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Journal description
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Details for article 82 of 117 found articles
| Title: |
Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III–V material |
| Author: |
Chou, Tsung-Lin Yang, Shin-Yueh Wu, Chung-Jung Han, Cheng-Nan Chiang, Kou-Ning |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 9-11 pages 5 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 82 of 117 found articles
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