|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 3 of 30 found articles
| Title: |
Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints |
| Author: |
Wu, W. H. Chung, H. L. Chen, B. Z. Ho, C. E. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 39 (2010) nr. 12 pages 2653-2661 |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 30 found articles
| << previous | next >> |