| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advanced metrology for rapid characterization of the thermal mechanical properties of low-k dielectric and copper thin films
|
Lau, S. H.
|
|
2001
|
30 |
4 |
p. 299-303
|
artikel
|
| 2 |
A model for wafer scale variation of removal rate in chemical mechanical polishing based on elastic pad deformation
|
Fu, Guanghui
|
|
2001
|
30 |
4 |
p. 400-408
|
artikel
|
| 3 |
Au−Ni−Sn intermetallic phase relationships in eutectic Pb−Sn solder formed on Ni/Au metallization
|
Song, H. G.
|
|
2001
|
30 |
4 |
p. 409-414
|
artikel
|
| 4 |
Barrier layers for Cu ULSI metallization
|
Shacham-Diamand, Yosi
|
|
|
30 |
4 |
p. 336-344
|
artikel
|
| 5 |
Barrier layers for Cu ULSI metallization
|
Shacham-Diamand, Yosi
|
|
2001
|
30 |
4 |
p. 336-344
|
artikel
|
| 6 |
Comparative study on the effect of misalignment on bordered and borderless contacts
|
Huang, J. S.
|
|
2001
|
30 |
4 |
p. 360-366
|
artikel
|
| 7 |
Cu-CMP for dual damascene technology: Prestonian vs. non-prestonian regimes of Cu removal
|
Gotkis, Y.
|
|
2001
|
30 |
4 |
p. 396-399
|
artikel
|
| 8 |
Evaluation of ultra-low-k dielectric materials for advanced interconnects
|
Jin, C.
|
|
|
30 |
4 |
p. 284-289
|
artikel
|
| 9 |
Evaluation of ultra-low-k dielectric materials for advanced interconnects
|
Jin, C.
|
|
2001
|
30 |
4 |
p. 284-289
|
artikel
|
| 10 |
Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials
|
Zhao, J.
|
|
2001
|
30 |
4 |
p. 415-421
|
artikel
|
| 11 |
Foreword
|
Shi, Frank G.
|
|
2001
|
30 |
4 |
p. 283
|
artikel
|
| 12 |
Grain growth simulation of [001] textured YBCO films grown on (001) substrates with large lattice misfit: Prediction of misorientations of the remaining boundaries
|
Tsai, Jack W. H.
|
|
2001
|
30 |
4 |
p. 422-431
|
artikel
|
| 13 |
Influence of oxides on friction during Cu CMP
|
Liang, Hong
|
|
2001
|
30 |
4 |
p. 391-395
|
artikel
|
| 14 |
Interactions between solder and metallization during long-term aging of advanced microelectronic packages
|
Ho, C. E.
|
|
2001
|
30 |
4 |
p. 379-385
|
artikel
|
| 15 |
Local Joule heating and overall resistance increase in void-containing aluminum interconnects
|
Shen, Y. L.
|
|
2001
|
30 |
4 |
p. 367-371
|
artikel
|
| 16 |
Low dielectric constant materials
|
Treichel, H.
|
|
2001
|
30 |
4 |
p. 290-298
|
artikel
|
| 17 |
Material and electrical properties of electroless Ag-W thin film
|
Inberg, A.
|
|
2001
|
30 |
4 |
p. 355-359
|
artikel
|
| 18 |
Material and process challenges in 100 nm interconnects module technology and beyond
|
Ohba, Takayuki
|
|
2001
|
30 |
4 |
p. 314-319
|
artikel
|
| 19 |
Material issues in electronic interconnects and packaging
|
Subramanian, K. N.
|
|
2001
|
30 |
4 |
p. 372-378
|
artikel
|
| 20 |
Microstructural characterization of inlaid copper interconnect lines
|
Besser, Paul R.
|
|
2001
|
30 |
4 |
p. 320-330
|
artikel
|
| 21 |
Microstructural characterization of inlaid copper interconnect lines
|
Besser, Paul R.
|
|
|
30 |
4 |
p. 320-330
|
artikel
|
| 22 |
Microstructure examination of copper wafer bonding
|
Chen, Kuan-Neng
|
|
2001
|
30 |
4 |
p. 331-335
|
artikel
|
| 23 |
Phase equilibria in transition metal Al-Ga-N systems and thermal stability of contacts to AlGaN
|
Schweitz, K. O.
|
|
2001
|
30 |
4 |
p. 445
|
artikel
|
| 24 |
Reduction of photoresist usage during spin coating
|
Chou, Fu-Chu
|
|
2001
|
30 |
4 |
p. 432-438
|
artikel
|
| 25 |
Relaxation of InGaN thin layers observed by X-ray and transmission electron microscopy studies
|
Liliental-Weber, Z.
|
|
2001
|
30 |
4 |
p. 439-444
|
artikel
|
| 26 |
Spontaneous, non-aqueous electrochemical deposition of copper and palladium on Al and Al(Cu) thin films
|
Fang, R.
|
|
2001
|
30 |
4 |
p. 349-354
|
artikel
|
| 27 |
Stress testing of a recrystallizing CaO-B2O3-SiO2 glass-ceramic with Ag electrodes for high frequency electronic packaging
|
Shapiro, Andrew A.
|
|
2001
|
30 |
4 |
p. 386-390
|
artikel
|
| 28 |
Structure and property characterization of low-k dielectric porous thin films
|
Bauer, Barry J.
|
|
2001
|
30 |
4 |
p. 304-308
|
artikel
|
| 29 |
Synthesis and characterization of porous polymeric low dielectric constant films
|
Xu, Yuhuan
|
|
|
30 |
4 |
p. 309-313
|
artikel
|
| 30 |
Synthesis and characterization of porous polymeric low dielectric constant films
|
Xu, Yuhuan
|
|
2001
|
30 |
4 |
p. 309-313
|
artikel
|
| 31 |
TiN and TaN diffusion barriers in copper interconnect technology: Towards a consistent testing methodology
|
Kizil, Huseyin
|
|
2001
|
30 |
4 |
p. 345-348
|
artikel
|
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