no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
A cloud model-based method for the analysis of accelerated life test data
|
Zhang, Wenjin |
|
2015 |
55 |
1 |
p. 123-128 6 p. |
article |
2 |
An advanced area scaling approach for semiconductor burn-in
|
Kurz, Daniel |
|
2015 |
55 |
1 |
p. 129-137 9 p. |
article |
3 |
An analytical avalanche breakdown model for double gate MOSFET
|
Cho, Edward Namkyu |
|
2015 |
55 |
1 |
p. 38-41 4 p. |
article |
4 |
Call for Papers: Reliability Issues in Power Electronics
|
|
|
2015 |
55 |
1 |
p. 292- 1 p. |
article |
5 |
Characterizing, modeling, and analyzing soft error propagation in asynchronous and synchronous digital circuits
|
Bany Hamad, Ghaith |
|
2015 |
55 |
1 |
p. 238-250 13 p. |
article |
6 |
Compact failure modeling for devices subject to electrostatic discharge stresses – A review pertinent to CMOS reliability simulation
|
Miao, Meng |
|
2015 |
55 |
1 |
p. 15-23 9 p. |
article |
7 |
Copper wire bonding package decapsulation using the anodic protection method
|
Endoh, Hirohiko |
|
2015 |
55 |
1 |
p. 207-212 6 p. |
article |
8 |
Corrigendum to “Junction temperature management of IGBT module in power electronic converters” [Microelectron. Reliab. 54 (2014) 2788–2795]
|
Zhou, Luowei |
|
2015 |
55 |
1 |
p. 291- 1 p. |
article |
9 |
Crosstalk noise modeling of multiwall carbon nanotube (MWCNT) interconnects using finite-difference time-domain (FDTD) technique
|
Ramesh Kumar, Vobulapuram |
|
2015 |
55 |
1 |
p. 155-163 9 p. |
article |
10 |
CSAM: A clock skew-aware aging mitigation technique
|
Eghbalkhah, Behzad |
|
2015 |
55 |
1 |
p. 282-290 9 p. |
article |
11 |
Deposition of Fe3O4 on oxidized activated carbon by hydrazine reducing method for high performance supercapacitor
|
Oh, Ilgeun |
|
2015 |
55 |
1 |
p. 114-122 9 p. |
article |
12 |
Effects of different test profiles of temperature cycling tests on the reliability of RFID tags
|
Lahokallio, Sanna |
|
2015 |
55 |
1 |
p. 93-100 8 p. |
article |
13 |
Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps
|
Meinshausen, L. |
|
2015 |
55 |
1 |
p. 192-200 9 p. |
article |
14 |
Empirical prediction model for Li/SOCl2 cells based on the accelerated degradation test
|
Cheng, Sijie |
|
2015 |
55 |
1 |
p. 101-106 6 p. |
article |
15 |
Equivalent circuit modeling of the bistable conduction characteristics in electroformed thin dielectric films
|
Blasco, J. |
|
2015 |
55 |
1 |
p. 1-14 14 p. |
article |
16 |
Equivalent mechanical properties of through silicon via interposers – A unit model approach
|
Chen, Cheng-fu |
|
2015 |
55 |
1 |
p. 221-230 10 p. |
article |
17 |
Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications
|
Msolli, S. |
|
2015 |
55 |
1 |
p. 164-171 8 p. |
article |
18 |
Exploiting component dependency for accurate and efficient soft error analysis via Probabilistic Graphical Models
|
Jiao, Jiajia |
|
2015 |
55 |
1 |
p. 251-263 13 p. |
article |
19 |
Fast power cycling protocols implemented in an automated test bench dedicated to IGBT module ageing
|
Forest, Francois |
|
2015 |
55 |
1 |
p. 81-92 12 p. |
article |
20 |
Genetic algorithms for defect detection of flip chips
|
Su, Lei |
|
2015 |
55 |
1 |
p. 213-220 8 p. |
article |
21 |
High performance SOI CMOS pixel sensor with surrounding N+ trench electrode
|
Hu, Hai-fan |
|
2015 |
55 |
1 |
p. 42-47 6 p. |
article |
22 |
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability
|
Jablonski, M. |
|
2015 |
55 |
1 |
p. 143-154 12 p. |
article |
23 |
Inside front cover - Editorial board
|
|
|
2015 |
55 |
1 |
p. IFC- 1 p. |
article |
24 |
Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test
|
Lin, Hsiu-Min |
|
2015 |
55 |
1 |
p. 231-237 7 p. |
article |
25 |
Low-power fault-tolerant interconnect method based on LCDMA and duplication
|
Nikolic, Tatjana |
|
2015 |
55 |
1 |
p. 272-281 10 p. |
article |
26 |
Modelling and IR measurement of the electronic substrate thermal conductivity
|
De Mey, G. |
|
2015 |
55 |
1 |
p. 138-142 5 p. |
article |
27 |
More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
|
Ly, Nhat |
|
2015 |
55 |
1 |
p. 201-206 6 p. |
article |
28 |
Node-to-node error sensitivity analysis using a graph based approach for VLSI logic circuits
|
Hamiyati Vaghef, Vahid |
|
2015 |
55 |
1 |
p. 264-271 8 p. |
article |
29 |
N2O treatment enhancement-mode InAlN/GaN HEMTs with HfZrO2 High-k insulator
|
Chiu, Hsien-Chin |
|
2015 |
55 |
1 |
p. 48-51 4 p. |
article |
30 |
PBGA packaging reliability assessments under random vibrations for space applications
|
Kim, Yeong K. |
|
2015 |
55 |
1 |
p. 172-179 8 p. |
article |
31 |
Process and temperature robust voltage multiplier design for RF energy harvesting
|
Yuan, J.S. |
|
2015 |
55 |
1 |
p. 107-113 7 p. |
article |
32 |
Raman spectroscopic assessments of structural orientation and residual stress in wurtzitic AlN film deposited on (001) Si
|
Zhu, Wenliang |
|
2015 |
55 |
1 |
p. 66-73 8 p. |
article |
33 |
Reliability impacts of high-speed 3-bit/cell Schottky barrier nanowire charge-trapping memories
|
Chang, Wei |
|
2015 |
55 |
1 |
p. 74-80 7 p. |
article |
34 |
Reliability investigation of light-emitting diodes via low frequency noise characteristics
|
Pralgauskaitė, Sandra |
|
2015 |
55 |
1 |
p. 52-61 10 p. |
article |
35 |
Short-channel effect and device design of extremely scaled tunnel field-effect transistors
|
Chien, Nguyen Dang |
|
2015 |
55 |
1 |
p. 31-37 7 p. |
article |
36 |
Soft errors in floating gate memory cells: A review
|
Bagatin, Marta |
|
2015 |
55 |
1 |
p. 24-30 7 p. |
article |
37 |
The effect of electroplating parameters and substrate material on tin whisker formation
|
Ashworth, M.A. |
|
2015 |
55 |
1 |
p. 180-191 12 p. |
article |
38 |
The effect of external stress on the properties of AlGaAs/GaAs single quantum well laser diodes
|
Zhu, Hui |
|
2015 |
55 |
1 |
p. 62-65 4 p. |
article |