2014 |
43 |
11 |
p. 4335-4343 |
artikel |
7 |
Carbon-Incorporated Amorphous Indium Zinc Oxide Thin-Film Transistors
|
Parthiban, S. |
|
2014 |
43 |
11 |
p. 4224-4228 |
artikel |
8 |
Characterization of CdS Nanowires Self-Assembled in a Nanoporous Alumina Template
|
Poduri, Shripriya |
|
2014 |
43 |
11 |
p. 3979-3983 |
artikel |
9 |
Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process
|
Lee, Seung-Woo |
|
2014 |
43 |
11 |
p. 4246-4254 |
artikel |
10 |
Density, Electrical and Optical Properties of Yttrium-Containing Tellurium Bismuth Borate Glasses
|
Shaaban, M. H. |
|
2014 |
43 |
11 |
p. 4023-4032 |
artikel |
11 |
Design, Modeling, Fabrication, and Evaluation of Thermoelectric Generators with Hot-Wire Chemical Vapor Deposited Polysilicon as Thermoelement Material
|
de Leon, Maria Theresa |
|
2014 |
43 |
11 |
p. 4070-4081 |
artikel |
12 |
Design of Dual-Junction Three-Terminal CdTe/InGaAs Solar Cells
|
Alshkeili, Sara |
|
2014 |
43 |
11 |
p. 4344-4348 |
artikel |
13 |
Design of Polarization- and Incident Angle-Independent Perfect Metamaterial Absorber with Interference Theory
|
Dincer, Furkan |
|
2014 |
43 |
11 |
p. 3949-3953 |
artikel |
14 |
Development of Polyaniline Using Electrochemical Technique for Plugging Pinholes in Cadmium Sulfide/Cadmium Telluride Solar Cells
|
Abdul-Manaf, N. A. |
|
2014 |
43 |
11 |
p. 4003-4010 |
artikel |
15 |
Effective Permittivity and Refractive Index of TiO2/Ge and SiO2/Ge Nanostructures at High Frequencies
|
Sadeghi, H. |
|
2014 |
43 |
11 |
p. 4294-4300 |
artikel |
16 |
Effect of Excess Li Content on the Microwave Dielectric Properties of the M-Phase of Li2O-Nb2O5-TiO2 Ceramics
|
Li, Enzhu |
|
2014 |
43 |
11 |
p. 3954-3958 |
artikel |
17 |
Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn–Ag–Cu and Sn–Ag Solder Interconnects With and Without Board-Side Ni Surface Finish
|
Lee, Tae-Kyu |
|
2014 |
43 |
11 |
p. 4126-4133 |
artikel |
18 |
Effect of Sprayed Solution Flow Rate on the Physical Properties of Anatase TiO2 Thin Films
|
Naffouti, Wafa |
|
2014 |
43 |
11 |
p. 4033-4040 |
artikel |
19 |
Effects of Carbon Coating on Microstructure and Dielectric Properties of CaCu3Ti4O12
|
Wang, Mao-Hua |
|
2014 |
43 |
11 |
p. 4322-4326 |
artikel |
20 |
Effects of In and Ni Addition on Microstructure of Sn-58BiSolder Joint
|
Mokhtari, Omid |
|
2014 |
43 |
11 |
p. 4158-4170 |
artikel |
21 |
Effects of Rapid Thermal Annealing on Electrical Transport in Heavily Doped ZnO Thin Films Deposited at Different Substrate Temperatures
|
Zhu, Ke |
|
2014 |
43 |
11 |
p. 3973-3978 |
artikel |
22 |
Effects of Substrate Temperature on the Microstructureand Morphology of CdZnTe Thin Films
|
Malkas, Hasan |
|
2014 |
43 |
11 |
p. 4011-4017 |
artikel |
23 |
Effects of Ta2O5/Y2O3 Codoping on the Microstructure and Microwave Dielectric Properties of Ba(Co0.56Zn0.40)1/3Nb2/3O3 Ceramics
|
Bin, Tang |
|
2014 |
43 |
11 |
p. 3959-3964 |
artikel |
24 |
Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders
|
Zhao, Xu |
|
2014 |
43 |
11 |
p. 4179-4185 |
artikel |
25 |
Electromigration Induced Break-up Phenomena in Liquid Metal Printed Thin Films
|
Ma, Rongchao |
|
2014 |
43 |
11 |
p. 4255-4261 |
artikel |
26 |
Electronic Structure and Lattice Dynamics of BaCeO3 Compound in Cubic Phase
|
Aycibin, Murat |
|
2014 |
43 |
11 |
p. 4301-4307 |
artikel |
27 |
Electron Paramagnetic Resonance and Photoluminescence Studies of LaMgAl11O19:Mn2+ Green Phosphors
|
Singh, Vijay |
|
2014 |
43 |
11 |
p. 4041-4047 |
artikel |
28 |
Elemental Compositions of Over 80 Cell Phones
|
Christian, Beverley |
|
2014 |
43 |
11 |
p. 4199-4213 |
artikel |
29 |
Fabrication of Relaxer-Based Piezoelectric Energy Harvesters Using a Sacrificial Poly-Si Seeding Layer
|
Fuentes-Fernandez, E. M. A. |
|
2014 |
43 |
11 |
p. 3898-3904 |
artikel |
30 |
Formation of a Metastable Phase at the Interface Between Sn and Ag–Pd Substrates During Liquid-State Reaction
|
Lin, Hsin-fu |
|
2014 |
43 |
11 |
p. 4275-4281 |
artikel |
31 |
Hall Effect Studies of AlGaAs Grown by Liquid-Phase Epitaxy for Tandem Solar Cell Applications
|
Zhao, Xin |
|
2014 |
43 |
11 |
p. 3999-4002 |
artikel |
32 |
IMC Growth at the Interface of Sn–2.0Ag–2.5Zn Solder Joints with Cu, Ni, and Ni–W Substrates
|
Liang, Jiaxing |
|
2014 |
43 |
11 |
p. 4119-4125 |
artikel |
33 |
Impact of Ni Concentration on the Performance of Ni Silicide/HfO2/TiN Resistive RAM (RRAM) Cells
|
Chen, Z.X. |
|
2014 |
43 |
11 |
p. 4193-4198 |
artikel |
34 |
Impact of Tellurium Precipitates in CdZnTe Substrates on MBE HgCdTe Deposition
|
Benson, J. D. |
|
2014 |
43 |
11 |
p. 3993-3998 |
artikel |
35 |
Influence of Oxygen Pressure on the Properties of Ni-Mn-Zn Ferrite Films on Silicon Substrate
|
Qian, Y. W. |
|
2014 |
43 |
11 |
p. 4289-4293 |
artikel |
36 |
Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits
|
Shih, W. L. |
|
2014 |
43 |
11 |
p. 4262-4265 |
artikel |
37 |
Interface Reaction Between Electroless Ni–Sn–P Metallization and Lead-Free Sn–3.5Ag Solder with Suppressed Ni3P Formation
|
Yang, Ying |
|
2014 |
43 |
11 |
p. 4103-4110 |
artikel |
38 |
Interface States of Fe3O4/Si Interfacial Structure and Effectof Magnetic Field
|
Ghosh, Surajit |
|
2014 |
43 |
11 |
p. 4357-4363 |
artikel |
39 |
Interfacial Reaction Between Nb Foil and n-Type PbTe Thermoelectric Materials During Thermoelectric Contact Fabrication
|
Xia, Haiyang |
|
2014 |
43 |
11 |
p. 4064-4069 |
artikel |
40 |
Investigating the Exchange-Coupling Interactionin Nanostructure Composite Particles of SrFe12O19and ZnFe2O4
|
Mehdipour, M. |
|
2014 |
43 |
11 |
p. 4282-4288 |
artikel |
41 |
Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps
|
Lin, Jui-Ching |
|
2014 |
43 |
11 |
p. 4134-4145 |
artikel |
42 |
Lattice Thermal Conductivity Reduction Due to In Situ-Generated Nano-Phase in Bi0.4Sb1.6Te3 Alloys by Microwave-Activated Hot Pressing
|
Yang, Fan |
|
2014 |
43 |
11 |
p. 4327-4334 |
artikel |
43 |
Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni
|
Hammad, A.E. |
|
2014 |
43 |
11 |
p. 4146-4157 |
artikel |
44 |
Mechanical Properties of Lead-Free Solder Joints Under High-Speed Shear Impact Loading
|
Nguyen, Van Luong |
|
2014 |
43 |
11 |
p. 4171-4178 |
artikel |
45 |
Nanoscale Investigation of Grain Growth in RF-Sputtered Indium Tin Oxide Thin Films by Scanning Probe Microscopy
|
Lamsal, B. S. |
|
2014 |
43 |
11 |
p. 3965-3972 |
artikel |
46 |
Phase Equilibria of the Sn-Ni-V System at 800°C
|
Wu, Changjun |
|
2014 |
43 |
11 |
p. 4111-4118 |
artikel |
47 |
Photoassisted Chemically Deposited Tin Sulfide Thin Films Based on Two Different Chemical Formulations
|
Remadevi, T. L. |
|
2014 |
43 |
11 |
p. 3984-3992 |
artikel |
48 |
Preparation, Infrared Emissivity, and Dielectric and Microwave Absorption Properties of Fe-Doped ZnO Powder
|
Su, Xiaolei |
|
2014 |
43 |
11 |
p. 3942-3948 |
artikel |
49 |
Properties of p- and n-Type PbTe Microwires for Thermoelectric Devices
|
Bhatta, Rudra P. |
|
2014 |
43 |
11 |
p. 4056-4063 |
artikel |
50 |
Review of Capabilities of the ENEPIG Surface Finish
|
Ratzker, Menahem |
|
2014 |
43 |
11 |
p. 3885-3897 |
artikel |
51 |
Role of Zinc Source in Chemical Bath Deposition of Zinc Sulfide Thin Films on Si3N4
|
Luque, P. A. |
|
2014 |
43 |
11 |
p. 4317-4321 |
artikel |
52 |
Sensor Performance of Nanostructured TiO2–Cr2O3 Thin Films Derived by a Particulate Sol–Gel Route with Various Cr:Ti Molar Ratios
|
Mohammadi, M.R. |
|
2014 |
43 |
11 |
p. 3922-3932 |
artikel |
53 |
Statistical Parameters Effects on Photocatalytic Degradation of Rhodamine 6G Dye with Hexagonal Zinc Oxide Nanorods Synthesized via Solution Process
|
Wahab, Rizwan |
|
2014 |
43 |
11 |
p. 4266-4274 |
artikel |
54 |
Structural and Electrical Properties of TaaxLa(1−a)xOy Thin Films
|
Khorshidi, Zahra |
|
2014 |
43 |
11 |
p. 4349-4356 |
artikel |
55 |
Study of Shallow Backside Junctions for Backside Illumination of CMOS Image Sensors
|
Choi, Chung Seok |
|
2014 |
43 |
11 |
p. 3933-3941 |
artikel |
56 |
Synthesis and Characterization of the 25Ga2S3-(75 − x)GeS2-xCsCl System for Engineering a Chemically Stable, Mid-IR Transparent Glass
|
Seo, Inseok |
|
2014 |
43 |
11 |
p. 4018-4022 |
artikel |
57 |
Synthesis and Thermoelectric Properties of Yb-doped Ca0.9−xYbxLa0.1MnO3 Ceramics
|
Zhang, Bo |
|
2014 |
43 |
11 |
p. 4048-4055 |
artikel |
58 |
The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading
|
Mattila, Toni T. |
|
2014 |
43 |
11 |
p. 4090-4102 |
artikel |
59 |
Thermodynamic Re-modeling of the Sb-Te System Using Associate and Ionic Models
|
Guo, Cuiping |
|
2014 |
43 |
11 |
p. 4082-4089 |
artikel |
60 |
The Role of Silver in Mitigation of Whisker Formation on Thin Tin Films
|
Stein, J. |
|
2014 |
43 |
11 |
p. 4308-4316 |
artikel |
61 |
Zinc Oxide Thin-Film Transistors Fabricated at Low Temperature by Chemical Spray Pyrolysis
|
Jeong, Yesul |
|
2014 |
43 |
11 |
p. 4241-4245 |
artikel |