| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
ACF particle distribution in COG process
|
Yen, Yee-Wen
|
|
2011
|
51 |
3 |
p. 676-684
9 p.
|
article
|
| 2 |
Acoustic emission for detecting deterioration of capacitors under aging
|
Smulko, Janusz
|
|
2011
|
51 |
3 |
p. 621-627
7 p.
|
article
|
| 3 |
Analyses of electromagnetic vibration-based generators fabricated with LTCC multilayer and silver spring-inducer
|
Lu, W.L.
|
|
2011
|
51 |
3 |
p. 610-620
11 p.
|
article
|
| 4 |
A self-test and dynamics characterization circuit for MEMS electrostatic actuators
|
Fernández, Daniel
|
|
2011
|
51 |
3 |
p. 602-609
8 p.
|
article
|
| 5 |
Characteristics of the intrinsic defects in unintentionally doped 4H–SiC after thermal annealing
|
Cheng, Ping
|
|
2011
|
51 |
3 |
p. 572-575
4 p.
|
article
|
| 6 |
Compact modeling of short-channel effects in symmetric and asymmetric 3-T/4-T double gate MOSFETs
|
Mohammadi, Saeed
|
|
2011
|
51 |
3 |
p. 543-549
7 p.
|
article
|
| 7 |
Current transport mechanisms and trap state investigations in (Ni/Au)–AlN/GaN Schottky barrier diodes
|
Arslan, Engin
|
|
2011
|
51 |
3 |
p. 576-580
5 p.
|
article
|
| 8 |
Cyclic endurance reliability of stretchable electronic substrates
|
Bossuyt, F.
|
|
2011
|
51 |
3 |
p. 628-635
8 p.
|
article
|
| 9 |
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes
|
Tsai, M.Y.
|
|
2011
|
51 |
3 |
p. 642-648
7 p.
|
article
|
| 10 |
Device linearity and intermodulation distortion comparison of dual material gate and conventional AlGaN/GaN high electron mobility transistor
|
Kumar, Sona P.
|
|
2011
|
51 |
3 |
p. 587-596
10 p.
|
article
|
| 11 |
Drain current model for undoped Gate Stack Double Gate (GSDG) MOSFETs including the hot-carrier degradation effects
|
Djeffal, F.
|
|
2011
|
51 |
3 |
p. 550-555
6 p.
|
article
|
| 12 |
Edge current induced failure of semiconductor PN junction during operation in the breakdown region of electrical characteristic
|
Obreja, V.V.N.
|
|
2011
|
51 |
3 |
p. 536-542
7 p.
|
article
|
| 13 |
Effect of Cr additions on interfacial reaction between the Sn–Zn–Bi solder and Cu/electroplated Ni substrates
|
Bi, Jinglin
|
|
2011
|
51 |
3 |
p. 636-641
6 p.
|
article
|
| 14 |
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading
|
Yu, Da
|
|
2011
|
51 |
3 |
p. 649-656
8 p.
|
article
|
| 15 |
Hysteresis effect in bottom-gate polymorphous silicon thin-film transistors
|
Hastas, N.A.
|
|
2011
|
51 |
3 |
p. 556-559
4 p.
|
article
|
| 16 |
Influence of P3HT:PCBM blend preparation on the active layer morphology and cell degradation
|
Balderrama, V.S.
|
|
2011
|
51 |
3 |
p. 597-601
5 p.
|
article
|
| 17 |
Inside front cover - Editorial board
|
|
|
2011
|
51 |
3 |
p. IFC-
1 p.
|
article
|
| 18 |
LDMOSFET with drain potential suppression for 100V Power IC technology
|
Holland, P.
|
|
2011
|
51 |
3 |
p. 529-535
7 p.
|
article
|
| 19 |
Mitigation of permanent faults in adaptive equalizers
|
Reviriego, P.
|
|
2011
|
51 |
3 |
p. 703-710
8 p.
|
article
|
| 20 |
Molybdenum and low-temperature annealing of a silicon power P–i–N diode
|
Vobecký, J.
|
|
2011
|
51 |
3 |
p. 566-571
6 p.
|
article
|
| 21 |
On the profile of frequency dependent dielectric properties of (Ni/Au)/GaN/Al0.3Ga0.7N heterostructures
|
Tekeli, Z.
|
|
2011
|
51 |
3 |
p. 581-586
6 p.
|
article
|
| 22 |
Orthogonal fault-tolerant systolic arrays for matrix multiplication
|
Milovanović, I.Ž.
|
|
2011
|
51 |
3 |
p. 711-725
15 p.
|
article
|
| 23 |
Reliability challenges in 3D IC packaging technology
|
Tu, K.N.
|
|
2011
|
51 |
3 |
p. 517-523
7 p.
|
article
|
| 24 |
RF small signal avalanche for bipolar transistor circuit design: Characterization, modeling and repercussions
|
Milovanović, Vladimir
|
|
2011
|
51 |
3 |
p. 560-565
6 p.
|
article
|
| 25 |
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
|
Schreier-Alt, Thomas
|
|
2011
|
51 |
3 |
p. 668-675
8 p.
|
article
|
| 26 |
Switch-level emulation of strength-base soft error detection
|
Sedaghat, Reza
|
|
2011
|
51 |
3 |
p. 692-702
11 p.
|
article
|
| 27 |
The effect of a post processing thermal anneal on pre-existing and stress induced electrically active defects in ultra-thin SiON dielectric layers
|
O’Connor, Robert
|
|
2011
|
51 |
3 |
p. 524-528
5 p.
|
article
|
| 28 |
The influence of solder composition on the impact strength of lead-free solder ball grid array joints
|
Tsukamoto, H.
|
|
2011
|
51 |
3 |
p. 657-667
11 p.
|
article
|
| 29 |
Thermal fracture toughness measurement for underfill during temperature change
|
Park, Soojae
|
|
2011
|
51 |
3 |
p. 685-691
7 p.
|
article
|
Journal description