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Journal description
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Details for article 48 of 50 found articles
| Title: |
Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders |
| Author: |
Yoon, Jeong-Won Lee, Jong-Gun Lee, Jong-Bum Noh, Bo-In Jung, Seung-Boo |
| Appeared in: |
Journal of materials science. Materials in electronics |
| Paging: | Volume 23 (2011) nr. 1 pages 41-47 |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 48 of 50 found articles
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