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                                       Details for article 9 of 29 found articles
 
 
  Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes
 
 
Title: Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes
Author: Tsai, M.Y.
Ting, C.W.
Huang, C.Y.
Lai, Yi-Shao
Appeared in: Microelectronics reliability
Paging: Volume 51 (2011) nr. 3 pages 7 p.
Year: 2011
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 29 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands