| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comprehensive study of negative bias temperature instability in MOS structures
|
Irrera, Fernanda
|
|
|
155 |
C |
p.
|
artikel
|
| 2 |
A novel approach of fatigue testing and evaluation of electronic systems based on phase tracking
|
Doranga, Sushil
|
|
|
155 |
C |
p.
|
artikel
|
| 3 |
A screening method of retired insulated gate bipolar transistor for reuse based on multiple indicators and integrated model
|
Liu, He
|
|
|
155 |
C |
p.
|
artikel
|
| 4 |
A theoretical investigation of mole fraction-based N + pocket doped stack oxide TFET considering ideal conditions for reliability issues
|
Nigam, Kaushal Kumar
|
|
|
155 |
C |
p.
|
artikel
|
| 5 |
Bayesian calibration of ball grid array lifetime models for solder fatigue
|
Tauscher, Markus
|
|
|
155 |
C |
p.
|
artikel
|
| 6 |
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study
|
Catalano, Antonio Pio
|
|
|
155 |
C |
p.
|
artikel
|
| 7 |
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors
|
Wu, Huihui
|
|
|
155 |
C |
p.
|
artikel
|
| 8 |
Cost-effective reliability enhancement for video stitching applications based on error-tolerance
|
Hsieh, Tong-Yu
|
|
|
155 |
C |
p.
|
artikel
|
| 9 |
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness
|
Wu, Qixiao
|
|
|
155 |
C |
p.
|
artikel
|
| 10 |
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process
|
Guo, Liwei
|
|
|
155 |
C |
p.
|
artikel
|
| 11 |
Editorial Board
|
|
|
|
155 |
C |
p.
|
artikel
|
| 12 |
Experimental and numerical investigation on reliability of encapsulated sine wave interconnect for stretchable substrates
|
Patidar, Deepesh
|
|
|
155 |
C |
p.
|
artikel
|
| 13 |
Failure analysis on the abnormal cracking of Si3N4 ceramic substrates for SiC power modules in new energy vehicles
|
Chen, Jie
|
|
|
155 |
C |
p.
|
artikel
|
| 14 |
Fault tolerant micro-programmed control unit for SEU and MBU mitigation in space based digital systems
|
S., Deepanjali
|
|
|
155 |
C |
p.
|
artikel
|
| 15 |
Field-plated and back-barrier engineered wide-bandgap III-nitride/β-Ga2O3 nano-HEMT for emerging RF/microwave micro/nanoelectronics applications
|
Rao, G. Purnachandra
|
|
|
155 |
C |
p.
|
artikel
|
| 16 |
Impact of SiC power MOSFET interface trap charges on UIS reliability under single pulse
|
Wu, Xiao-Dong
|
|
|
155 |
C |
p.
|
artikel
|
| 17 |
Interface stress analysis and bonding strengthening exploration of metal layer on the laser-activated copper-clad AlN
|
Shao, Jing
|
|
|
155 |
C |
p.
|
artikel
|
| 18 |
Investigation of safe operating area and behavior of unclamped inductive switching on 4H-SiC VDMOSFET
|
Ke, Chao-Yang
|
|
|
155 |
C |
p.
|
artikel
|
| 19 |
Numerical investigation of solder joint shape for micro-spring package during vacuum vapor phase soldering
|
Li, Xiaomin
|
|
|
155 |
C |
p.
|
artikel
|
| 20 |
Research progress of hybrid bonding technology for three-dimensional integration
|
Zhou, Anqi
|
|
|
155 |
C |
p.
|
artikel
|
| 21 |
Sensitivity study of super-junction power MOSFETs by spatial and depth resolved heavy ion SEE mapping with various bias, LETs and ion ranges
|
Gerold, M.
|
|
|
155 |
C |
p.
|
artikel
|
| 22 |
Software countermeasures against the multiple instructions skip fault model
|
Khuat, Vanthanh
|
|
|
155 |
C |
p.
|
artikel
|
| 23 |
Study on the effect of anti-oxidation film formed by composite system on solder balls performance
|
Wang, Tongju
|
|
|
155 |
C |
p.
|
artikel
|
| 24 |
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle
|
Sippel, Marcel
|
|
|
155 |
C |
p.
|
artikel
|
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