| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Model for Rapid Tin Whisker Growth on the Surfaceof ErSn3 Phase
|
Hao, Hu
|
|
2011
|
41 |
2 |
p. 184-189
|
artikel
|
| 2 |
Comparison of Extensive Thermal Cycling Effects on Microstructure Development in Micro-alloyed Sn-Ag-Cu Solder Joints
|
Anderson, Iver E.
|
|
2011
|
41 |
2 |
p. 390-397
|
artikel
|
| 3 |
Creep Behavior of Bi-Containing Lead-Free Solder Alloys
|
Witkin, David
|
|
2011
|
41 |
2 |
p. 190-203
|
artikel
|
| 4 |
Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature
|
Arfaei, B.
|
|
2011
|
41 |
2 |
p. 362-374
|
artikel
|
| 5 |
Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging
|
Powers, Mike
|
|
2011
|
41 |
2 |
p. 224-231
|
artikel
|
| 6 |
Electrical and Mechanical Properties of Through-Silicon Vias and Bonding Layers in Stacked Wafers for 3D Integrated Circuits
|
Hwang, Sung-Hwan
|
|
2011
|
41 |
2 |
p. 232-240
|
artikel
|
| 7 |
Finite-Element Analysis of Current-Induced Thermal Stressin a Conducting Sphere
|
Liu, Ming
|
|
2011
|
41 |
2 |
p. 352-361
|
artikel
|
| 8 |
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates:I. Effects of Loading and Processing Conditions
|
Huang, Z.
|
|
2011
|
41 |
2 |
p. 375-389
|
artikel
|
| 9 |
Fracture of Sn-Ag-Cu Solder Joints on Cu Substrates. II: Fracture Mechanism Map
|
Kumar, P.
|
|
2011
|
41 |
2 |
p. 412-424
|
artikel
|
| 10 |
Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation
|
Lee, Tae-Kyu
|
|
2011
|
41 |
2 |
p. 273-282
|
artikel
|
| 11 |
In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders
|
Zhou, Bite
|
|
2011
|
41 |
2 |
p. 262-272
|
artikel
|
| 12 |
Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)
|
Kumar, P.
|
|
2011
|
41 |
2 |
p. 322-335
|
artikel
|
| 13 |
Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique
|
Ma, Limin
|
|
2011
|
41 |
2 |
p. 425-430
|
artikel
|
| 14 |
Martensitic Transformation in Sn-Rich SnIn Solder Joints
|
Lee, K.-O.
|
|
2011
|
41 |
2 |
p. 336-351
|
artikel
|
| 15 |
Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints
|
Chan, D.
|
|
2011
|
41 |
2 |
p. 398-411
|
artikel
|
| 16 |
Optimization of Pb-Free Solder Joint Reliabilityfrom a Metallurgical Perspective
|
Zeng, Kejun
|
|
2011
|
41 |
2 |
p. 253-261
|
artikel
|
| 17 |
Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue
|
Yin, Liang
|
|
2011
|
41 |
2 |
p. 241-252
|
artikel
|
| 18 |
Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process
|
Yung, K.C.
|
|
2011
|
41 |
2 |
p. 313-321
|
artikel
|
| 19 |
The Effect of Random Voids in the Modified Gurson Model
|
Fei, Huiyang
|
|
2011
|
41 |
2 |
p. 177-183
|
artikel
|
| 20 |
The Role of Elastic and Plastic Anisotropy of Snin Recrystallization and Damage Evolution DuringThermal Cycling in SAC305 Solder Joints
|
Bieler, Thomas R.
|
|
2011
|
41 |
2 |
p. 283-301
|
artikel
|
| 21 |
Toward a Better Understanding of the Effect of Cu Electroplating Process Parameters on Cu3Sn Voiding
|
Yin, Liang
|
|
2011
|
41 |
2 |
p. 302-312
|
artikel
|
| 22 |
Whisker Formation Induced by Component and Assembly Ionic Contamination
|
Snugovsky, Polina
|
|
2011
|
41 |
2 |
p. 204-223
|
artikel
|
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