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Journal description
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Details for article 37 of 117 found articles
| Title: |
3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs |
| Author: |
Azoui, T. Tounsi, P. Dupuy, Ph. Guillot, L. Dorkel, J.M. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 9-11 pages 5 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 37 of 117 found articles
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