| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A New Nonlinear Optically Active Donor–Acceptor-Type Conjugated Polymer: Synthesis and Electrochemical and Optical Characterization
|
Manjunatha, M. G.
|
|
2010
|
39 |
12 |
p. 2711-2719
|
artikel
|
| 2 |
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface
|
Zhou, Bite
|
|
2010
|
39 |
12 |
p. 2669-2679
|
artikel
|
| 3 |
Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints
|
Wu, W. H.
|
|
2010
|
39 |
12 |
p. 2653-2661
|
artikel
|
| 4 |
Discussion on the Mechanism of Electromigration from the Perspective of Electromagnetism
|
Zhou, Peng
|
|
2010
|
39 |
12 |
p. 2583-2587
|
artikel
|
| 5 |
Effect of DC Current on the Creep Deformation of Tin
|
Chen, Rong
|
|
2010
|
39 |
12 |
p. 2611-2617
|
artikel
|
| 6 |
Effects of Minor Ni Doping on Microstructural Variationsand Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu-xNi/Au/Ni Sandwich Structures
|
Yu, Chi-Yang
|
|
2010
|
39 |
12 |
p. 2544-2552
|
artikel
|
| 7 |
Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders
|
Wang, Y. W.
|
|
2010
|
39 |
12 |
p. 2636-2642
|
artikel
|
| 8 |
Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability
|
Sakurai, Hitoshi
|
|
2010
|
39 |
12 |
p. 2598-2604
|
artikel
|
| 9 |
Electromigration in Sn-Bi Modified with Polyhedral Oligomeric Silsesquioxane
|
Zhang, Ruihong
|
|
2010
|
39 |
12 |
p. 2513-2521
|
artikel
|
| 10 |
Empirical Study of Hall Bars on Few-Layer Grapheneon C-Face 4H-SiC
|
Bolen, M. L.
|
|
2010
|
39 |
12 |
p. 2696-2701
|
artikel
|
| 11 |
Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl4-Na2SO3 Electroplating Solutions for Pb-Free Solder Packaging
|
Dalili, Neda
|
|
2010
|
39 |
12 |
p. 2680
|
artikel
|
| 12 |
Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies
|
|
|
2010
|
39 |
12 |
p. 2503
|
artikel
|
| 13 |
Formation and Growth of Intermetallic Compound Cu6Sn5 at Early Stages in Lead-Free Soldering
|
Park, M.S.
|
|
2010
|
39 |
12 |
p. 2574-2582
|
artikel
|
| 14 |
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects
|
Lee, Tae-Kyu
|
|
2010
|
39 |
12 |
p. 2564-2573
|
artikel
|
| 15 |
Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C
|
Wang, Kai-Jheng
|
|
2010
|
39 |
12 |
p. 2558-2563
|
artikel
|
| 16 |
Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer
|
Chang, C.C.
|
|
2010
|
39 |
12 |
p. 2662-2668
|
artikel
|
| 17 |
Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging
|
Tseng, Chien-Fu
|
|
2010
|
39 |
12 |
p. 2522-2527
|
artikel
|
| 18 |
Investigation and Effects of Wafer Bow in 3D Integration Bonding Schemes
|
Chen, K. N.
|
|
2010
|
39 |
12 |
p. 2605-2610
|
artikel
|
| 19 |
Investigation of Trap States in AlInN/AlN/GaN Heterostructures by Frequency-Dependent Admittance Analysis
|
Arslan, Engin
|
|
2010
|
39 |
12 |
p. 2681-2686
|
artikel
|
| 20 |
Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates
|
Kim, Young Min
|
|
2010
|
39 |
12 |
p. 2504-2512
|
artikel
|
| 21 |
Magnetic Silver-Coated Ferrite Nanoparticles and Their Application in Thick Films
|
Liu, Jianguo
|
|
2010
|
39 |
12 |
p. 2702-2710
|
artikel
|
| 22 |
Microstructural Variation and Phase Evolution in the Reaction of Sn-xAg-Cu Solders and Cu-yZn Substrates During Reflow
|
Yu, Chi-Yang
|
|
2010
|
39 |
12 |
p. 2627-2635
|
artikel
|
| 23 |
Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu SubstrateDue to a Minor Addition of Ni
|
Harcuba, Petr
|
|
2010
|
39 |
12 |
p. 2553-2557
|
artikel
|
| 24 |
Morphological Stability of Diffusion Couples Under Electric Current
|
Leo, Perry
|
|
2010
|
39 |
12 |
p. 2687-2695
|
artikel
|
| 25 |
Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C
|
Chang, Jaewon
|
|
2010
|
39 |
12 |
p. 2643-2652
|
artikel
|
| 26 |
Reactions of Sn-3.5Ag-Based Solders Containing Zn and Al Additions on Cu and Ni(P) Substrates
|
Kotadia, H. R.
|
|
2010
|
39 |
12 |
p. 2720-2731
|
artikel
|
| 27 |
Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy
|
Lee, Tae-Kyu
|
|
2010
|
39 |
12 |
p. 2588-2597
|
artikel
|
| 28 |
Study of the Impact Performance of Solder Joints by High-Velocity Impact Tests
|
Zhang, Ning
|
|
2010
|
39 |
12 |
p. 2536-2543
|
artikel
|
| 29 |
Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material
|
Chen, Chia-Ju
|
|
2010
|
39 |
12 |
p. 2618-2626
|
artikel
|
| 30 |
Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints
|
Tsai, M. Y.
|
|
2010
|
39 |
12 |
p. 2528-2535
|
artikel
|
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