| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Aging resilient ring oscillators for reliable Physically Unclonable Functions (PUFs)
|
Omaña, M.
|
|
|
162 |
C |
p.
|
artikel
|
| 2 |
A novel methodology for vibration induced fatigue life assessment of BGA devices in avionics systems of satellite launch vehicles
|
Jaiswal, Janmejay
|
|
|
162 |
C |
p.
|
artikel
|
| 3 |
A novel multi-information fusion CNN for defect detection in laser soldering of SAC305
|
Wang, Wei
|
|
|
162 |
C |
p.
|
artikel
|
| 4 |
A remaining useful life prediction method of aluminum electrolytic capacitor with adaptive degradation model selection
|
Chen, Jindian
|
|
|
162 |
C |
p.
|
artikel
|
| 5 |
A SEGR hardened trench gate DMOS with stepped source and optimized LOCOS structure
|
Zhang, Yanfei
|
|
|
162 |
C |
p.
|
artikel
|
| 6 |
Corrosion and conductivity damage of AgNW transparent conductive thin films under a simulated sulfur-containing atmosphere and mechanical force
|
Wan, Shan
|
|
|
162 |
C |
p.
|
artikel
|
| 7 |
Deformation mechanism and optimization of high-density organic substrates during reflow soldering
|
Cao, Rongxing
|
|
|
162 |
C |
p.
|
artikel
|
| 8 |
Editorial Board
|
|
|
|
162 |
C |
p.
|
artikel
|
| 9 |
Effect of filer content on the thermal characteristics of underfill materials for Ball-Grid-Array component package
|
Kim, Jang Baeg
|
|
|
162 |
C |
p.
|
artikel
|
| 10 |
Effect of microstructural variability on fatigue simulations of solder joints
|
Rebosolan, M.
|
|
|
162 |
C |
p.
|
artikel
|
| 11 |
Electrical contact reliability investigation of high-speed electrical connectors under fretting wear behavior
|
Lei, Xin
|
|
|
162 |
C |
p.
|
artikel
|
| 12 |
First-principles study of Ni additions on mechanical properties of η'-Cu6Sn5-based intermetallic compound
|
Yao, Jinye
|
|
|
162 |
C |
p.
|
artikel
|
| 13 |
Influence of different vibration directions on the solder layer fatigue in IGBT modules
|
Jian, Yifan
|
|
|
162 |
C |
p.
|
artikel
|
| 14 |
Investigation of thermal efficiency of recessed Γ gate over Γ gate, T gate and rectangular gate AlGaN/GaN HEMT on BGO substrate
|
Iype, Preethi Elizabeth
|
|
|
162 |
C |
p.
|
artikel
|
| 15 |
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires
|
Wu, Bo-Ding
|
|
|
162 |
C |
p.
|
artikel
|
| 16 |
500 μm heavy micro-alloyed Cu wire for IGBT application: The study on microstructure characteristics, electrical fatigue fracture mechanism and bonding reliability
|
Wu, Bo-Ding
|
|
|
162 |
C |
p.
|
artikel
|
| 17 |
Modeling LED driver lifespan through capacitor degradation due to thermal cycling
|
De Vas Gunawardena, Sachintha
|
|
|
162 |
C |
p.
|
artikel
|
| 18 |
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain
|
Kang, Tae Yeob
|
|
|
162 |
C |
p.
|
artikel
|
| 19 |
Novel Latin square matrix code of large burst error correction for MRAM applications
|
Jin, Hui
|
|
|
162 |
C |
p.
|
artikel
|
| 20 |
Radiation hardened P-Quatro 12T SRAM cell with strong SEU tolerance for aerospace applications
|
Mondal, Debabrata
|
|
|
162 |
C |
p.
|
artikel
|
| 21 |
Rapid on-site nondestructive surface corrosion characterization of sintered nanocopper paste in power electronics packaging using hyperspectral imaging
|
Chen, Wei
|
|
|
162 |
C |
p.
|
artikel
|
| 22 |
Research of SEB effects in trench IGBT based on the TCAD simulation
|
Gong, Yanfei
|
|
|
162 |
C |
p.
|
artikel
|
| 23 |
Research on the multi-physical field coupling modelling of IGBT package module and the effect of different structure failure interaction
|
Ren, Hanwen
|
|
|
162 |
C |
p.
|
artikel
|
| 24 |
Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire
|
An, Bin
|
|
|
162 |
C |
p.
|
artikel
|
| 25 |
Soft error analysis on junctionless ringFET structures and junctionless ringFET-based inverter circuits using numerical device modeling
|
M., Ramya
|
|
|
162 |
C |
p.
|
artikel
|
| 26 |
Study of the characteristics and growth of tin whiskers in orbit
|
Ichimaru, Shinichiro
|
|
|
162 |
C |
p.
|
artikel
|
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