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Journal description
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Details for article 26 of 117 found articles
| Title: |
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test |
| Author: |
Shi, Hongbin Ueda, Toshitsugu |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 9-11 pages 5 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 26 of 117 found articles
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