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                             52 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Ab initio investigations in amorphous silicon dioxide: Proposing a multi-state defect model for electron and hole capture Wilhelmer, Christoph
139 C p.
 artikel
2 A degradation model for separable electrical contacts based on the failure caused by surface oxide film Zhong, Liqiang
139 C p.
 artikel
3 A general defect modelling and simulation-assisted approach for fault isolation in failure analysis Li, Ang
139 C p.
 artikel
4 A health state prediction method of traction converter IGBT based on optimized particle filter Shi, Yunming
139 C p.
 artikel
5 A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact Gharaibeh, Mohammad A.
139 C p.
 artikel
6 An equivalent circuit model of NBTI effect for short-channel P-MOSFET Zhang, Jun-an
139 C p.
 artikel
7 A survey on two-dimensional Error Correction Codes applied to fault-tolerant systems Freitas, David
139 C p.
 artikel
8 A triple-node upset self-healing latch for high speed and robust operation in radiation-prone harsh-environment Kumar, Sandeep
139 C p.
 artikel
9 BAS: A BTI-based aging aware synthesis in FPGAs Abednazari, Mohammad
139 C p.
 artikel
10 Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges Thukral, V.
139 C p.
 artikel
11 Comprehensive study of the radiation effects on the LDMOS transistors Lei, Zeyu
139 C p.
 artikel
12 Creep-fatigue lifetime estimation of efficient photovoltaic module ribbon interconnections Eslami Majd, Alireza
139 C p.
 artikel
13 Cross-layer inference methodology for microarchitecture-aware fault models Alshaer, Ihab
139 C p.
 artikel
14 Design of high reliability LDO regulator with NLRSCR based ESD protection circuit using dynamic feedback loop for low-voltage applications Kwon, Sang Wook
139 C p.
 artikel
15 Design optimization of a packaged thermoelectric generator for electrically active implants Rao, Yongchen
139 C p.
 artikel
16 Displacement damage and single event effects of SiC diodes and MOSFETs by neutron, heavy ions and pulsed laser Shangguan, ShiPeng
139 C p.
 artikel
17 Editorial Board
139 C p.
 artikel
18 Effect of Ag and Cu co-addition on the microstructure and creep properties of Sn-5Sb solder under current stressing Yu, Zhang
139 C p.
 artikel
19 Effect of Ag and Cu co-addition on the microstructure evolution, interface behavior and mechanical properties of Sn-5Sb based solder joints subjected to different thermal aging conditions Xu, Da
139 C p.
 artikel
20 Effect of NC pins ESD test on the reliability of integrated circuits with high density BGA package Lu, Jian
139 C p.
 artikel
21 Effect of temperature on vibration durability of lead-free solder joints Höhne, Robert
139 C p.
 artikel
22 Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging Tang, Jiuyang
139 C p.
 artikel
23 Heterojunction bipolar transistor featuring a stressed implanted collector: Defects formation and impact on functionality Brezza, Edoardo
139 C p.
 artikel
24 High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor Mao, Qidong
139 C p.
 artikel
25 IGBT modules fault prediction based on particle filter with an improved nonlinear characteristics representation of state-space model Yang, Jinhui
139 C p.
 artikel
26 Impact of unpreventable induced interface trapped charges on HZO based FDSOI NCFET Seshu, Vullakula Rama
139 C p.
 artikel
27 Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules Cui, Haoyang
139 C p.
 artikel
28 Integer linear programming-based optimization methodology for reliability and energy-aware high-level synthesis Dilek, Selma
139 C p.
 artikel
29 Investigation on vibration induced fretting in degraded contact interface Li, Qingya
139 C p.
 artikel
30 Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity Zhang, Yong-Xin
139 C p.
 artikel
31 Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface Lee, Seong-Min
139 C p.
 artikel
32 Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs Berens, Judith
139 C p.
 artikel
33 Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi Jaffery, Syed Hassan Abbas
139 C p.
 artikel
34 Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study Xue, Peng
139 C p.
 artikel
35 Quality control of lifetime drift effects Lewitschnig, Horst
139 C p.
 artikel
36 Radiation hardness of solution-processed amorphous ZnSnO gas sensors against gamma rays Lin, Pei-Te
139 C p.
 artikel
37 Reliability improved dual driven feedback 10T SRAM bit cell Leavline, Epiphany Jebamalar
139 C p.
 artikel
38 Reliability testing of solder joints under combined cyclic thermal and bending load for automotive applications Gleichauf, Jonas
139 C p.
 artikel
39 Remaining useful life (RUL) regression using Long–Short Term Memory (LSTM) networks Yousuf, Sofia
139 C p.
 artikel
40 Simulation of transient radiation upset in a 0.18-μm CMOS SRAM by accurately modeling a 6T memory cell Zhao, Zhenguo
139 C p.
 artikel
41 Single-event burnout hardening of RC-IGBT with the raised N-buffer layer Zhang, Xiao-Dong
139 C p.
 artikel
42 Study of TID radiation effects on the breakdown voltage of buried P-pillar SOI LDMOSFETs with P-top region Yu, Cheng-hao
139 C p.
 artikel
43 Study on failure mechanism caused by voltage leap of SGT-MOSFET during UIS testing Su, Le
139 C p.
 artikel
44 Study on interfacial reaction behavior of SnAg based lead-free solder with (111) single crystal copper substrate Han, Jing
139 C p.
 artikel
45 TCAD evaluation of single-event burnout hardening design for SiC Schottky diodes Chen, Jia-Hao
139 C p.
 artikel
46 The electrothermal fracture mechanism between aluminum and copper wires Wu, Bo-Ding
139 C p.
 artikel
47 The integrated fast short-circuit protection technique with soft turn-off for SiC MOSFET Cao, Jianwen
139 C p.
 artikel
48 Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests Zhang, Yunfan
139 C p.
 artikel
49 Towards development of an intelligent failure analysis system based on infrared thermography Pareek, Kaushal Arun
139 C p.
 artikel
50 Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics Schipfer, Christian
139 C p.
 artikel
51 Trap-assisted degradation mechanisms in E-mode p-GaN power HEMT: A review Nautiyal, Priyanka
139 C p.
 artikel
52 Warpage characterization of a large size fan-out panel subjected to inhomogeneous heating by a digital fringe projection system Chen, Zhiwen
139 C p.
 artikel
                             52 gevonden resultaten
 
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