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Journal description
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Details for article 17 of 24 found articles
| Title: |
Interface stress analysis and bonding strengthening exploration of metal layer on the laser-activated copper-clad AlN |
| Author: |
Shao, Jing Wang, Yingming Zhu, Karl Sun, Zhiyuan Han, Suli Dong, Hao Sun, Shufeng Song, Ping Zhang, Ruolan |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 155 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 24 found articles
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