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Details for article 14 of 30 found articles
| Title: |
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Surface Finish Effects |
| Author: |
Lee, Tae-Kyu Ma, Hongtao Liu, Kuo-Chuan Xue, Jie |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 12 pages 2564-2573 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 30 found articles
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