| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A feasibility study on potential of stress sensors to detect solder joint defects toward prognostics of power modules
|
Usui, Masanori
|
|
|
137 |
C |
p.
|
artikel
|
| 2 |
A general approach for degradation modeling to enable a widespread use of aging simulations in IC design
|
Lange, André
|
|
|
137 |
C |
p.
|
artikel
|
| 3 |
Aluminium corrosion in power semiconductor devices
|
Leppänen, J.
|
|
|
137 |
C |
p.
|
artikel
|
| 4 |
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor
|
Riegel, Daniel
|
|
|
137 |
C |
p.
|
artikel
|
| 5 |
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET
|
Alberton, Saulo G.
|
|
|
137 |
C |
p.
|
artikel
|
| 6 |
Corrigendum to “Wettable flank routable thin MicroLeadFrame for automotive applications” [Microelectron. Reliab. 135 (2022) 114602]
|
Kim, Byong Jin
|
|
|
137 |
C |
p.
|
artikel
|
| 7 |
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study
|
Tiwari, Shreyas
|
|
|
137 |
C |
p.
|
artikel
|
| 8 |
Editorial Board
|
|
|
|
137 |
C |
p.
|
artikel
|
| 9 |
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer
|
Lee, Yu Seong
|
|
|
137 |
C |
p.
|
artikel
|
| 10 |
Equivalent thermal model of through silicon via and bump for advanced packaging of integrated circuits
|
Nie, Chuanjun
|
|
|
137 |
C |
p.
|
artikel
|
| 11 |
Evaluation of the helium hermeticity reliability of copper through-glass vias
|
Okoro, Chukwudi
|
|
|
137 |
C |
p.
|
artikel
|
| 12 |
`Failure analysis of short-circuit failure of metal-oxide-metal capacitor
|
Wang, Yan
|
|
|
137 |
C |
p.
|
artikel
|
| 13 |
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity
|
Tai, Yunxiao
|
|
|
137 |
C |
p.
|
artikel
|
| 14 |
Fatigue of copper films subjected to high-strain rate thermo-mechanical pulsing
|
Moser, Sebastian
|
|
|
137 |
C |
p.
|
artikel
|
| 15 |
FIB-SEM based 3D tomography of micro-electronic components: Application to automotive high-definition LED lighting systems
|
Noçairi, Safa
|
|
|
137 |
C |
p.
|
artikel
|
| 16 |
Flexible privilege management for microcontroller-class RISC-V cores
|
Cilardo, Alessandro
|
|
|
137 |
C |
p.
|
artikel
|
| 17 |
Heavy-ion induced gate damage and thermal destruction in double-trench SiC MOSFETs
|
Wang, Lihao
|
|
|
137 |
C |
p.
|
artikel
|
| 18 |
Impact of THT-hole dimensioning on manufacturability in selective wave soldering
|
Seidel, Reinhardt
|
|
|
137 |
C |
p.
|
artikel
|
| 19 |
In-field test solution for enhancing safety in automotive applications
|
Abotbol, Yehonatan
|
|
|
137 |
C |
p.
|
artikel
|
| 20 |
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current
|
García Cozzi, R.
|
|
|
137 |
C |
p.
|
artikel
|
| 21 |
Interdiffusion and formation of intermetallic compounds in high-temperature power electronics substrate joints fabricated by transient liquid phase bonding
|
Imediegwu, Chidinma
|
|
|
137 |
C |
p.
|
artikel
|
| 22 |
50 MeV lithium ion irradiation studies on silicon-germanium heterojunction bipolar transistors at low temperature
|
Hegde, Vinayakprasanna N.
|
|
|
137 |
C |
p.
|
artikel
|
| 23 |
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults
|
Thomet, Sébastien
|
|
|
137 |
C |
p.
|
artikel
|
| 24 |
Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging
|
Chen, Chun-Hao
|
|
|
137 |
C |
p.
|
artikel
|
| 25 |
Phase field study on the effect of roughness on interfacial intermetallic compounds of micro-solder joints under multifield coupling
|
Guo, Hao
|
|
|
137 |
C |
p.
|
artikel
|
| 26 |
Three-parameter Weibull distribution with upper limit applicable in reliability studies and materials testing
|
Kohout, Jan
|
|
|
137 |
C |
p.
|
artikel
|
| 27 |
TID evaluation based on variabilities of space radiation and device failure dose in typical navigation satellite orbits
|
Wang, Jian-zhao
|
|
|
137 |
C |
p.
|
artikel
|
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