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                                       Details for article 11 of 27 found articles
 
 
  Evaluation of the helium hermeticity reliability of copper through-glass vias
 
 
Title: Evaluation of the helium hermeticity reliability of copper through-glass vias
Author: Okoro, Chukwudi
Maurey, Pamela
Davis, Ronald
Pollard, Scott
Appeared in: Microelectronics reliability
Paging: Volume 137 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 11 of 27 found articles
 
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