nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method
|
Niu, Yuling |
|
2018 |
87 |
C |
p. 81-88 |
artikel |
2 |
Adaptive and robust prediction for the remaining useful life of electrolytic capacitors
|
Qin, Qi |
|
2018 |
87 |
C |
p. 64-74 |
artikel |
3 |
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method
|
Nwanoro, Kenneth Chimezie |
|
2018 |
87 |
C |
p. 1-14 |
artikel |
4 |
An efficient NBTI sensor and compensation circuit for stable and reliable SRAM cells
|
Shah, Ambika Prasad |
|
2018 |
87 |
C |
p. 15-23 |
artikel |
5 |
A new hierarchical belief-rule-based method for reliability evaluation of wireless sensor network
|
He, Wei |
|
2018 |
87 |
C |
p. 33-51 |
artikel |
6 |
Application of expectation maximization and Kalman smoothing for prognosis of lumen maintenance life for light emitting diodes
|
Duong, Pham Luu Trung |
|
2018 |
87 |
C |
p. 206-212 |
artikel |
7 |
A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
|
Bojita, Adrian |
|
2018 |
87 |
C |
p. 142-150 |
artikel |
8 |
Asymmetric resistive switching behaviour in a Au/a-C:Co/Au planar structure
|
Zhang, D. |
|
2018 |
87 |
C |
p. 52-56 |
artikel |
9 |
Editorial Board
|
|
|
2018 |
87 |
C |
p. ii |
artikel |
10 |
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder
|
Lee, Hyunju |
|
2018 |
87 |
C |
p. 75-80 |
artikel |
11 |
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
|
Lofrano, Melina |
|
2018 |
87 |
C |
p. 97-105 |
artikel |
12 |
Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb
|
Hammad, A.E. |
|
2018 |
87 |
C |
p. 133-141 |
artikel |
13 |
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
|
Meier, Karsten |
|
2018 |
87 |
C |
p. 125-132 |
artikel |
14 |
From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application
|
Fan, Peng |
|
2018 |
87 |
C |
p. 271-277 |
artikel |
15 |
Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity
|
Gain, Asit Kumar |
|
2018 |
87 |
C |
p. 278-285 |
artikel |
16 |
Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence
|
Goes, W. |
|
2018 |
87 |
C |
p. 286-320 |
artikel |
17 |
IGBT junction and coolant temperature estimation by thermal model
|
Zhihong, Wu |
|
2018 |
87 |
C |
p. 168-182 |
artikel |
18 |
Impact and mitigation of SRAM read path aging
|
Agbo, Innocent |
|
2018 |
87 |
C |
p. 158-167 |
artikel |
19 |
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
|
Auersperg, J. |
|
2018 |
87 |
C |
p. 238-244 |
artikel |
20 |
Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree
|
Li, Yuanqing |
|
2018 |
87 |
C |
p. 24-32 |
artikel |
21 |
Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs
|
Alexeev, A. |
|
2018 |
87 |
C |
p. 89-96 |
artikel |
22 |
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization
|
Rogié, Brice |
|
2018 |
87 |
C |
p. 222-231 |
artikel |
23 |
New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges
|
Nouguier, D. |
|
2018 |
87 |
C |
p. 106-112 |
artikel |
24 |
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications
|
Nishimoto, Shuji |
|
2018 |
87 |
C |
p. 232-237 |
artikel |
25 |
Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs
|
Zając, Piotr |
|
2018 |
87 |
C |
p. 245-258 |
artikel |
26 |
Performance assessment of the NIRS-based medical system of evaluating therapeutic effect
|
Zhao, Ke |
|
2018 |
87 |
C |
p. 188-193 |
artikel |
27 |
Reliability analysis of an integrated device of ECG, PPG and pressure pulse wave for cardiovascular disease
|
Liu, Weichao |
|
2018 |
87 |
C |
p. 183-187 |
artikel |
28 |
Sensor system optimization to meet reliability targets
|
Granig, Wolfgang |
|
2018 |
87 |
C |
p. 113-124 |
artikel |
29 |
Single-event multiple transients in guard-ring hardened inverter chains of different layout designs
|
Zhao, Wen |
|
2018 |
87 |
C |
p. 151-157 |
artikel |
30 |
Source engineering on ruggedness and RF performance of n-channel RFLDMOS
|
Li, Hao |
|
2018 |
87 |
C |
p. 57-63 |
artikel |
31 |
Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]
|
van Driel, Willem D. |
|
2018 |
87 |
C |
p. 321 |
artikel |
32 |
Temperature effects on BTI and soft errors in modern logic circuits
|
Sootkaneung, W. |
|
2018 |
87 |
C |
p. 259-270 |
artikel |
33 |
Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes over wide temperature range
|
Vigneshwara Raja, P. |
|
2018 |
87 |
C |
p. 213-221 |
artikel |
34 |
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources
|
Codecasa, Lorenzo |
|
2018 |
87 |
C |
p. 194-205 |
artikel |