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                             50 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Bismuth effect in the structural, magnetic and dielectric properties of CoZn ferrite Sathishkumar, G.
2011
23 1 p. 243-250
artikel
2 Die attach properties of Zn–Al–Mg–Ga based high-temperature lead-free solder on Cu lead-frame Haque, A.
2011
23 1 p. 115-123
artikel
3 Dielectric and photoluminesent properties of (Ca2Mg3-xPbx)A2(Ti0.75Zr0.25)O12 [x = 0 & 0.25; A = Nb & Ta] microwave ceramics Suresh, M. K.
2011
23 1 p. 200-205
artikel
4 Dielectric properties and high-temperature dielectric relaxation of tungsten-bronze structure ceramics Ba2GdFeNbTa3O15 Yang, Zhao
2011
23 1 p. 229-233
artikel
5 Dielectric property and electrical conduction mechanism of ZrO2–TiO2 composite thin films Dong, Ming
2011
23 1 p. 174-179
artikel
6 Dielectric relaxation in complex perovskite Ba(Bi1/2Ta1/2)O3 Mishra, Amodini
2011
23 1 p. 185-192
artikel
7 Effect of deposition condition and UV-ozone post-treatment on work function of DC magnetron sputtered AZO thin films Feng, Quanyu
2011
23 1 p. 267-272
artikel
8 Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test Tian, Yanhong
2011
23 1 p. 136-147
artikel
9 Effect of Ti on the interfacial reaction between Sn and Cu Vuorinen, V.
2011
23 1 p. 68-74
artikel
10 Effects of addition of copper particles of different size to Sn-3.5Ag solder Nadia, Aemi
2011
23 1 p. 86-93
artikel
11 Effects of annealing temperatures on crystalline quality of ceramic thin films by RF-magnetron sputtering using Zn-enriched (Ba0.3Sr0.7)(Zn1/3Nb2/3)O3 as target Ji, Feifei
2011
23 1 p. 164-168
artikel
12 Effects of microstructure and temperature on corrosion behavior of Sn–3.0Ag–0.5Cu lead-free solder Wang, Mingna
2011
23 1 p. 148-155
artikel
13 Effects of Nb doping on microstructure and properties of Bi4Ti3−xNbxO12 thin films prepared by magnetron sputtering Wang, Hua
2011
23 1 p. 234-237
artikel
14 Effects of rare earth additions on the microstructural evolution and microhardness of Sn30Bi0.5Cu and Sn35Bi1Ag solder alloys Shen, Jun
2011
23 1 p. 156-163
artikel
15 Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints Wu, Cuiping
2011
23 1 p. 14-21
artikel
16 Effects of ZnO and CeO2 additions on the microstructure and dielectric properties of Mn-modified (Bi0.5Na0.5)0.88Ca0.12TiO3 ceramics Yuan, Ying
2011
23 1 p. 309-314
artikel
17 Electrical and optical properties of one-dimensional metallophthalocyanine (M = Fe) thin films grown by thermal evaporation Sánchez-Vergara, M. E.
2011
23 1 p. 193-199
artikel
18 Enhancement of thermal conductivity of hydrogenated silicon film by microcrystalline structure growth Li, Shibin
2011
23 1 p. 224-228
artikel
19 Featured issue: Lead-free solder and packaging Willoughby, Arthur
2011
23 1 p. 1
artikel
20 Growth and consumption rates of the phase layers during interdiffusion in a diffusion couple with finite end member Prasad, S.
2011
23 1 p. 75-85
artikel
21 Impact of interfacial solubility on penetration of metals into dielectrics and the mechanism of failure Plawsky, Joel. L.
2011
23 1 p. 48-55
artikel
22 Influence of post-deposition annealing in oxygen ambient on metal–organic decomposed CeO2 film spin coated on 4H-SiC Lim, Way Foong
2011
23 1 p. 257-266
artikel
23 Influence of silver additions on electrical, mechanical and structures properties of rapidly solidified Sn–0.7%Cu alloy from melt Negm, Samia E.
2011
23 1 p. 94-99
artikel
24 Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn–3.5 wt% Ag eutectic solder Çadırlı, E.
2011
23 1 p. 31-40
artikel
25 Interface fracture surface energy of sol–gel bonded silicon wafers by three-point bending Latella, B. A.
2011
23 1 p. 8-13
artikel
26 Liquid–solid interfacial reactions of Sn–Ag and Sn–Ag–In solders with Cu under bump metallization Wang, Dong-Liang
2011
23 1 p. 61-67
artikel
27 Luminescent properties of GdPO4:Eu nanorods Lai, Hua
2011
23 1 p. 285-289
artikel
28 Microwave dielectric properties and compatibility with silver of low-fired Ba2Ti3Nb4O18 ceramics with BaCu(B2O5) addition Zhou, Huanfu
2011
23 1 p. 238-242
artikel
29 Microwave dielectric properties of Ca4La2Ti5O17–LaAlO3 system ceramic materials Chen, Guo-hua
2011
23 1 p. 280-284
artikel
30 Nanocrystalline TiO2 thin films for NH3 monitoring: microstructural and physical characterization Pawar, S. G.
2011
23 1 p. 273-279
artikel
31 Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression Zou, Changdong
2011
23 1 p. 2-7
artikel
32 Optimization of Bosch etch process for vertically stacked Si nanowires Guo, Qing
2011
23 1 p. 334-342
artikel
33 Photovoltaic properties of nanocrystalline CdS films deposited by SILAR and CBD techniques—a comparative study Senthamilselvi, V.
2011
23 1 p. 302-308
artikel
34 Poly (thienylene methine) grafted nanocrystalline TiO2 based hybrid solar cells Lu, Shengli
2011
23 1 p. 251-256
artikel
35 Pr3+ doped BaMoO4 octahedron to shuttle-like microcrystals: synthesis and luminescence properties Thirumalai, J.
2011
23 1 p. 325-333
artikel
36 Preparation and dielectric properties of poly(arylene ether nitrile) containing carboxyl groups/carbon nanotubes composites Zou, Yanke
2011
23 1 p. 206-211
artikel
37 Preparation and photocatalytic activity of N-doped TiO2 nanotube array films Dang, Mingming
2011
23 1 p. 320-324
artikel
38 Preparation and properties of a novel electrically conductive adhesive using a composite of silver nanorods, silver nanoparticles, and modified epoxy resin Yang, Xiaojian
2011
23 1 p. 108-114
artikel
39 Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process Gao, Hong
2011
23 1 p. 22-30
artikel
40 Reaction behaviour of Ni1−xMxO’s (M = Li, Na) formation and its thermoelectric properties Lu, Yun
2011
23 1 p. 315-319
artikel
41 Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints Yu, Chun
2011
23 1 p. 124-129
artikel
42 Suppression of Cu3Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge Yu, Chun
2011
23 1 p. 56-60
artikel
43 Suppression of interfacial intermetallic compounds between Sn–9Zn solder and Cu-substrate by adding Cu-particles in the solder Wei, G. Q.
2011
23 1 p. 130-135
artikel
44 Synthesis and characterization of flexible one-dimensional TiO2 nanocrystalline films Deng, Jie
2011
23 1 p. 295-301
artikel
45 Synthesis and magnetic properties of NixFe1−x/NiyFe3−yO4 nanocomposite Li, Shuiming
2011
23 1 p. 169-173
artikel
46 The effect of the number of Ag layers on some physical properties of Bi1.8Pb0.4Ca2.2Sr2Cu3Ox Akdogan, M.
2011
23 1 p. 212-223
artikel
47 The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction Chang, S. Y.
2011
23 1 p. 100-107
artikel
48 Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders Yoon, Jeong-Won
2011
23 1 p. 41-47
artikel
49 Ti/NiCu/Ag and Al/NiCu/Ag thin film deposited on positive temperature coefficient (PTC) thermistor by direct current magnetron sputtering Cen, Jiabao
2011
23 1 p. 290-294
artikel
50 Ultra-thin BiFeO3 nanowires prepared by a sol–gel combustion method: an investigation of its multiferroic and optical properties Zhao, Y.
2011
23 1 p. 180-184
artikel
                             50 gevonden resultaten
 
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