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                                       Details for article 20 of 24 found articles
 
 
  Research progress of hybrid bonding technology for three-dimensional integration
 
 
Title: Research progress of hybrid bonding technology for three-dimensional integration
Author: Zhou, Anqi
Zhang, Yu
Ding, Fei
Lian, Ziqi
Jin, Renxi
Yang, Yudong
Wang, Qidong
Cao, Liqiang
Appeared in: Microelectronics reliability
Paging: Volume 155 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 20 of 24 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands