| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method
|
Niu, Yuling
|
|
2018
|
87 |
C |
p. 81-88
|
article
|
| 2 |
Adaptive and robust prediction for the remaining useful life of electrolytic capacitors
|
Qin, Qi
|
|
2018
|
87 |
C |
p. 64-74
|
article
|
| 3 |
An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method
|
Nwanoro, Kenneth Chimezie
|
|
2018
|
87 |
C |
p. 1-14
|
article
|
| 4 |
An efficient NBTI sensor and compensation circuit for stable and reliable SRAM cells
|
Shah, Ambika Prasad
|
|
2018
|
87 |
C |
p. 15-23
|
article
|
| 5 |
A new hierarchical belief-rule-based method for reliability evaluation of wireless sensor network
|
He, Wei
|
|
2018
|
87 |
C |
p. 33-51
|
article
|
| 6 |
Application of expectation maximization and Kalman smoothing for prognosis of lumen maintenance life for light emitting diodes
|
Duong, Pham Luu Trung
|
|
2018
|
87 |
C |
p. 206-212
|
article
|
| 7 |
A simple metal-semiconductor substructure for the advanced thermo-mechanical numerical modeling of the power integrated circuits
|
Bojita, Adrian
|
|
2018
|
87 |
C |
p. 142-150
|
article
|
| 8 |
Asymmetric resistive switching behaviour in a Au/a-C:Co/Au planar structure
|
Zhang, D.
|
|
2018
|
87 |
C |
p. 52-56
|
article
|
| 9 |
Editorial Board
|
|
|
2018
|
87 |
C |
p. ii
|
article
|
| 10 |
Effect of solder resist dissolution on the joint reliability of ENIG surface and Sn–Ag–Cu solder
|
Lee, Hyunju
|
|
2018
|
87 |
C |
p. 75-80
|
article
|
| 11 |
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly
|
Lofrano, Melina
|
|
2018
|
87 |
C |
p. 97-105
|
article
|
| 12 |
Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu lead-free solder by adding trace amount of elements Ni and Sb
|
Hammad, A.E.
|
|
2018
|
87 |
C |
p. 133-141
|
article
|
| 13 |
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
|
Meier, Karsten
|
|
2018
|
87 |
C |
p. 125-132
|
article
|
| 14 |
From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application
|
Fan, Peng
|
|
2018
|
87 |
C |
p. 271-277
|
article
|
| 15 |
Growth nature of in-situ Cu6Sn5-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity
|
Gain, Asit Kumar
|
|
2018
|
87 |
C |
p. 278-285
|
article
|
| 16 |
Identification of oxide defects in semiconductor devices: A systematic approach linking DFT to rate equations and experimental evidence
|
Goes, W.
|
|
2018
|
87 |
C |
p. 286-320
|
article
|
| 17 |
IGBT junction and coolant temperature estimation by thermal model
|
Zhihong, Wu
|
|
2018
|
87 |
C |
p. 168-182
|
article
|
| 18 |
Impact and mitigation of SRAM read path aging
|
Agbo, Innocent
|
|
2018
|
87 |
C |
p. 158-167
|
article
|
| 19 |
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor
|
Auersperg, J.
|
|
2018
|
87 |
C |
p. 238-244
|
article
|
| 20 |
Modeling and analysis of single-event transient sensitivity of a 65 nm clock tree
|
Li, Yuanqing
|
|
2018
|
87 |
C |
p. 24-32
|
article
|
| 21 |
Multiple heat path dynamic thermal compact modeling for silicone encapsulated LEDs
|
Alexeev, A.
|
|
2018
|
87 |
C |
p. 89-96
|
article
|
| 22 |
Multi-port dynamic compact thermal models of dual-chip package using model order reduction and metaheuristic optimization
|
Rogié, Brice
|
|
2018
|
87 |
C |
p. 222-231
|
article
|
| 23 |
New NBTI models for degradation and relaxation kinetics valid over extended temperature and stress/recovery ranges
|
Nouguier, D.
|
|
2018
|
87 |
C |
p. 106-112
|
article
|
| 24 |
Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications
|
Nishimoto, Shuji
|
|
2018
|
87 |
C |
p. 232-237
|
article
|
| 25 |
Novel thermal model of microchannel cooling system designed for fast simulation of liquid-cooled ICs
|
Zając, Piotr
|
|
2018
|
87 |
C |
p. 245-258
|
article
|
| 26 |
Performance assessment of the NIRS-based medical system of evaluating therapeutic effect
|
Zhao, Ke
|
|
2018
|
87 |
C |
p. 188-193
|
article
|
| 27 |
Reliability analysis of an integrated device of ECG, PPG and pressure pulse wave for cardiovascular disease
|
Liu, Weichao
|
|
2018
|
87 |
C |
p. 183-187
|
article
|
| 28 |
Sensor system optimization to meet reliability targets
|
Granig, Wolfgang
|
|
2018
|
87 |
C |
p. 113-124
|
article
|
| 29 |
Single-event multiple transients in guard-ring hardened inverter chains of different layout designs
|
Zhao, Wen
|
|
2018
|
87 |
C |
p. 151-157
|
article
|
| 30 |
Source engineering on ruggedness and RF performance of n-channel RFLDMOS
|
Li, Hao
|
|
2018
|
87 |
C |
p. 57-63
|
article
|
| 31 |
Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]
|
van Driel, Willem D.
|
|
2018
|
87 |
C |
p. 321
|
article
|
| 32 |
Temperature effects on BTI and soft errors in modern logic circuits
|
Sootkaneung, W.
|
|
2018
|
87 |
C |
p. 259-270
|
article
|
| 33 |
Thermal annealing studies in epitaxial 4H-SiC Schottky barrier diodes over wide temperature range
|
Vigneshwara Raja, P.
|
|
2018
|
87 |
C |
p. 213-221
|
article
|
| 34 |
Versatile MOR-based boundary condition independent compact thermal models with multiple heat sources
|
Codecasa, Lorenzo
|
|
2018
|
87 |
C |
p. 194-205
|
article
|
Journal description