nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A bottom-up approach for System-On-Chip reliability
|
Huard, V. |
|
2011 |
51 |
9-11 |
p. 1425-1439 15 p. |
artikel |
2 |
Accelerated life test of high power white light emitting diodes based on package failure mechanisms
|
Chan, S.I. |
|
2011 |
51 |
9-11 |
p. 1806-1809 4 p. |
artikel |
3 |
A compact model for early electromigration failures of copper dual-damascene interconnects
|
de Orio, R.L. |
|
2011 |
51 |
9-11 |
p. 1573-1577 5 p. |
artikel |
4 |
A full characterization of single pitch IO ESD protection based on silicon controlled rectifier and dynamic trigger circuit in CMOS 32nm node
|
Bourgeat, J. |
|
2011 |
51 |
9-11 |
p. 1614-1617 4 p. |
artikel |
5 |
Ageing monitoring of lithium-ion cell during power cycling tests
|
Eddahech, A. |
|
2011 |
51 |
9-11 |
p. 1968-1971 4 p. |
artikel |
6 |
An active heat-based restoring mechanism for improving the reliability of RF-MEMS switches
|
Iannacci, J. |
|
2011 |
51 |
9-11 |
p. 1869-1873 5 p. |
artikel |
7 |
Analysis of critical-length data from Electromigration failure studies
|
Dwyer, V.M. |
|
2011 |
51 |
9-11 |
p. 1568-1572 5 p. |
artikel |
8 |
An analytical approach for physical modeling of hot-carrier induced degradation
|
Tyaginov, S. |
|
2011 |
51 |
9-11 |
p. 1525-1529 5 p. |
artikel |
9 |
A new test methodology for an exhaustive study of single-event-effects on power MOSFETs
|
Busatto, G. |
|
2011 |
51 |
9-11 |
p. 1995-1998 4 p. |
artikel |
10 |
An extension of the Curie-von Schweidler law for the leakage current decay in MIS structures including progressive breakdown
|
Miranda, E. |
|
2011 |
51 |
9-11 |
p. 1535-1539 5 p. |
artikel |
11 |
An original DoE-based tool for silicon photodetectors EoL estimation in space environments
|
Spezzigu, P. |
|
2011 |
51 |
9-11 |
p. 1999-2003 5 p. |
artikel |
12 |
An overview of the reliability prediction related aspects of high power IGBTs in wind power applications
|
Busca, C. |
|
2011 |
51 |
9-11 |
p. 1903-1907 5 p. |
artikel |
13 |
ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness
|
de Filippis, Stefano |
|
2011 |
51 |
9-11 |
p. 1954-1958 5 p. |
artikel |
14 |
Application of transient interferometric mapping method for ESD and latch-up analysis
|
Pogany, D. |
|
2011 |
51 |
9-11 |
p. 1592-1596 5 p. |
artikel |
15 |
Applying Bayesian mixtures-of-experts models to statistical description of smart power semiconductor reliability
|
Bluder, Olivia |
|
2011 |
51 |
9-11 |
p. 1464-1468 5 p. |
artikel |
16 |
A reliable technology concept for active power cycling to extreme temperatures
|
Nelhiebel, M. |
|
2011 |
51 |
9-11 |
p. 1927-1932 6 p. |
artikel |
17 |
A simplified procedure for the analysis of Safety Instrumented Systems in the process industry application
|
Catelani, M. |
|
2011 |
51 |
9-11 |
p. 1503-1507 5 p. |
artikel |
18 |
A study of SiC Power BJT performance and robustness
|
Castellazzi, A. |
|
2011 |
51 |
9-11 |
p. 1773-1777 5 p. |
artikel |
19 |
A study of the effect of degradation of the aluminium metallization layer in the case of power semiconductor devices
|
Pietranico, S. |
|
2011 |
51 |
9-11 |
p. 1824-1829 6 p. |
artikel |
20 |
A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects
|
Yang, L. |
|
2011 |
51 |
9-11 |
p. 1882-1886 5 p. |
artikel |
21 |
Backside failure analysis case study: Implementation of innovative Local Backside Deprocessing technique
|
Laroche, A. |
|
2011 |
51 |
9-11 |
p. 1705-1709 5 p. |
artikel |
22 |
Challenges and opportunity in performance, variability and reliability in sub-45nm CMOS technologies
|
Arnaud, F. |
|
2011 |
51 |
9-11 |
p. 1508-1514 7 p. |
artikel |
23 |
Characterization and modelling of single event transients in LDMOS-SOI FETs
|
Alvarado, J. |
|
2011 |
51 |
9-11 |
p. 2004-2009 6 p. |
artikel |
24 |
Characterization of the self-heating of AlGaN/GaN HEMTs during an electrical stress by using Raman spectroscopy
|
Berthet, F. |
|
2011 |
51 |
9-11 |
p. 1796-1800 5 p. |
artikel |
25 |
Chromatic and spherical aberration correction for silicon aplanatic solid immersion lens for fault isolation and photon emission microscopy of integrated circuits
|
Goldberg, B.B. |
|
2011 |
51 |
9-11 |
p. 1637-1639 3 p. |
artikel |
26 |
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test
|
Shi, Hongbin |
|
2011 |
51 |
9-11 |
p. 1898-1902 5 p. |
artikel |
27 |
Comparative study of sensitive volume and triggering criteria of SEB in 600V planar and trench IGBTs
|
Zerarka, M. |
|
2011 |
51 |
9-11 |
p. 1990-1994 5 p. |
artikel |
28 |
Comparison of IGBT short-circuit failure “ohmic mode”: Epoxy molded package versus silicone gel module for new fail-safe and interruptible power converters
|
Richardeau, Frédéric |
|
2011 |
51 |
9-11 |
p. 1919-1926 8 p. |
artikel |
29 |
Comprehensive nanostructural study of SSRM nanocontact on silicon
|
Delaroque, T. |
|
2011 |
51 |
9-11 |
p. 1693-1696 4 p. |
artikel |
30 |
Concurrent PBTI and hot carrier degradation in n-channel MuGFETs
|
Lee, Sueng Min |
|
2011 |
51 |
9-11 |
p. 1544-1546 3 p. |
artikel |
31 |
Control of the electromagnetic compatibility: An issue for IC reliability
|
Gros, Jean-Baptiste |
|
2011 |
51 |
9-11 |
p. 1493-1497 5 p. |
artikel |
32 |
Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality
|
Rongen, R.T.H. |
|
2011 |
51 |
9-11 |
p. 1865-1868 4 p. |
artikel |
33 |
Cu pumping in TSVs: Effect of pre-CMP thermal budget
|
De Wolf, I. |
|
2011 |
51 |
9-11 |
p. 1856-1859 4 p. |
artikel |
34 |
DC parameters for laser diodes from experimental curves
|
Vanzi, M. |
|
2011 |
51 |
9-11 |
p. 1752-1756 5 p. |
artikel |
35 |
Degradation mechanisms of high-power white LEDs activated by current and temperature
|
Dal Lago, M. |
|
2011 |
51 |
9-11 |
p. 1742-1746 5 p. |
artikel |
36 |
Degradation of InGaN lasers: Role of non-radiative recombination and injection efficiency
|
Trivellin, N. |
|
2011 |
51 |
9-11 |
p. 1747-1751 5 p. |
artikel |
37 |
3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs
|
Azoui, T. |
|
2011 |
51 |
9-11 |
p. 1943-1947 5 p. |
artikel |
38 |
Design considerations and strategies for high-reliable STT-MRAM
|
Zhao, W.S. |
|
2011 |
51 |
9-11 |
p. 1454-1458 5 p. |
artikel |
39 |
“Design for EMI” approach on power PiN diode reverse recovery
|
Tsukuda, M. |
|
2011 |
51 |
9-11 |
p. 1972-1975 4 p. |
artikel |
40 |
Design of optimum electron beam irradiation processes for the reliability of electric cables used in critical applications
|
Ciappa, M. |
|
2011 |
51 |
9-11 |
p. 1479-1483 5 p. |
artikel |
41 |
Determination of bulk discharge current in the dielectric film of MEMS capacitive switches
|
Koutsoureli, M.S. |
|
2011 |
51 |
9-11 |
p. 1874-1877 4 p. |
artikel |
42 |
Dynamic active cooling for improved power system reliability
|
Castellazzi, A. |
|
2011 |
51 |
9-11 |
p. 1964-1967 4 p. |
artikel |
43 |
Dynamic defect localization using FPGA to monitor digital values
|
Saury, L. |
|
2011 |
51 |
9-11 |
p. 1701-1704 4 p. |
artikel |
44 |
Dynamic electro-thermal modeling for power device assemblies
|
Cova, P. |
|
2011 |
51 |
9-11 |
p. 1948-1953 6 p. |
artikel |
45 |
Editorial
|
Labat, Nathalie |
|
2011 |
51 |
9-11 |
p. 1423-1424 2 p. |
artikel |
46 |
Effect of high temperature aging on reliability of automotive electronics
|
Yang, D.G. |
|
2011 |
51 |
9-11 |
p. 1938-1942 5 p. |
artikel |
47 |
Effects of channel thickness variation on bias stress instability of InGaZnO thin-film transistors
|
Cho, Edward Namkyu |
|
2011 |
51 |
9-11 |
p. 1792-1795 4 p. |
artikel |
48 |
Effects of device layout on the drain breakdown voltages in MuGFETs
|
Kim, Jin Young |
|
2011 |
51 |
9-11 |
p. 1547-1550 4 p. |
artikel |
49 |
Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology
|
Liu, R. |
|
2011 |
51 |
9-11 |
p. 1721-1724 4 p. |
artikel |
50 |
Electric field unbalance for robust floating ring termination
|
Villamor-Baliarda, A. |
|
2011 |
51 |
9-11 |
p. 1959-1963 5 p. |
artikel |
51 |
Electro-thermal characterization of AlGaN/GaN HEMT on Silicon Microstrip Technology
|
Riccio, M. |
|
2011 |
51 |
9-11 |
p. 1725-1729 5 p. |
artikel |
52 |
ESD sensitivity of a GaAs MMIC microwave power amplifier
|
Tazzoli, Augusto |
|
2011 |
51 |
9-11 |
p. 1602-1607 6 p. |
artikel |
53 |
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow
|
Aubert, A. |
|
2011 |
51 |
9-11 |
p. 1845-1849 5 p. |
artikel |
54 |
Experimental verification of the usefulness of the nth power law MOSFET model under hot carrier wearout
|
Berbel, N. |
|
2011 |
51 |
9-11 |
p. 1564-1567 4 p. |
artikel |
55 |
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending
|
Shi, Hongbin |
|
2011 |
51 |
9-11 |
p. 1850-1855 6 p. |
artikel |
56 |
Failure analysis defect location on a real case 55nm memory using dynamic power supply emulation
|
Parrassin, Thierry |
|
2011 |
51 |
9-11 |
p. 1646-1651 6 p. |
artikel |
57 |
Failure mechanisms in advanced BCD technology during reliability qualification
|
van Hassel, J.G. |
|
2011 |
51 |
9-11 |
p. 1697-1700 4 p. |
artikel |
58 |
Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview
|
Chin, Jiann Min |
|
2011 |
51 |
9-11 |
p. 1440-1448 9 p. |
artikel |
59 |
FIFA: A fault-injection–fault-analysis-based tool for reliability assessment at RTL level
|
Naviner, L.A.B. |
|
2011 |
51 |
9-11 |
p. 1459-1463 5 p. |
artikel |
60 |
Foundry workflow for dynamic-EFA-based yield ramp
|
Kardach, C. |
|
2011 |
51 |
9-11 |
p. 1668-1672 5 p. |
artikel |
61 |
From component to system failure analysis – The future challenge within work-sharing supply chains
|
Jacob, Peter |
|
2011 |
51 |
9-11 |
p. 1618-1623 6 p. |
artikel |
62 |
GaN-based HEMTs tested under high temperature storage test
|
Marcon, D. |
|
2011 |
51 |
9-11 |
p. 1717-1720 4 p. |
artikel |
63 |
HCI and NBTI induced degradation in gate-all-around silicon nanowire transistors
|
Huang, Ru |
|
2011 |
51 |
9-11 |
p. 1515-1520 6 p. |
artikel |
64 |
High temperature long term stability of SiC Schottky diodes
|
Testa, A. |
|
2011 |
51 |
9-11 |
p. 1778-1782 5 p. |
artikel |
65 |
How supercapacitors reach end of life criteria during calendar life and power cycling tests
|
Chaari, R. |
|
2011 |
51 |
9-11 |
p. 1976-1979 4 p. |
artikel |
66 |
Identifying electrical mechanisms responsible for functional failures during harsh external ESD and EMC aggression
|
Besse, P. |
|
2011 |
51 |
9-11 |
p. 1597-1601 5 p. |
artikel |
67 |
Impact of gate poly doping and oxide thickness on the N- and PBTI in MOSFETs
|
Pobegen, Gregor |
|
2011 |
51 |
9-11 |
p. 1530-1534 5 p. |
artikel |
68 |
Impact of irregular geometries on low-k dielectric breakdown
|
Bashir, Muhammad |
|
2011 |
51 |
9-11 |
p. 1582-1586 5 p. |
artikel |
69 |
Impact of modularity and redundancy in optimising the reliability of power systems that include a large number of power converters
|
Siemaszko, Daniel |
|
2011 |
51 |
9-11 |
p. 1484-1488 5 p. |
artikel |
70 |
Improved thermal management of low voltage power devices with optimized bond wire positions
|
Köck, Helmut |
|
2011 |
51 |
9-11 |
p. 1913-1918 6 p. |
artikel |
71 |
Influence of air gaps on the thermal–electrical–mechanical behavior of a copper metallization
|
Bauer, Irina |
|
2011 |
51 |
9-11 |
p. 1587-1591 5 p. |
artikel |
72 |
Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach
|
Lofrano, M. |
|
2011 |
51 |
9-11 |
p. 1578-1581 4 p. |
artikel |
73 |
Inside front cover - Editorial board
|
|
|
2011 |
51 |
9-11 |
p. IFC- 1 p. |
artikel |
74 |
Investigation methods and approaches for alleviating charge trapping phenomena in ohmic RF-MEMS switches submitted to cycling test
|
Massenz, A. |
|
2011 |
51 |
9-11 |
p. 1887-1891 5 p. |
artikel |
75 |
Investigation of the degradation mechanisms of InP/InGaAs DHBT under bias stress conditions to achieve electrical aging model for circuit design
|
Ghosh, S. |
|
2011 |
51 |
9-11 |
p. 1736-1741 6 p. |
artikel |
76 |
Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications
|
Ousten, J.P. |
|
2011 |
51 |
9-11 |
p. 1830-1835 6 p. |
artikel |
77 |
Laser induced impact ionization effect in MOSFET during 1064nm laser stimulation
|
Brahma, Sanjib Kumar |
|
2011 |
51 |
9-11 |
p. 1652-1657 6 p. |
artikel |
78 |
Leakage current, active power, and delay analysis of dynamic dual Vt CMOS circuits under P–V–T fluctuations
|
Wang, Jinhui |
|
2011 |
51 |
9-11 |
p. 1498-1502 5 p. |
artikel |
79 |
LVI detection on passive structure in advance CMOS technology: New opportunities for device analysis
|
Celi, Guillaume |
|
2011 |
51 |
9-11 |
p. 1662-1667 6 p. |
artikel |
80 |
Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization
|
Infante, F. |
|
2011 |
51 |
9-11 |
p. 1684-1688 5 p. |
artikel |
81 |
Matching degradation of threshold voltage and gate voltage of NMOSFET after Hot Carrier Injection stress
|
Joly, Y. |
|
2011 |
51 |
9-11 |
p. 1561-1563 3 p. |
artikel |
82 |
Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III–V material
|
Chou, Tsung-Lin |
|
2011 |
51 |
9-11 |
p. 1757-1761 5 p. |
artikel |
83 |
Mechanism of breakdown voltage wavering in power MOSFET induced by silicon crystalline defect
|
Weber, Y. |
|
2011 |
51 |
9-11 |
p. 1908-1912 5 p. |
artikel |
84 |
Migration induced material transport in Cu–Sn IMC and SnAgCu microbumps
|
Meinshausen, L. |
|
2011 |
51 |
9-11 |
p. 1860-1864 5 p. |
artikel |
85 |
MOS-IGBT power devices for high-temperature operation in smart power SOI technology
|
Arbess, H. |
|
2011 |
51 |
9-11 |
p. 1980-1984 5 p. |
artikel |
86 |
NBTI related degradation and lifetime estimation in p-channel power VDMOSFETs under the static and pulsed NBT stress conditions
|
Manić, I. |
|
2011 |
51 |
9-11 |
p. 1540-1543 4 p. |
artikel |
87 |
On the reliability of electrostatic NEMS/MEMS devices: Review of present knowledge on the dielectric charging and stiction failure mechanisms and novel characterization methodologies
|
Zaghloul, Usama |
|
2011 |
51 |
9-11 |
p. 1810-1818 9 p. |
artikel |
88 |
Operation of SiC normally-off JFET at the edges of its safe operating area
|
Abbate, Carmine |
|
2011 |
51 |
9-11 |
p. 1767-1772 6 p. |
artikel |
89 |
Optimization of wire connections design for power electronics
|
Celnikier, Y. |
|
2011 |
51 |
9-11 |
p. 1892-1897 6 p. |
artikel |
90 |
Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
|
Wang, B. |
|
2011 |
51 |
9-11 |
p. 1878-1881 4 p. |
artikel |
91 |
Performance improvement of Si-CCD detector based backside reflected light and photon emission microscopy by FIB ultimate substrate thinning
|
Glowacki, A. |
|
2011 |
51 |
9-11 |
p. 1632-1636 5 p. |
artikel |
92 |
Photoelectric Laser Stimulation applied to Latch-Up phenomenon and localization of parasitic transistors in an industrial failure analysis laboratory
|
Llido, R. |
|
2011 |
51 |
9-11 |
p. 1658-1661 4 p. |
artikel |
93 |
Positive bias temperature instabilities on sub-nanometer EOT FinFETs
|
Feijoo, P.C. |
|
2011 |
51 |
9-11 |
p. 1521-1524 4 p. |
artikel |
94 |
Power cycling fatigue and lifetime prediction of power electronic devices in space applications
|
Vacher, F. |
|
2011 |
51 |
9-11 |
p. 1985-1989 5 p. |
artikel |
95 |
Progressive module redundancy for fault-tolerant designs in nanoelectronics
|
Ban, Tian |
|
2011 |
51 |
9-11 |
p. 1489-1492 4 p. |
artikel |
96 |
QALT study of scintillating material in digital flat panels for medical imaging
|
Béranger, M. |
|
2011 |
51 |
9-11 |
p. 1801-1805 5 p. |
artikel |
97 |
Reliability assessment on new reprogrammable non-volatile memory devices based on SiCr–O
|
Li, Yuan |
|
2011 |
51 |
9-11 |
p. 1474-1478 5 p. |
artikel |
98 |
Reliability aware design of low power continuous-time sigma–delta modulator
|
Cai, H. |
|
2011 |
51 |
9-11 |
p. 1449-1453 5 p. |
artikel |
99 |
Reliability impact due to high current, lattice and hot carriers temperatures on β(2×2) matrix ESD power devices for advanced CMOS technologies
|
Galy, Ph. |
|
2011 |
51 |
9-11 |
p. 1608-1613 6 p. |
artikel |
100 |
Reliability issues of GaN based high voltage power devices
|
Wuerfl, J. |
|
2011 |
51 |
9-11 |
p. 1710-1716 7 p. |
artikel |
101 |
Reliability of submicron InGaAs/InP DHBT under thermal and electrical stresses
|
Koné, G.A. |
|
2011 |
51 |
9-11 |
p. 1730-1735 6 p. |
artikel |
102 |
Reliability study of AlGaN/GaN HEMT under electromagnetic, RF and DC stress
|
Khemiri, S. |
|
2011 |
51 |
9-11 |
p. 1783-1787 5 p. |
artikel |
103 |
S-parameter performance degradation in power RF N-LDMOS devices due to hot carrier effects
|
Belaïd, M.A. |
|
2011 |
51 |
9-11 |
p. 1551-1556 6 p. |
artikel |
104 |
Statistical modeling of reliability in logic devices
|
Schleifer, Jochen |
|
2011 |
51 |
9-11 |
p. 1469-1473 5 p. |
artikel |
105 |
Structure oriented compact model for advanced trench IGBTs without fitting parameters for extreme condition: Part I
|
Tanaka, M. |
|
2011 |
51 |
9-11 |
p. 1933-1937 5 p. |
artikel |
106 |
Study of the impact of hot carrier injection to immunity of MOSFET to electromagnetic interferences
|
Li, B. |
|
2011 |
51 |
9-11 |
p. 1557-1560 4 p. |
artikel |
107 |
Synthesis of scanning electron microscopy images by high performance computing for the metrology of advanced CMOS processes
|
Esposito, Aniello |
|
2011 |
51 |
9-11 |
p. 1673-1678 6 p. |
artikel |
108 |
The combinational or selective usage of the laser SQUID microscope, the non-bias laser terahertz emission microscope, and fault simulations in non-electrical-contact fault localization
|
Nikawa, Kiyoshi |
|
2011 |
51 |
9-11 |
p. 1624-1631 8 p. |
artikel |
109 |
Thermal impedance spectroscopy of power modules
|
Hensler, A. |
|
2011 |
51 |
9-11 |
p. 1679-1683 5 p. |
artikel |
110 |
Thermal–mechanical behavior of the bonding wire for a power module subjected to the power cycling test
|
Hung, T.Y. |
|
2011 |
51 |
9-11 |
p. 1819-1823 5 p. |
artikel |
111 |
Thermal optimization of GaN-on-Si HEMTs with plastic package
|
Liu, R. |
|
2011 |
51 |
9-11 |
p. 1788-1791 4 p. |
artikel |
112 |
Thermal stress effects on Dye-Sensitized Solar Cells (DSSCs)
|
Bari, D. |
|
2011 |
51 |
9-11 |
p. 1762-1766 5 p. |
artikel |
113 |
Time Resolved Imaging: From logical states to events, a new and efficient pattern matching method for VLSI analysis
|
Bascoul, G. |
|
2011 |
51 |
9-11 |
p. 1640-1645 6 p. |
artikel |
114 |
Tiny-scale “stealth” current sensor to probe power semiconductor device failure
|
Kasho, Yuya |
|
2011 |
51 |
9-11 |
p. 1689-1692 4 p. |
artikel |
115 |
Total ionising dose effects on punch-through insulated gate bipolar transistors turn-on switching behaviour
|
Tala-Ighil, B. |
|
2011 |
51 |
9-11 |
p. 2010-2014 5 p. |
artikel |
116 |
Warpage analysis of layered structures connected by direct brazing
|
Asada, T. |
|
2011 |
51 |
9-11 |
p. 1836-1839 4 p. |
artikel |
117 |
Warpage variations of Si/solder/OFHC-Cu layered plates subjected to cyclic thermal loading
|
Tanie, Hisashi |
|
2011 |
51 |
9-11 |
p. 1840-1844 5 p. |
artikel |