| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A cloud model-based method for the analysis of accelerated life test data
|
Zhang, Wenjin
|
|
2015
|
55 |
1 |
p. 123-128
6 p.
|
artikel
|
| 2 |
An advanced area scaling approach for semiconductor burn-in
|
Kurz, Daniel
|
|
2015
|
55 |
1 |
p. 129-137
9 p.
|
artikel
|
| 3 |
An analytical avalanche breakdown model for double gate MOSFET
|
Cho, Edward Namkyu
|
|
2015
|
55 |
1 |
p. 38-41
4 p.
|
artikel
|
| 4 |
Call for Papers: Reliability Issues in Power Electronics
|
|
|
2015
|
55 |
1 |
p. 292-
1 p.
|
artikel
|
| 5 |
Characterizing, modeling, and analyzing soft error propagation in asynchronous and synchronous digital circuits
|
Bany Hamad, Ghaith
|
|
2015
|
55 |
1 |
p. 238-250
13 p.
|
artikel
|
| 6 |
Compact failure modeling for devices subject to electrostatic discharge stresses – A review pertinent to CMOS reliability simulation
|
Miao, Meng
|
|
2015
|
55 |
1 |
p. 15-23
9 p.
|
artikel
|
| 7 |
Copper wire bonding package decapsulation using the anodic protection method
|
Endoh, Hirohiko
|
|
2015
|
55 |
1 |
p. 207-212
6 p.
|
artikel
|
| 8 |
Corrigendum to “Junction temperature management of IGBT module in power electronic converters” [Microelectron. Reliab. 54 (2014) 2788–2795]
|
Zhou, Luowei
|
|
2015
|
55 |
1 |
p. 291-
1 p.
|
artikel
|
| 9 |
Crosstalk noise modeling of multiwall carbon nanotube (MWCNT) interconnects using finite-difference time-domain (FDTD) technique
|
Ramesh Kumar, Vobulapuram
|
|
2015
|
55 |
1 |
p. 155-163
9 p.
|
artikel
|
| 10 |
CSAM: A clock skew-aware aging mitigation technique
|
Eghbalkhah, Behzad
|
|
2015
|
55 |
1 |
p. 282-290
9 p.
|
artikel
|
| 11 |
Deposition of Fe3O4 on oxidized activated carbon by hydrazine reducing method for high performance supercapacitor
|
Oh, Ilgeun
|
|
2015
|
55 |
1 |
p. 114-122
9 p.
|
artikel
|
| 12 |
Effects of different test profiles of temperature cycling tests on the reliability of RFID tags
|
Lahokallio, Sanna
|
|
2015
|
55 |
1 |
p. 93-100
8 p.
|
artikel
|
| 13 |
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps
|
Meinshausen, L.
|
|
2015
|
55 |
1 |
p. 192-200
9 p.
|
artikel
|
| 14 |
Empirical prediction model for Li/SOCl2 cells based on the accelerated degradation test
|
Cheng, Sijie
|
|
2015
|
55 |
1 |
p. 101-106
6 p.
|
artikel
|
| 15 |
Equivalent circuit modeling of the bistable conduction characteristics in electroformed thin dielectric films
|
Blasco, J.
|
|
2015
|
55 |
1 |
p. 1-14
14 p.
|
artikel
|
| 16 |
Equivalent mechanical properties of through silicon via interposers – A unit model approach
|
Chen, Cheng-fu
|
|
2015
|
55 |
1 |
p. 221-230
10 p.
|
artikel
|
| 17 |
Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications
|
Msolli, S.
|
|
2015
|
55 |
1 |
p. 164-171
8 p.
|
artikel
|
| 18 |
Exploiting component dependency for accurate and efficient soft error analysis via Probabilistic Graphical Models
|
Jiao, Jiajia
|
|
2015
|
55 |
1 |
p. 251-263
13 p.
|
artikel
|
| 19 |
Fast power cycling protocols implemented in an automated test bench dedicated to IGBT module ageing
|
Forest, Francois
|
|
2015
|
55 |
1 |
p. 81-92
12 p.
|
artikel
|
| 20 |
Genetic algorithms for defect detection of flip chips
|
Su, Lei
|
|
2015
|
55 |
1 |
p. 213-220
8 p.
|
artikel
|
| 21 |
High performance SOI CMOS pixel sensor with surrounding N+ trench electrode
|
Hu, Hai-fan
|
|
2015
|
55 |
1 |
p. 42-47
6 p.
|
artikel
|
| 22 |
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability
|
Jablonski, M.
|
|
2015
|
55 |
1 |
p. 143-154
12 p.
|
artikel
|
| 23 |
Inside front cover - Editorial board
|
|
|
2015
|
55 |
1 |
p. IFC-
1 p.
|
artikel
|
| 24 |
Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test
|
Lin, Hsiu-Min
|
|
2015
|
55 |
1 |
p. 231-237
7 p.
|
artikel
|
| 25 |
Low-power fault-tolerant interconnect method based on LCDMA and duplication
|
Nikolic, Tatjana
|
|
2015
|
55 |
1 |
p. 272-281
10 p.
|
artikel
|
| 26 |
Modelling and IR measurement of the electronic substrate thermal conductivity
|
De Mey, G.
|
|
2015
|
55 |
1 |
p. 138-142
5 p.
|
artikel
|
| 27 |
More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
|
Ly, Nhat
|
|
2015
|
55 |
1 |
p. 201-206
6 p.
|
artikel
|
| 28 |
Node-to-node error sensitivity analysis using a graph based approach for VLSI logic circuits
|
Hamiyati Vaghef, Vahid
|
|
2015
|
55 |
1 |
p. 264-271
8 p.
|
artikel
|
| 29 |
N2O treatment enhancement-mode InAlN/GaN HEMTs with HfZrO2 High-k insulator
|
Chiu, Hsien-Chin
|
|
2015
|
55 |
1 |
p. 48-51
4 p.
|
artikel
|
| 30 |
PBGA packaging reliability assessments under random vibrations for space applications
|
Kim, Yeong K.
|
|
2015
|
55 |
1 |
p. 172-179
8 p.
|
artikel
|
| 31 |
Process and temperature robust voltage multiplier design for RF energy harvesting
|
Yuan, J.S.
|
|
2015
|
55 |
1 |
p. 107-113
7 p.
|
artikel
|
| 32 |
Raman spectroscopic assessments of structural orientation and residual stress in wurtzitic AlN film deposited on (001) Si
|
Zhu, Wenliang
|
|
2015
|
55 |
1 |
p. 66-73
8 p.
|
artikel
|
| 33 |
Reliability impacts of high-speed 3-bit/cell Schottky barrier nanowire charge-trapping memories
|
Chang, Wei
|
|
2015
|
55 |
1 |
p. 74-80
7 p.
|
artikel
|
| 34 |
Reliability investigation of light-emitting diodes via low frequency noise characteristics
|
Pralgauskaitė, Sandra
|
|
2015
|
55 |
1 |
p. 52-61
10 p.
|
artikel
|
| 35 |
Short-channel effect and device design of extremely scaled tunnel field-effect transistors
|
Chien, Nguyen Dang
|
|
2015
|
55 |
1 |
p. 31-37
7 p.
|
artikel
|
| 36 |
Soft errors in floating gate memory cells: A review
|
Bagatin, Marta
|
|
2015
|
55 |
1 |
p. 24-30
7 p.
|
artikel
|
| 37 |
The effect of electroplating parameters and substrate material on tin whisker formation
|
Ashworth, M.A.
|
|
2015
|
55 |
1 |
p. 180-191
12 p.
|
artikel
|
| 38 |
The effect of external stress on the properties of AlGaAs/GaAs single quantum well laser diodes
|
Zhu, Hui
|
|
2015
|
55 |
1 |
p. 62-65
4 p.
|
artikel
|
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