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                             153 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A class of fault-tolerant multiprocessor networks 1990
30 3 p. 622
artikel
2 A complex priority redundant system with phase type distribution Gururajan, M.
1990
30 3 p. 453-455
artikel
3 A corollary to: Duane's postulate on reliability growth 1990
30 3 p. 619
artikel
4 A framework for knowledge-based computer-integrated manufacturing 1990
30 3 p. 623
artikel
5 Ageing effects in GaAs Schottky barrier diodes 1990
30 3 p. 616-617
artikel
6 A method for generating weighted random test patterns 1990
30 3 p. 621
artikel
7 An altered layer model for ion assisted deposition under net growth conditions 1990
30 3 p. 627
artikel
8 Analysis of aluminum gallium arsenide laser diodes failing due to nonradiative regions behind the facets 1990
30 3 p. 616
artikel
9 Analysis of a protective system having two types of failure Singh, S.K.
1990
30 3 p. 473-480
artikel
10 A new concept in reliability modelling 1990
30 3 p. 615
artikel
11 A new reliability problem associated with Ar ion sputter cleaning of interconnect vias 1990
30 3 p. 627
artikel
12 An expert system to facilitate fault isolation 1990
30 3 p. 621
artikel
13 An investigation of the time dependence of current degradation in MOS devices 1990
30 3 p. 615-616
artikel
14 A note on experiment design for accelerated life tests Luvalle, M.J.
1990
30 3 p. 591-603
artikel
15 A performance measure for a VHSIC avionic system: mission dependent availability 1990
30 3 p. 613
artikel
16 Application-specific integrated circuits (ASICs)—a main-stream line of VLSI device fabrication 1990
30 3 p. 624
artikel
17 Applied electromagnetics in materials G.W.A.D.,
1990
30 3 p. 609-610
artikel
18 Approximate availability analysis of VAXcluster systems 1990
30 3 p. 619
artikel
19 A reliability model for total field incidents 1990
30 3 p. 618
artikel
20 A study of the breakdown testing of thermal silicon oxides and the effects of preoxidation surface treatment 1990
30 3 p. 625
artikel
21 A study of the majority carrier mobility in hydrogenated boron-doped silicon 1990
30 3 p. 625
artikel
22 A theoretical derivation of the log-normal distribution of time-dependent dielectric breakdown in thin oxides 1990
30 3 p. 625
artikel
23 Availability measures of human-equipment standby redundant data-flow system with application to NASA deep space station Issa, Tareq N.
1990
30 3 p. 573-583
artikel
24 Bellcore system hardware reliability prediction 1990
30 3 p. 617
artikel
25 BiCMOS circuitry: the best of both worlds 1990
30 3 p. 623
artikel
26 Built-in test strategies for military systems 1990
30 3 p. 621
artikel
27 Chip type aluminum electrolytic capacitors feature SMT-compatibility, low profiles 1990
30 3 p. 617
artikel
28 4847838 Circuit for testing the bus structure of a printed wiring card Kralik, Ivan
1990
30 3 p. ii
artikel
29 Component failures based on flow distributions 1990
30 3 p. 616
artikel
30 Compound availability measures for a two-unit standby system Kapur, P.K.
1990
30 3 p. 425-429
artikel
31 Cost analysis of a multi-component screening system in the paper industry Kumar, Dinesh
1990
30 3 p. 457-461
artikel
32 Cost-effective software safety analysis 1990
30 3 p. 618
artikel
33 Design of a self-reconfiguring interconnection network for fault-tolerant VLSI processor arrays 1990
30 3 p. 623
artikel
34 Development of a generic database for CAE/CAD/CAM system at an Air Force facility Sherif, Yosef S.
1990
30 3 p. 555-564
artikel
35 Development of a new composite pseudo random number generator Sherif, Yosef S.
1990
30 3 p. 545-553
artikel
36 Dynamic analyses in mass spectrometry of SF 6 plasma during etching of silicon 1990
30 3 p. 620
artikel
37 Economic reliability testing of fiber optic systems 1990
30 3 p. 615
artikel
38 Effect of argon implantation on antimony implanted silicon 1990
30 3 p. 627
artikel
39 Effect of mechanical stress for thin SiO 2 films in TDDB and CCST characteristics 1990
30 3 p. 622
artikel
40 Effects of copper and titanium addition to aluminum interconnects on electro- and stress-migration open circuit failures 1990
30 3 p. 615
artikel
41 Environmental stress screening: an integration of disciplines 1990
30 3 p. 614
artikel
42 ESD phenomena in graded junction devices 1990
30 3 p. 625
artikel
43 Estimated costs of system maintenance and repair Sultan, Torky I.
1990
30 3 p. 515-518
artikel
44 Excess repair time for a repairable system Agrafiotis, G.K.
1990
30 3 p. 507-509
artikel
45 Extensions of the effective thickness theory of oxide breakdown 1990
30 3 p. 626
artikel
46 Fact and fiction in yield modeling 1990
30 3 p. 623-624
artikel
47 Filmless, sealed super-small chip trimmer potentiometers take on new importance 1990
30 3 p. 617
artikel
48 4845425 Full chip integrated circuit tester Beha, Johannes G
1990
30 3 p. i
artikel
49 HAST applications: acceleration factors and results for VLSI components 1990
30 3 p. 615
artikel
50 Heterostructure semiconductor device analysis: a globally convergent solution method for the nonlinear Poisson equation 1990
30 3 p. 626
artikel
51 High-performance optics—fundamental constituent of equipment for VLSI circuit fabrication 1990
30 3 p. 624
artikel
52 High reliability in the commercial arena 1990
30 3 p. 613
artikel
53 Hill-climbing heuristics for optimal hardware dimensioning and software allocation in fault-tolerant distributed systems 1990
30 3 p. 621
artikel
54 Human contamination as a source of IC failures 1990
30 3 p. 616
artikel
55 Impact of new technology on repair 1990
30 3 p. 614
artikel
56 Integrated reliability growth testing 1990
30 3 p. 619
artikel
57 Integration of reliability—and tolerance effect analysis 1990
30 3 p. 619-620
artikel
58 Interface degradation and dielectric breakdown of thin oxides due to homogeneous charge injection 1990
30 3 p. 625
artikel
59 Interface state generation due to electron tunneling into thin oxides 1990
30 3 p. 625
artikel
60 Into the nineties: VLSI trends and education 1990
30 3 p. 622
artikel
61 Invariant permutations for consecutive k-out-of-n cycles 1990
30 3 p. 619
artikel
62 Ion-implanted-induced structural modifications in Y 1Ba 2Cu 3O 7−δ superconductor 1990
30 3 p. 627
artikel
63 Large-area fault clusters and fault tolerance in VLSI circuits: a review 1990
30 3 p. 616
artikel
64 Legal liability and system safety applied to expert systems 1990
30 3 p. 614-615
artikel
65 Lithography in microelectronics G.W.A.D.,
1990
30 3 p. 606
artikel
66 Low-voltage hot-electron currents and degradation in deep-submicrometer MOSFETs 1990
30 3 p. 626
artikel
67 Management method for LSI wafer fabrication facilities 1990
30 3 p. 623
artikel
68 Managing Murphy's law: engineering a minimum-risk system 1990
30 3 p. 615
artikel
69 Mechanical durability prediction methods 1990
30 3 p. 614
artikel
70 4847810 Memory having redundancy circuit Tagami, Tomoyuki
1990
30 3 p. ii
artikel
71 Modeling and analysis of systems with multimode components and dependent failures 1990
30 3 p. 618-619
artikel
72 Modeling server-unreliability in closed queuing networks 1990
30 3 p. 619
artikel
73 Models and algorithms for reliability-oriented task-allocation in redundant distributed-computer systems 1990
30 3 p. 621
artikel
74 Monte Carlo evaluation of a dynamic reliability problem with an application to a case of partial cuts 1990
30 3 p. 621
artikel
75 Motivating reliable switching system performance 1990
30 3 p. 618
artikel
76 MTSF and availability analysis of a complex system composed of two subsystems in series subjected to random shocks with single repair facility Singh Joorel, J.P.
1990
30 3 p. 463-466
artikel
77 Multiplexing input options of VLSI circuits implemented in four-phase dynamic logic technology 1990
30 3 p. 624
artikel
78 Natural language processing technologies in artificial intelligence: The science and industry perspective Popentiu, Florin
1990
30 3 p. 610-611
artikel
79 4847553 Needle card contacting mechanism for testing micro-electronic components Seinecke, Siegfried
1990
30 3 p. i
artikel
80 New anatomies for semiconductor wafers 1990
30 3 p. 623
artikel
81 New applications of focused ion beam technique to failure analysis and process monitoring of VLSI 1990
30 3 p. 627
artikel
82 New effects resulting from the co-operation between process engineering and equipment design in IC fabrication 1990
30 3 p. 624
artikel
83 Noise and lifetime measurements in Si p +-i-n power diodes 1990
30 3 p. 616
artikel
84 Nonplanar VLSI arrays with high fault-tolerance capabilities 1990
30 3 p. 615
artikel
85 Observation of coherent Zener tunneling in Si inversion layers 1990
30 3 p. 626
artikel
86 On-chip measurement of package-related metal shift using an integrated silicon sensor 1990
30 3 p. 623
artikel
87 Operability and maintainability hazards in communications systems 1990
30 3 p. 618
artikel
88 Overheating effects in metallic point contacts 1990
30 3 p. 616
artikel
89 Parallelization of expert systems with recursive applications Yaprak, E.
1990
30 3 p. 519-523
artikel
90 Particles on surfaces volume 1 detection, adhesion, and removal G.W.A.D.,
1990
30 3 p. 608
artikel
91 Performance analysis of fault-tolerant systems in parallel execution of conversations 1990
30 3 p. 618
artikel
92 Performance control of systems with two decisive factors Sultan, Torky I.
1990
30 3 p. 511-514
artikel
93 Periodic replacement when minimal repair costs depend on the age and the number of minimal repair for a multi-unit system Sheu, Shey-Huei
1990
30 3 p. 565-572
artikel
94 Photoluminescence of the residual shallow acceptor in In xGa 1 − x grown on GaAs (001) by molecular beam epitaxy 1990
30 3 p. 626
artikel
95 p-MOSFET gate current and device degradation 1990
30 3 p. 625
artikel
96 Polarity dependence of thin oxide wearout 1990
30 3 p. 626-627
artikel
97 Prediction for system reliability and availability 1990
30 3 p. 620
artikel
98 Probabilistic analysis of a two-unit system with ‘start-up process time’ and imperfect switch Sarma, Yadavalli V.S.
1990
30 3 p. 537-543
artikel
99 Process optimization tweaking tool (POTT) and its application in controlling oxidation thickness 1990
30 3 p. 625
artikel
100 Publications, notices, calls for papers, etc. 1990
30 3 p. 421-423
artikel
101 Pulsed laser deposition of barium titanate films on silicon 1990
30 3 p. 627
artikel
102 Qualification of high reliability medical grade batteries 1990
30 3 p. 615
artikel
103 Redundancy strategy for dependent subsystems 1990
30 3 p. 621
artikel
104 Reliability analysis of a class of fault tolerant systems 1990
30 3 p. 621
artikel
105 Reliability analysis of a k-out-of-N:G parallel redundant system with multiple critical errors Kee Chung, Who
1990
30 3 p. 585-589
artikel
106 Reliability analysis of a two-unit parallel system with dissimilar units and general distributions Vanderperre, E.J.
1990
30 3 p. 491-501
artikel
107 Reliability analysis of a warm standby system with general distributions Vanderperre, E.J.
1990
30 3 p. 487-490
artikel
108 Reliability analysis of interconnection networks using hierarchical composition 1990
30 3 p. 620
artikel
109 Reliability analysis of redundant-path interconnection networks 1990
30 3 p. 618
artikel
110 Reliability computation of multistage interconnection networks 1990
30 3 p. 617
artikel
111 Reliability database development for use with an object-oriented fault tree evaluation program 1990
30 3 p. 619
artikel
112 Reliability evaluation of hypercube multicomputers 1990
30 3 p. 617-618
artikel
113 Reliability fundamentals Popentiu, Florin
1990
30 3 p. 605-606
artikel
114 Reliability issues with multiprocessor distributed database systems: a case study 1990
30 3 p. 620
artikel
115 Reliability models for mechanical equipment 1990
30 3 p. 613
artikel
116 Reliability testing of a software-driven system 1990
30 3 p. 619
artikel
117 Repair actions for self-diagnostic machines 1990
30 3 p. 621
artikel
118 R&M through avionics/electronics integrity program 1990
30 3 p. 620
artikel
119 Robust testing of CMOS logic circuits 1990
30 3 p. 621
artikel
120 Silicon-hydrogen bonds and microvoids in hydrogenated amorphous silicon and Staebler-Wronski effect 1990
30 3 p. 625
artikel
121 Si/Ti/TiB 2/Al structures investigated as contacts in microelectronic devices 1990
30 3 p. 622
artikel
122 Small-area fault clusters and fault tolerance in VLSI circuits 1990
30 3 p. 617
artikel
123 Smart power and high voltage integrated circuits and related MOS technologies 1990
30 3 p. 623
artikel
124 Software reliability and redundancy optimization 1990
30 3 p. 619
artikel
125 Software reliability from a system perspective 1990
30 3 p. 617
artikel
126 Software reliability growth process—a life cycle approach 1990
30 3 p. 620-621
artikel
127 SPAREL: a model for reliability and sparing in the world of redundancies 1990
30 3 p. 620
artikel
128 Stacking fault growth of f.c.c. crystal: the Monte-Carlo simulation approach 1990
30 3 p. 622
artikel
129 Star-delta transformations of bidirectional branches in probabilistic flow networks Rushdi, Ali M.
1990
30 3 p. 525-535
artikel
130 Storage reliability 1990
30 3 p. 614
artikel
131 Study of bandgap narrowing in the space-charge region of heavily doped silicon MOS capacitors 1990
30 3 p. 625-626
artikel
132 Survey of available software-safety analysis techniques 1990
30 3 p. 617
artikel
133 4845426 Temperature conditioner for tests of unpackaged semiconductors Nolan, Charles
1990
30 3 p. i
artikel
134 Temperature dependence of the conductivity in uniaxially stressed Si inversion layers at low temperatures 1990
30 3 p. 626
artikel
135 Testing equality of means in a bivariate normal population under possible presence of correlation coefficient Srivastava, C.P.L.
1990
30 3 p. 467-471
artikel
136 The alternate approach to the reliability modeling of fault masking systems Biernat, Janusz
1990
30 3 p. 503-506
artikel
137 The cost of poor repair process quality (COPRPQ) 1990
30 3 p. 614
artikel
138 The growth and characterization of ZnSe epilayers grown by VPE and MOCVD 1990
30 3 p. 627
artikel
139 The “hedgehog” shape of an ESD failure 1990
30 3 p. 614
artikel
140 The limit condition of some time between failure models of software reliability Xizi, Huang
1990
30 3 p. 481-485
artikel
141 The numbers game with the logistics support analysis record (LSAR) 1990
30 3 p. 614
artikel
142 The passivation of silicon devices by a-Si:H films 1990
30 3 p. 622
artikel
143 Thought-provoking gems from my reliability experience 1990
30 3 p. 613-614
artikel
144 Three-dimensional integrated circuit: technology and application prospect 1990
30 3 p. 624
artikel
145 Three-dimensional process and device modeling 1990
30 3 p. 624
artikel
146 Time-dependent dielectric breakdown of 210Åoxides 1990
30 3 p. 616
artikel
147 Trends in semiconductor memories 1990
30 3 p. 622-623
artikel
148 Two models for two-dissimilar-unit cold standby redundant system with partial failure and two types of repairs Mokaddis, G.S.
1990
30 3 p. 431-451
artikel
149 Ultrahigh reliability estimates through simulation 1990
30 3 p. 622
artikel
150 VLSI electronics microstructure science volume 21 beam processing technologies G.W.A.D.,
1990
30 3 p. 607
artikel
151 Voltage shifts of Fowler-Nordheim tunneling J-V plots in thin gate oxide MOS structures due to trapped charges 1990
30 3 p. 626
artikel
152 Warranties: concept to implementation 1990
30 3 p. 613
artikel
153 Why there is a need for a software-safety program 1990
30 3 p. 617
artikel
                             153 gevonden resultaten
 
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